Surface-modified metal oxide particle material, dispersion liquid, silicone resin composition, silicone resin composite body, optical semiconductor light emitting device, lighting device, and liquid crystal imaging device

Active Publication Date: 2015-10-01
SUMITOMO OSAKA CEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0019]According to the present invention, it is possible to provide a surface-modified metal oxide particle material which when used for a sealing material for optical semiconductor light emitting device, or the like, has high heat resistance (namely, coloration during thermal loading or a lowering of transmittance to be caused due to particle aggregation during thermal loading is suppressed) and may further exhibit high transparency and gas barrier properties; a dispersion liquid, a silicone resin composition and a silico

Problems solved by technology

Meanwhile, while the silicone resins are excellent in durability, there is involved such a problem that gas permeability is

Method used

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  • Surface-modified metal oxide particle material, dispersion liquid, silicone resin composition, silicone resin composite body, optical semiconductor light emitting device, lighting device, and liquid crystal imaging device
  • Surface-modified metal oxide particle material, dispersion liquid, silicone resin composition, silicone resin composite body, optical semiconductor light emitting device, lighting device, and liquid crystal imaging device
  • Surface-modified metal oxide particle material, dispersion liquid, silicone resin composition, silicone resin composite body, optical semiconductor light emitting device, lighting device, and liquid crystal imaging device

Examples

Experimental program
Comparison scheme
Effect test

Example

[0157]In Examples A1 to A5 and Comparative Examples A1 to A4, heat resistance of a silicone resin composite was evaluated by applying a load to the above-described composite (cured material) having a thickness of 0.5 mm in an electric furnace at 150° C. for 500 hours and then measuring a transmittance using a spectrophotometer (integrating sphere). The case where a transmittance at a wavelength of 450 nm after thermal loading was reduced by 30% or more as compared with an initial value (before thermal loading) was defined as “B”, and the case where a reduction amount was less than 30% was defined as “A”.

Example

[0158]Meanwhile, in Examples B1 to B5 and Comparative Examples B1 to B6, the evaluation was performed by using a composite (thickness: 0.5 mm) of each of the Examples formed on a glass base material and using a spectrophotometer (integrating sphere) to measure a transmittance. Specifically, a silicone resin composite was put into a dryer at 120° C., and after elapsing 1,000 hours, a transmittance at 450 nm was compared with an initial transmittance. The case where a reduction rate of transmittance relative to the initial value was less than 5% was defined as “A”; the case where it was 5% or more and less than 25% was defined as “B”; and the case where it was 25% or more was defined as “C”.

(Gas Permeability (Gas Barrier Properties) of Silicone Resin Composite)

[0159]Gas permeability (gas barrier properties) of a silicone resin composite was evaluated in the following manner.

[0160]First of all, an LED package having a silver-plated reflector was sealed with a silicone resin composition...

Example

[0161]Meanwhile, in Examples B1 to B5 and Comparative Examples B1 to B6, blackening of an appearance of the above-described silver-plated reflector (corrosion (blackening discoloration) of silver plate by sulfur gas) was observed through visual inspection and evaluated in terms of a time required for reaching the same degree as that in a separately fabricated standard plate (plate prepared by blackening a silver-plated reflector directly with a sulfur gas). Incidentally, the lower the gas barrier properties of the composite, the shorter the time required for reaching blackening was.

(Hardness Evaluation of Silicone Resin Composite)

[0162]With respect to the hardness evaluation of a silicone resin composite, at the time of fabricating a silicone resin composite, the case where no crack was generated was defined as “A”, and the case where a crack was generated was defined as “B” (Examples B1 to B5 and Comparative Examples B1 to B6).

(Thickness of Sealing Layer Made of Silicone Resin Comp...

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Abstract

By using a surface-modified metal oxide particle material obtained by performing surface modification on a metal oxide particle having an average primary particle diameter of 3 nm or more and 10 nm or less with a surface-modifying material having at least a phenyl group and a group capable of undergoing a crosslinking reaction with a functional group in a silicone resin-forming component, the surface-modified metal oxide particle material which has high heat resistance and may further exhibit high transparency and gas barrier properties when used for a sealing material for optical semiconductor light emitting device, or the like is provided and a dispersion liquid, a silicone resin composition and a silicone resin composite each containing the surface-modified metal oxide particle material, as well as an optical semiconductor light emitting device, a light fitting, and a liquid crystal imaging device each using the silicone resin composite, are also provided.

Description

TECHNICAL FIELD[0001]The present invention relates to a surface-modified metal oxide particle material, a dispersion liquid, a silicone resin composition, a silicone resin composite, an optical semiconductor light emitting device using this as a sealing material, and a light fitting and a liquid crystal imaging device each including the optical semiconductor light emitting device.BACKGROUND ART[0002]As described in, for example, Patent Literature 1, silicone resins are excellent in characteristics, such as transparency, heat resistance, light resistance, etc., and also excellent in hardness and rubber elasticity, and therefore, the silicone resins are used in a sealing material for optical semiconductor, an optical waveguide material, and the like.[0003]In particular, as a sealing material of a light emitting diode (LED) that is one of optical semiconductor light emitting elements, there are organic modified silicone resins and phenyl (or methyl phenyl) silicone resins as described ...

Claims

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Application Information

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IPC IPC(8): C08G77/38G02F1/1335C07F7/00H01L33/56C07F7/28
CPCC08G77/38H01L33/56G02F1/1336C07F7/00C07F7/28C01B13/145C01B33/18C08K3/22C08K3/36C08K9/06C01P2004/64C08L2201/08C08K2003/2237C08K2003/2244C08K2201/011C08L83/04C08G77/12C08G77/20C08G77/80C08K2201/008C09D183/04C08K5/56C08L83/00Y10T428/2982
Inventor SATO, YOICHIKURIONO, YASUYUKIOTSUKA, TAKESHIYAMAGUCHI, TAKERUHARADA, KENJI
Owner SUMITOMO OSAKA CEMENT CO LTD
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