Silver-plated carbon nanotube heat-conducting adhesive and preparation method thereof

A technology of carbon nanotubes and adhesives, applied in adhesives, adhesive additives, epoxy resin glue, etc., can solve problems such as damage to electronic components, decreased bonding strength, danger, etc., and achieve poor toughness and improved durability. Aging performance, cheap effect

Inactive Publication Date: 2011-09-21
CHANGZHOU HE RUN NEW MATERIAL TECH
View PDF7 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the field of microelectronics, one-dimensional nanomaterials such as carbon nanotubes and metal nanowires have been widely studied and applied due to their special structures, unique electrical properties, mechanical properties and good chemical stability. The size of the carbon nanotube is small, and the diameter is generally several nanometers to tens of nanometers, while the length of the carbon nanotube is generally on the order of microns, and the aspect ratio is very large, so the carbon nanotube is considered as a typical one-dimensional nanomaterial. Nanotubes have many excellent properties, which can be either metallic or semiconducting, have a large specific surface area and super mechanical properties; Chinese patent CN201010155479 discloses a carbon nanotube filled with isotropic high performance Thermally conductive adhesive, the average thermal conductivity of the thermally conductive adhesive reaches 25.5W / mK, the bond strength on the copper plate reaches 17MPa at room temperature, the bond strength on the aluminum plate reaches 14MPa, and the bond strength at 180 degrees is 8MPa and 7Mpa respectively. The problem is that the bond strength decreases at higher temperatures, and the environment where thermal conductive adhesives are used is often at a higher temperature, which will lead to potential damage to electronic components and safety issues

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Silver-plated carbon nanotube heat-conducting adhesive and preparation method thereof
  • Silver-plated carbon nanotube heat-conducting adhesive and preparation method thereof
  • Silver-plated carbon nanotube heat-conducting adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] 1. Add the purchased carbon nanotubes into nitric acid, boil for 10 minutes, then centrifuge and dry;

[0035] 2. Add 30mL of formaldehyde, 200mL of ethanol, and 200mL of deionized water to the dried carbon nanotubes with a concentration of 38% by mass, and mix them uniformly by ultrasonic;

[0036]3. Slowly drop the mixed solution of silver nitrate and ammonia water into the mixed solution. The mixed solution is composed of silver nitrate aqueous solution: concentration 35g / L, volume 200mL, and 400mL ammonia water with a concentration of 25% by mass. Keep the pH value of the solution at 8, the reaction temperature is 25°C, ultrasonically oscillate, and the obtained product is dried at 60°C after solid-liquid separation; figure 1 Shown is the TEM photo of the prepared silver-coated carbon nanotubes, the diameter of the silver-coated carbon nanotubes is about 20nm, figure 2 Shown is the XRD photo of the prepared silver-coated carbon nanotubes. It can be seen from the f...

Embodiment 2

[0038] 1. Add the purchased carbon nanotubes into nitric acid, boil for 15 minutes, then centrifuge and dry;

[0039] 2. Add 50mL of formaldehyde with a mass percentage concentration of 38%, 300mL of ethanol, and 300mL of deionized water to the dried carbon nanotubes, and perform ultrasonic mixing;

[0040] 3. Slowly drop the mixed solution of silver nitrate and ammonia water into the mixed solution. The mixed solution is composed of silver nitrate aqueous solution: concentration 40g / L, volume 300mL, and 500mL ammonia water with a concentration of 25% by mass. Keep the pH value of the solution at 9, the reaction temperature at 30°C, and ultrasonically vibrate, and the obtained product is dried at 60°C after solid-liquid separation.

[0041] Weigh epoxy resin, epoxy toughness modifier, adhesion promoter, rheology control agent according to the mass weighing given in table 2 and they are mixed; The mode of mixing is mechanical stirring, and stirring speed is 1000 rev / mins, The ...

Embodiment 1～11

[0047] According to the ingredients and dosage listed in Table 2, weigh epoxy resin, epoxy toughness modifier, adhesion promoter, rheology control agent and mix them. The mixing method is mechanical stirring, and the stirring rate is 1000 rpm , the time is 10 minutes, then add the weighed thermally conductive filler, filler surface modifier, and diluent to the mixture in turn under stirring, continue to stir for 10 minutes after the addition, and add the curing agent to the mixture after the mixture is uniform And curing accelerator, after mechanical stirring for 5 minutes, the mixture is transferred to a high-speed shear mixer for mixing. The mixing rate is 2000 rpm, and the time is 30s. Repeat the mixing process in the high-speed shear mixer for 3 times to obtain a mixture. The uniform jelly is the thermally conductive adhesive.

[0048] Table 2

[0049]

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
shear strengthaaaaaaaaaa
shear strengthaaaaaaaaaa
shear strengthaaaaaaaaaa
Login to view more

Abstract

The invention relates to a heat-conducting adhesive, particularly a silver-plated carbon nanotube heat-conducting adhesive and a preparation method thereof. One-dimensional silver-plated carbon nanotubes are used as a heat-conducting filler of the heat-conducting adhesive to fully take the advantage of the fiber structure of the nanowire, so that a heat-conducting network can be well formed in the resin matrix of the heat-conducting adhesive. The composite heat-conducting adhesive has the advantages of low price, simple technique and simple formation process, can well satisfy the requirements for electronic and electric materials; and the excellent corrosion resistance of the silver-plated carbon nanotubes can greatly enhance the ageing resistance of the electric-conducting adhesive.

Description

technical field [0001] The invention relates to a heat-conducting adhesive, in particular to a silver-plated carbon nanotube heat-conducting adhesive and a preparation method thereof. Background technique [0002] In recent years, thermal conductive materials have been widely used in heat exchange engineering, heating engineering, electronic information engineering and other fields. With the development of integrated circuits and packaging technology, electronic components are developing in the direction of small, light and thin. The assembly density of components is too high, and heat dissipation has become a prominent problem, which directly affects the life and reliability of the equipment used. The thermal conductivity of high thermal conductivity adhesive can reach 60 , so it has been widely used in packaging materials and thermal interface materials. [0003] At present, the types of thermally conductive fillers used in thermally conductive adhesives mainly include t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/04C09J9/00
Inventor 陶宇吴海平陶新永夏艳平李斌
Owner CHANGZHOU HE RUN NEW MATERIAL TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap