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Ceramic base composite material using copper alloy as metal phase and metal phase adding method thereof

A composite material and metal phase technology, applied in the field of composite materials, can solve problems such as overflow, copper phase aggregation, material density, electrical conductivity, poor strength and toughness, etc., to prevent oxidation, improve sintered density, and uniform distribution Effect

Inactive Publication Date: 2009-12-02
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The invention provides a ceramic-metal composite material with Cu alloy as the metal phase and a method for adding the metal phase to solve the problem of copper phase aggregation and overflow in the preparation process of the existing material system, as well as material density, electrical conductivity, strength and toughness poor problem

Method used

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  • Ceramic base composite material using copper alloy as metal phase and metal phase adding method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0019] Example 1: 17(Cu-Ni) / (NiFe 2 o 4 Preparation of -7NiO-3CoO) ceramic-metal composites

[0020] The first step: preparation of copper-nickel composite powder (nickel content 20wt%)

[0021] The electroless nickel plating method is used to coat nickel with uniform thickness on the surface of copper powder (electrolytic copper powder, particle size -325 mesh) to prepare copper-nickel composite powder. The specific process is: weigh 35.40g of copper powder, and use 10ml / L Soak in sulfuric acid solution for about 1 minute to remove the oxide layer on the surface, filter and wash the copper powder with distilled water several times until the water is neutral, then add the copper powder to the electroless nickel plating solution (2L) for nickel plating until all the nickel ions in the solution are consumed So far, the process conditions of electroless nickel plating are: NiSO 4 ·6H 2 O20g / L; NaH 2 PO 2 ·H 2 O 25g / L; Lactic acid 35ml / L; Sodium lauryl sulfate 0.2g / L; Thiou...

Embodiment 2

[0029] Example 2: 12(Cu-Ag-Ni) / (NiFe 2 o 4 Preparation of -10NiO) ceramic-metal composites

[0030] The first step: preparation of copper-silver-nickel composite powder

[0031] Using glucose as a reducing agent, first coat a layer of metallic silver on the surface of copper powder (electrolytic copper powder, particle size -325 mesh) to make copper-silver composite powder, and then use hydrazine as a reducing agent to compound copper on silver by electroless nickel plating. The surface of the powder is coated with nickel with uniform thickness to prepare copper-silver-nickel composite powder. The specific process is as follows: weigh 35.2g of copper powder, soak it in 10ml / L dilute sulfuric acid solution for about 1 minute to remove the oxide layer on the surface, filter and wash it with distilled water several times Clean the copper powder until the water is neutral; take 6.93g of silver nitrate and add 400ml of deionized water, add 40ml of ammonia water, stir to obtain a tr...

Embodiment 3

[0039] Example 3: 8(Cu-Co) / (NiFe 2 o 4 Preparation of -10CoO) ceramic-metal composites

[0040] The first step: preparation of copper-cobalt composite powder (cobalt content 20wt%)

[0041] The electroless cobalt plating method is used to coat the surface of copper powder (electrolytic copper powder, particle size -325 mesh) with uniform thickness of cobalt to prepare copper-cobalt composite powder. The specific process is: weigh 35.40g of copper powder, and use 10ml / L dilute Soak in sulfuric acid solution for about 1 minute to remove the oxide layer on the surface, filter and wash the copper powder with distilled water several times until the water is neutral, then add the copper powder to the electroless cobalt plating solution (2L) for cobalt plating until all the cobalt ions in the solution are consumed So far, the process conditions of electroless cobalt plating are: CoSO 4 ·6H 2 O20g / L; Hydrazine 80ml / L; Disodium EDTA 60ml / L; Hexadecyltrimethylammonium bromide 0.1g / L...

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Abstract

The invention provides a ceramic base composite material using a copper alloy as a metal phase and a metal phase adding method thereof, solves the problem of overflow of a pure copper metal phase in a sintering process of the composite materials, and improves the compactness, the electrical conductivity and the toughness of the material. The metal powder of a ceramic-metal composite material is prepared into composite powder by coating a layer of nickel-cobalt alloy or one of nickel and cobalt on the surface of Cu powder, or coating one or several of Ag, Pd, Au and Pt on the surface of Cu powder first and then coating a layer of metal nickel or cobalt or nickel-cobalt alloy. The nickel or cobalt content in the composite powder is 5 to 40 weight percent, and the content of other metal is 0 to 20 weight percent. After the metal composite powder and the ceramic powder are fully and evenly mixed, the mixed powder is prepared into the ceramic-metal composite material through processes of pressure forming, degreasing, sintering and the like. The problems of copper phase aggregation and overflow of the prior material system during the preparing are solved, and the compactness, electrical conductivity, strength, toughness and the like of the material are greatly improved.

Description

technical field [0001] The invention belongs to the technical field of composite materials, and relates to a ceramic-based composite material with copper alloy as a metal phase and a metal phase adding method thereof. Background technique [0002] Ceramic materials have high melting point, hardness and elastic modulus, and have good heat resistance, corrosion resistance and wear resistance, and are widely used in military industry, aerospace, automobile, electronics, metallurgy and other fields. Although ceramic materials have such excellent special properties, their brittleness is their fatal shortcoming, which limits the development and application of their characteristics. Metal materials have good ductility and machinability. Therefore, by combining ceramics and metals, high-performance composite materials with good ductility and thermal conductivity of metal materials and good heat and wear resistance of ceramic materials can be produced. One of the keys to preparing ...

Claims

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Application Information

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IPC IPC(8): C22C1/10C22C1/05C22C29/00
Inventor 甘雪萍周科朝李志友张雷
Owner CENT SOUTH UNIV
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