Silver-plated carbon nanotube heat-conducting adhesive and preparation method thereof

Abstract

The invention relates to a heat-conducting adhesive, particularly a silver-plated carbon nanotube heat-conducting adhesive and a preparation method thereof. One-dimensional silver-plated carbon nanotubes are used as a heat-conducting filler of the heat-conducting adhesive to fully take the advantage of the fiber structure of the nanowire, so that a heat-conducting network can be well formed in the resin matrix of the heat-conducting adhesive. The composite heat-conducting adhesive has the advantages of low price, simple technique and simple formation process, can well satisfy the requirements for electronic and electric materials; and the excellent corrosion resistance of the silver-plated carbon nanotubes can greatly enhance the ageing resistance of the electric-conducting adhesive.

Description

technical field [0001] The invention relates to a heat-conducting adhesive, in particular to a silver-plated carbon nanotube heat-conducting adhesive and a preparation method thereof. Background technique [0002] In recent years, thermal conductive materials have been widely used in heat exchange engineering, heating engineering, electronic information engineering and other fields. With the development of integrated circuits and packaging technology, electronic components are developing in the direction of small, light and thin. The assembly density of components is too high, and heat dissipation has become a prominent problem, which directly affects the life and reliability of the equipment used. The thermal conductivity of high thermal conductivity adhesive can reach 60 , so it has been widely used in packaging materials and thermal interface materials. [0003] At present, the types of thermally conductive fillers used in thermally conductive adhesives mainly include t...

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Problems solved by technology

In the field of microelectronics, one-dimensional nanomaterials such as carbon nanotubes and metal nanowires have been widely studied and applied due to their special structures, unique electrical properties, mechanical properties and good chemical stability. The size of the carbon nanotube is small, and the diameter is generally several nanometers to tens of nanometers, while the length of the carbon nanotube is generally on the order of microns, and the aspect ratio is very large, so the carbon nanotube is considered as a typical one-dimensional nanomaterial. Nanotubes have many excellent properties, which can be either metallic or semiconducting, have a large specific surface area and super mechanical properties; Chinese patent CN201010155479 discloses a carbon nanotube filled with isotropic high performance Thermally conductive adhesive, the average thermal conductivity of the thermally conductive adhesive reaches 25.5W / mK, the bond strength on the copper plate reaches 17MPa at room temperature, the bond strength on the aluminum plate reaches 14MPa, and the bond strength at 180 degrees is 8MPa and 7Mpa respectively. The problem is that the bond strength decreases at higher temperatures, and the environment where thermal conductive adhesives are used is often at a higher temperature, which will lead to potential damage to electronic components and safety issues

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