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Method for preparing insulating heat conducting ceramic coating from polymer precursor

A technology of insulating thermal conductivity and ceramic coating, applied in the field of insulating thermal conductivity coating and ceramic coating, can solve the problem of insignificant effect, and achieve the effect of good insulation performance, excellent thermal conductivity and excellent thermal shock resistance.

Inactive Publication Date: 2010-02-24
BEIJING PANTIAN NEW TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the insulation and thermal conductivity required for high-power electronic packaging applications, at present, it mainly relies on the improvement of traditional low-temperature co-firing, anodic oxidation, and micro-arc oxidation processes to meet the requirements of the packaging process, but the effect is still Not obvious

Method used

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  • Method for preparing insulating heat conducting ceramic coating from polymer precursor
  • Method for preparing insulating heat conducting ceramic coating from polymer precursor
  • Method for preparing insulating heat conducting ceramic coating from polymer precursor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Take 1Kg of polysilazane with a molecular weight between 1000 and 5000, add 200g of aluminum nitride filler, 50g of tantalum nitride filler, 100g of boron nitride filler, silicon carbide Filler 200g, boron carbide filler 100g, silicon powder 5g, boron powder 5g, after stirring, add xylene 60g, continue stirring until uniform. The slurry was then repeatedly ground for 3 to 5 times with a three-roll mill. Spray the obtained slurry on the surface of a surface-treated 1mm-thick copper sheet with a spray gun, heat-treat it at 100°C to 300°C for 2 hours in a vacuum state, and then pass it into a nitrogen atmosphere, start slowly heating up to 900°C, and heat it at 900°C ℃ for 1 hour, and then slowly lower the temperature to room temperature to obtain a ceramic coating with copper as the base material, with a thickness of about 80-100 μm. According to the experimental test, the breakdown voltage can reach 10KV (AC), and the insulation resistance is greater than 1×10 10 Ω, th...

Embodiment 2

[0041] Take 1Kg of polysilazane with a molecular weight between 1000 and 5000, add 300g of aluminum nitride filler, 50g of tantalum nitride filler, 100g of boron nitride filler, silicon carbide Filler 200g, boron carbide filler 200g, silicon powder 8g, boron powder 8g, after stirring, add xylene 80g, continue stirring until uniform. The slurry was then repeatedly ground for 3 to 5 times with a three-roll mill. Spray the obtained slurry on the surface of a surface-treated 1mm-thick copper sheet with a spray gun, heat-treat it at 100°C to 300°C for 2 hours in a vacuum state, then pass it into an ammonia atmosphere, and start slowly heating up to 900°C. Keep the temperature at 900°C for 1 hour, and then slowly cool down to room temperature to obtain a ceramic coating with copper as the base material, with a thickness of about 80-100 μm. According to the experimental test, the breakdown voltage can reach 10KV (AC), and the insulation resistance is greater than 1×10 10 Ω, thermal...

Embodiment 3

[0043] Take 1Kg of polysilazane with a molecular weight between 1000 and 5000, add 200g of aluminum nitride filler, 50g of tantalum nitride filler, 100g of boron nitride filler, silicon carbide Filler 200g, boron carbide filler 200g, silicon powder 8g, boron powder 8g, after stirring, add xylene 80g, continue stirring until uniform. The slurry was then repeatedly ground for 3 to 5 times with a three-roll mill. Spray the obtained slurry on the surface of a surface-treated 1mm-thick aluminum sheet with a spray gun, heat-treat it at 100°C to 300°C for 2 hours in a vacuum state, pass through an ammonia atmosphere, and start to slowly heat up to 500°C, and then Keep the temperature at 500°C for 2 hours, and then slowly cool down to room temperature to obtain a ceramic coating with aluminum as the base material, with a thickness of about 80-100 μm. According to the experimental test, the breakdown voltage can reach 10KV (AC), and the insulation resistance is greater than 1×10 10 Ω...

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Abstract

The invention relates to a method for preparing an insulating heat conducting ceramic coating, which is prepared from one or more of polymer precursors such as polysilazane, polysiloxane and polycarbosilane serving as a base material, and multiple kinds of ceramic packing and active fillers as well as solvent and various auxiliary agents, and is prepared by the following steps of: 1, adding a certain amount of fillers, solvent and auxiliary agents into a polymer precursor, stirring the mixture evenly, and preparing the mixture into slurry after high-speed grinding; 2, coating the slurry on thesurface of a treated substrate material (comprising metal, ceramic, graphite, a C / C composite material and the like) in a brush coating or spray coating mode; 3, performing vacuum heat treatment on the substrate material with a coating at a temperature of between 100 and 300 DEG C for 1 to 2 hours to ensure that the polymer precursor performs a cross-linking reaction; and 4, performing high-temperature treatment on the treated material under the protection of a gas, namely treating the material at a temperature of between 400 and 1,000 DEG C for 1 to 5 hours, and then naturally cooling to obtain a ceramic coating on the surface of the substrate material. The insulating heat conducting ceramic coating has the characteristics of simple coating and heat treatment technology, excellent insulating property and heat conductivity, good high temperature resistance, excellent high-temperature cracking resistance and the like. The method can be widely applied in electronic and electrical industry.

Description

Technical field: [0001] The invention relates to a method for preparing a ceramic coating with excellent insulation, heat conduction and mechanical properties, and the ceramic coating prepared according to the above method, which is an insulating and heat conducting coating that can be used in the electronic and electrical industry. It belongs to the field of coating preparation. Background technique: [0002] Modern ceramic materials have been widely used in various construction machinery, equipment and components due to their excellent high temperature resistance, corrosion resistance and wear resistance. At the same time, with the development of high-performance ceramic materials and the expansion of new applications, some ceramic materials are increasingly valued by the electronics and electrical industry for their excellent insulation, heat resistance, thermal conductivity and low shrinkage properties. So far, ceramic materials that have been successfully used in the e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C20/08C08L83/04C08L83/16C08K9/06
Inventor 张听刘洪丽
Owner BEIJING PANTIAN NEW TECH
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