Efficient mechanical method for peeling layered compounds

A layered compound, mechanical exfoliation technology, applied in the direction of nanostructure manufacturing, nanotechnology, nanotechnology, etc., can solve the problems of destroying the layered compound lattice, difficult to obtain nano flakes, and difficult separation of grinding media, so as to improve the grinding efficiency , the effect of small mass and low energy

Inactive Publication Date: 2010-10-13
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] The invention solves the disadvantages of low grinding efficiency, difficulty in obtaining a large number of 1-10-layer nanoflakes, damage to the ...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0015] Specific Embodiment 1: The method for high-efficiency mechanical exfoliation of layered compounds in this embodiment is achieved through the following steps: mechanically exfoliate after mixing layered compounds, solid particles with a particle size of 1 nm to 100 μm, and a liquid working medium. The time is more than 5 minutes, and the liquid working medium has a surface tension of 10~73mN / m and a viscosity of 1~1×10 at the working temperature of mechanical peeling. 9 mPa·s, and then separated to remove solid particles and liquid working medium; that is, the exfoliation of layered compounds is completed; dispersant is added during the mechanical exfoliation process, and the amount of dispersant is 0-20% of the liquid working medium.

[0016] The working temperature described in this embodiment should not only meet the equipment requirements, but also ensure that the liquid working medium is in a liquid state during the mechanical stripping process.

[0017] The disp...

specific Embodiment approach 2

[0019] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the solid particles are magnesium, aluminum, iron, cobalt, nickel, copper, zinc, silver, tin, vanadium, chromium, tungsten, copper alloy, Aluminum alloy, zinc alloy, iron-carbon alloy, magnesium alloy, lithium alloy, boron oxide, silicon oxide, zirconia, aluminum oxide, calcium carbonate, magnesium oxide, titanium dioxide, iodine, zinc oxide, tin oxide, ferric oxide, four Ferric oxide, aluminum nitride, aluminum chloride, titanium nitride, silicon carbide, sodium fluoride, ammonium fluoride, calcium oxide, ammonium bicarbonate, ammonium bromide, ammonium chromate, ammonium dihydrogen phosphate, ammonium formate, Ammonium acetate, sodium bicarbonate, ammonium monohydrogen phosphate, ammonium iodide, ammonium nitrate, ammonium oxalate, ammonium sulfate, ammonium sulfite, ammonium tartrate, ammonium thiocyanate, ammonium acetate, barium iodide, barium nitrate, calcium bromide , calcium iodide, ca...

specific Embodiment approach 3

[0027] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the weight ratio of the layered compound to the solid particles is 1:0.1~10000.

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Abstract

The invention relates to an efficient mechanical method for peeling layered compounds, relating to a method for peeling layered compounds. The invention overcomes the disadvantages of low efficiency for peeling the layered compounds, difficulty in acquiring a large amount of 1 to 10 layers of nanometer slices, easy damage to the lattice of the layered compounds, and the like of the traditional mechanical methods for peeling the layered compounds, such as high-energy ball-milling method, sanding method, and the like. Meanwhile, the invention overcomes the disadvantage of difficult separation of superfine grinding media. In the invention, solid particles and liquid work media (or gas work media) are utilized, and the layered compounds are separated after being mechanically peeled so that the layered compounds are peeled. The invention has the advantages of high grinding efficiency, acquirement of a large amount of 1 to 10 layers of nanometer slices, no change of the lattice of the layered compounds, and easy separation of the grinding media.

Description

technical field [0001] The present invention relates to a method of exfoliating layered compounds. Background technique [0002] Layered compound is a kind of compound with a layered main structure. The laminates form a specific spatial structure by stacking certain structural units on the same plane or side. Each laminate can be regarded as a huge planar molecule, and Layered compounds are formed by superposition of these planar macromolecules. Inorganic layered compounds show many unique physical and chemical properties, and their single-layer or thin-layer compounds and their functional composites show excellent properties in light, electricity, magnetism, and catalysis, which have attracted special attention. [0003] There are many kinds of layered compounds, and the inorganic layered compounds can usually be divided into two categories: the first type is the non-electricity of the layered framework, typical representative substances such as graphite, vanadium pentoxid...

Claims

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Application Information

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IPC IPC(8): B82B3/00
Inventor 王黎东费维栋崔烨
Owner HARBIN INST OF TECH
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