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Surface-modified metal oxide particle material, dispersion liquid, silicone resin composition, silicone resin composite body, optical semiconductor light emitting device, lighting device, and liquid crystal imaging device

Active Publication Date: 2015-10-01
SUMITOMO OSAKA CEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a surface-modified metal oxide particle material that has high heat resistance and can be used as a sealing material for optical semiconductor devices. The material also exhibits high transparency and gas barrier properties. The invention also provides a dispersion liquid, silicone resin composition, and silicone resin composite containing the surface-modified metal oxide particle material. The use of the silicone resin composite as a sealing material can lower gas permeability, suppress deterioration of the device due to gas permeation, and improve transparency and heat resistance of the device. The invention also provides light fitting and liquid crystal imaging device that includes the optical semiconductor light emitting device.

Problems solved by technology

Meanwhile, while the silicone resins are excellent in durability, there is involved such a problem that gas permeability is large (gas barrier properties are low), and in response thereto, it has been attempted to incorporate a metal oxide particle.

Method used

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  • Surface-modified metal oxide particle material, dispersion liquid, silicone resin composition, silicone resin composite body, optical semiconductor light emitting device, lighting device, and liquid crystal imaging device
  • Surface-modified metal oxide particle material, dispersion liquid, silicone resin composition, silicone resin composite body, optical semiconductor light emitting device, lighting device, and liquid crystal imaging device
  • Surface-modified metal oxide particle material, dispersion liquid, silicone resin composition, silicone resin composite body, optical semiconductor light emitting device, lighting device, and liquid crystal imaging device

Examples

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examples

[0153]The present invention is hereunder specifically described with reference to the following Examples and Comparative Examples, but it should not be construed that the present invention is limited to these Examples.

[0154]With respect to the present Examples, various measurements and evaluations were performed in the following manners.

(Average Primary Particle Diameter of Metal Oxide Particle)

[0155]An average primary particle diameter of a metal oxide particle was defined as a Scherrer's diameter which is obtained by calculation from a half-value width of an X-ray diffraction peak. This is because so long as the primary particle diameter is a nanometer size, a possibility that one particle is constituted of plural crystallites is low, so that the average primary particle diameter and the Scherrer's diameter are substantially equal to each other.

(Transmittance of Silicone Resin Composite)

[0156]A transmittance of a silicone resin composite was measured by using a composite (thicknes...

example a1

Fabrication of Zirconia Particle

[0164]To a zirconium salt solution of 2,615 g of zirconium oxychloride octahydrate dissolved in 40 L (liters) of pure water, dilute ammonia water of 344 g of 28% ammonia water dissolved in 20 L of pure water was added while stirring, thereby preparing a zirconia precursor slurry.

[0165]Subsequently, a sodium sulfate aqueous solution of 300 g of sodium sulfate dissolved in 5 L of pure water was added to this slurry while stirring. At this time, the addition amount of sodium sulfate was 30% by mass relative to a zirconia conversion value of a zirconium ion in the zirconium salt solution.

[0166]Subsequently, this mixture was dried in the air at 130° C. for 24 hours by using a dryer, thereby obtaining a solid.

[0167]Subsequently, this solid was pulverized by an automatic mortar and then baked in the air at 500° C. for one hour by using an electric furnace.

[0168]Subsequently, this baked material was put into pure water and stirred to make into a slurry form. ...

example a2

Fabrication of Zirconia Particle

[0175]A zirconia particle was fabricated in the same manner as that in Example A1.

(Fabrication of Surface-Modifying Material Containing Both a Phenyl Group and an Alkenyl Group)

Preparation of Surface-Modifying Material A: (CH2═CM(CH3)2SiO(SiO(C6H5)2)45Si(OC2H5)3

[0176]1.8 g of dimethyl vinyl silanol was dissolved in 60 mL of a tetrahydrofuran (THF) solvent in a nitrogen atmosphere, 1.2 g of n-butyl lithium dissolved in n-hexane was added dropwise at a temperature of 0° C. while stirring, and the contents were allowed to react with each other for 3 hours, thereby obtaining lithium dimethyl vinyl silanolate (see formula (A)).

[0177]Subsequently, a solution of 160.5 g of hexaphenyl cyclotrisiloxane dissolved in a THF solvent was added dropwise, and the contents were allowed to react with each other at a temperature of 0° C. for 12 hours, thereby obtaining lithium phenylvinyl organosilanolate (see formula (B)).

[0178]Subsequently, 3.6 g of chlorotriethoxysi...

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Abstract

By using a surface-modified metal oxide particle material obtained by performing surface modification on a metal oxide particle having an average primary particle diameter of 3 nm or more and 10 nm or less with a surface-modifying material having at least a phenyl group and a group capable of undergoing a crosslinking reaction with a functional group in a silicone resin-forming component, the surface-modified metal oxide particle material which has high heat resistance and may further exhibit high transparency and gas barrier properties when used for a sealing material for optical semiconductor light emitting device, or the like is provided and a dispersion liquid, a silicone resin composition and a silicone resin composite each containing the surface-modified metal oxide particle material, as well as an optical semiconductor light emitting device, a light fitting, and a liquid crystal imaging device each using the silicone resin composite, are also provided.

Description

TECHNICAL FIELD[0001]The present invention relates to a surface-modified metal oxide particle material, a dispersion liquid, a silicone resin composition, a silicone resin composite, an optical semiconductor light emitting device using this as a sealing material, and a light fitting and a liquid crystal imaging device each including the optical semiconductor light emitting device.BACKGROUND ART[0002]As described in, for example, Patent Literature 1, silicone resins are excellent in characteristics, such as transparency, heat resistance, light resistance, etc., and also excellent in hardness and rubber elasticity, and therefore, the silicone resins are used in a sealing material for optical semiconductor, an optical waveguide material, and the like.[0003]In particular, as a sealing material of a light emitting diode (LED) that is one of optical semiconductor light emitting elements, there are organic modified silicone resins and phenyl (or methyl phenyl) silicone resins as described ...

Claims

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Application Information

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IPC IPC(8): C08G77/38G02F1/1335C07F7/00H01L33/56C07F7/28
CPCC08G77/38H01L33/56G02F1/1336C07F7/00C07F7/28C01B13/145C01B33/18C08K3/22C08K3/36C08K9/06C01P2004/64C08L2201/08C08K2003/2237C08K2003/2244C08K2201/011C08L83/04C08G77/12C08G77/20C08G77/80C08K2201/008C09D183/04C08K5/56C08L83/00Y10T428/2982
Inventor SATO, YOICHIKURIONO, YASUYUKIOTSUKA, TAKESHIYAMAGUCHI, TAKERUHARADA, KENJI
Owner SUMITOMO OSAKA CEMENT CO LTD
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