Positive light-sensitive polyamic ester resin composition and its preparation and use

A technology of polyamic acid ester and resin composition, which is applied in the direction of photomechanical equipment, photoplate making process coating equipment, optics, etc., can solve the problems of large amount of photosensitizer, poor process repeatability, low photosensitivity, etc., and achieve the goal of photosensitizer The effect of low dosage, excellent mechanics and high photosensitivity

Active Publication Date: 2009-07-08
POME TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the positive photosensitive polyimide resins reported above all have shortcomings such as low photosensitivity, large amount of photosensitizer, and poor process repeatability.

Method used

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  • Positive light-sensitive polyamic ester resin composition and its preparation and use
  • Positive light-sensitive polyamic ester resin composition and its preparation and use
  • Positive light-sensitive polyamic ester resin composition and its preparation and use

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0016] The invention provides a kind of preparation method of soluble polyamic acid ester resin, the method comprises the following steps:

[0017] 1) reacting fluorine-containing aromatic diacid diester with thionyl chloride to form corresponding fluorine-containing aromatic diacid diester;

[0018] 2) dissolving the aromatic diamine and its mixture in an organic solvent to form a homogeneous solution;

[0019] 3) Adding the aromatic diamine and its mixture solution in batches to the fluorine-containing aromatic dichloride diester solution;

[0020] 4) Then add the molecular weight regulator, and the reaction mixture generates polyamic acid ester resin solution by polycondensation reaction at room temperature;

[0021] 5) Pour the resin solution into excess water to precipitate solid resin;

[0022] 6) Wash and dry the solid resin for use.

[0023] The positive photosensitive polyamic acid ester resin composition of the present invention is characterized in that the fluori...

Embodiment 1

[0034] In a 1500ml three-neck round bottom flask equipped with a mechanical stirrer, a thermometer and a nitrogen protection device, add 260 parts by weight of 4,4'-[2,2,2-trifluoro-1-(3-trifluoromethylbenzene base) ethyl] diphthalic anhydride (TFDA), 130 parts by weight of butanol and 550 parts by weight of tetrahydrofuran. The reaction mixture was heated to 80°C and stirred for 6 hours to generate the corresponding dibutyl aromatic diacid. The above product is reacted with 98 parts by weight of thionyl chloride at 0-10° C. for 2 hours and at room temperature for 4 hours to generate the corresponding fluorine-containing aromatic diacid chloride dibutyl ester.

[0035] In a 1000ml three-necked round-bottomed flask equipped with a mechanical stirrer, a thermometer and a nitrogen protection device, add 160 parts by weight of 2,2'-bis(3-amino-4-phenol) hexafluoropropane and 500 parts by weight of N, N-dimethylacetamide, start stirring to form a homogeneous solution; then, react ...

Embodiment 2

[0041] In a 1000ml three-necked round-bottomed flask equipped with a mechanical stirrer, a thermometer and a nitrogen protection device, add 210 parts by weight of 2,2'-bis(3-amino-4-phenol)propane and 500 parts by weight of N,N- Dimethylacetamide, start stirring, so that it forms a homogeneous solution; then, react 2 hours at 0~10 ℃ with the fluorine-containing aromatic diacid dibutyl chloride prepared in Example 1 and 5 parts by weight of 4-phenylynylphthalic anhydride , Polycondensation reaction occurred at room temperature for 10 hours, the reaction solution was poured into a large amount of deionized water, the solid was precipitated, filtered, and vacuum-dried to generate polyamic acid ester resin.

[0042] The above-mentioned polyamic acid ester resin of 40 parts by weight is added the N of 50 parts by weight, N'-dimethylacetamide, stirred at room temperature for 2 hours, and made it form a homogeneous solution.

[0043] 10 parts by weight of propylene oxide triethoxysi...

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Abstract

The invention provides a positive photosensitivity polyamide acid ester resin composition, a preparation method and application thereof. The resin composition comprises the following components in portion by weight: 10 to 70 portions of the soluble polyamide acid ester resin, 100 to 1,000 portions of an organic solvent, 0.1 to 50 portions of a photosencitizer, 0.1 to 50 portions of a photosensitizer additive, and 0.1 to 50 portions of a built-in adhesion promoter, wherein the soluble polyamide acid ester resin is prepared from aromatic diacid chloride diester containing fluorin, aromatic diamine and mixture thereof, and a molecular weight conditioning agent. The positive photosensitivity polyamide acid ester resin performs a photodegradation reaction after exposure through ultraviolet ray (i ray and g ray), and after an exposure area is dissolved by an aqueous solvent, a pattern with high resolution can be obtained. Furthermore, a polyimide layer membrane formed after being heated and cured has low specific inductive capacity, low water absorbing capacity, excellent thermal stability, mechanical performance and optical performance.

Description

technical field [0001] The invention relates to a positive photosensitive polyamic acid ester resin composition, a preparation method and application thereof. Background technique [0002] Polyimide resin has the advantages of high temperature resistance, low temperature resistance, corrosion resistance, high insulation, low dielectric constant and low dielectric loss, and excellent mechanical properties. It is widely used in chip surface passivation and multilayer interconnection structures in semiconductor manufacturing processes. The interlayer insulation of advanced microelectronic packages (BGA, CSP, SiP, etc.), the distribution of package substrate signal lines, the ball-making process of micro-solder balls, the stress-buffering internal coating protective film of plastic-encapsulated circuits, and the manufacturing process of liquid crystal flat panel displays, etc. . In these applications, it is often necessary to make through holes on the polyimide coating film and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/039G03F7/16G03F7/00
Inventor 左立辉袁向文戴美竹申学明
Owner POME TECH CO LTD
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