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Flexible base material and preparation method thereof

A flexible substrate, insulating substrate technology, applied in circuit substrate materials, printed circuit manufacturing, printed circuit components, etc., can solve the problems of reduced peel strength, easy detachment of surface chemical groups, and large environmental pollution, achieving Improve peel strength, simple preparation process and good etching performance

Active Publication Date: 2013-01-02
CHONGQING YUNTIANHUA HIGH END NEW MATERIALS DEV CO LTD +1
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Problems solved by technology

This method has low cost and high peel strength of FCCL, but it is not easy to make FCCL with extremely thin conductive layer and double-sided FCCL; the lamination method is to coat hot-melt polyimide resin on both sides of polyimide film, after treatment Obtain an adhesive polyimide film, and heat and pressurize it with copper foil to obtain an adhesive-free FCCL. This method is also limited when making an adhesive-free FCCL with an extremely thin conductive layer; sputtering (or electroless plating) / electroplating The method is to deposit a conductive metal layer on the surface-treated insulating substrate by physical sputtering or chemical plating, and thicken the conductive layer by electroplating to obtain glue-free FCCL. This method can produce glue-free FCCL with an extremely thin conductive layer. FCCL, the composition of the conductive layer can also be various alloys, and it is easy to make double-sided FCCL, but the investment in the equipment used is large, the cost is high, the electroless plating process is also relatively complicated, and the environmental pollution is large. At the same time, the FCCL conductive layer prepared by this method Low bonding force with the substrate layer, resulting in low peel strength of FCCL and prone to pinholes
[0005] At present, there have been some reports on the research on improving the peel strength of sputtering (or chemical plating) / electroplating. The Chinese patents with the publication number CN102215632A and CN1957005 respectively disclose the improvement of metal and metal by coupling and grafting. The method of binding force between insulating substrates, but these two methods make FCCL after high temperature treatment, the surface chemical groups are easy to fall off, and the peeling strength is greatly reduced; the Chinese patent with publication number CN101189287A discloses roughening by alkaline etching The surface of the polyimide film is a method of improving the bonding force between the metal layer and the insulating substrate, but this method increases the surface roughness of the substrate, resulting in deeper penetration of the metal into the substrate, and poor etchability of FCCL, which is not conducive to Fabrication of thin lines

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preparation example Construction

[0026] The invention provides a method for preparing a flexible base material, comprising the following steps: A) spraying a metal oxidizing solution and a reducing solution onto the surface layer of an insulating base material at the same time to obtain an insulating base material covered with an intermediate layer. The surface layer contains nanoparticles with a microporous structure, and the thickness of the surface layer is preferably 1-3 μm, more preferably 1-2 μm; B) Put the insulating substrate covered with the intermediate layer into the electroplating solution, and perform electroplating Anti-oxidation treatment yields a flexible substrate. The electroplating solution is an electroplating solution well known to those skilled in the art.

[0027] Wherein, the coverage rate of the nanoparticles on the surface layer is 10%~100%, preferably 35%~80%, the particle size of the nanoparticles is less than 500nm, preferably 100~300nm, and the nanoparticles with microporous stru...

Embodiment 1

[0046] The preparation of embodiment 1 insulating substrate

[0047] 1.1 Surface-treat silicon dioxide with a particle size of 200nm with a microporous structure, fill it into thermoplastic polyimide resin according to the ratio of silicon dioxide to thermoplastic polyimide resin mass ratio of 1:5, and obtain micro Porous silica / thermoplastic polyimide hybrid resin.

[0048] 1.2 Evenly coat the microporous silica / thermoplastic polyimide hybrid resin obtained in 1.1 on the polyimide base film, keep it at 50°C for 1h, at 150°C for 1h, at 250°C for 1h, and at 340°C After 0.5h, at CF 4 (flow 200ml / min) and O 2 (Flow rate: 500 ml / min) vacuum plasma etching for 15 minutes in an atmosphere to obtain an insulating substrate with a surface layer thickness of 1 μm and a surface coverage of about 40%.

Embodiment 2

[0050] 2.1 Preparation of metal oxidation solution and reducing solution

[0051] In parts by weight, the formula of the metal oxidizing solution is: 70 parts of nickel sulfate, 120 parts of ammonia water, and 1000 parts of water; the formula of the reducing solution is: 17 parts of hydrazine hydrate, 2 parts of sodium hydroxide, and 1000 parts of water.

[0052] 2.2 In situ reduction deposition

[0053] Spray the insulating substrate obtained in 1.2 with an alkaline chemical degreaser, and after washing with water, spray the metal oxidation solution and reducing solution obtained in 2.1 on the surface of the insulating substrate at the same time until the thickness of the metal nickel deposit is 150nm, and then , treating the deposited insulating substrate at 150° C. under nitrogen protection conditions for 10 minutes to obtain an insulating substrate covered with an intermediate layer.

[0054] 2.3 Electroplating and anti-oxidation treatment

[0055] Place the insulating b...

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Abstract

The invention provides a flexible base material and a preparation method thereof. Compared with the prior art that a sputtering(or chemical plating) / electric plating method is utilized to prepare the adhesive-free flexible base material, the method utilizes a normal position chemical reduction / electric plating method to prepare the flexible base material on an insulation base material containing a surface layer, and the surface layer contains nanometer particles with micropore structure. First, a middle layer is subjected to the normal position chemical reduction, partial metal particles are infiltrated into micro pores of the nanometer particles to enable physical anchoring fit to be formed between the middle layer and the insulation base material and improve peeling strength. Further, the peeling strength is not reduced after high temperature processing. Second, the particles are in nanometer grade, the insulation base material infiltrated in the middle layer is shallow, interface is smooth, etching performance is good, and manufacture of a fine line is facilitated. Finally, the normal position chemical reduction method can control thickness of the middle layer by adjusting density of oxygen liquid and reduction liquid and spraying time to further prepare the adhesive-free flexible base material with any thickness without special devices, and the preparation process is simple.

Description

technical field [0001] The invention belongs to the technical field of materials, and in particular relates to a flexible substrate and a preparation method thereof. Background technique [0002] Flexible printed circuit board (FPC) has the characteristics of light weight, small size and easy bending, which has changed the way of connecting and assembling electronic components. It is widely used in consumer products such as notebook computers, mobile phones, personal digital assistants and digital cameras. electronic product. The flexible base material is the processing substrate material of FPC, and it is also the main factor determining the performance of the flexible circuit. It is composed of a flexible insulating base material and a metal foil, among which the flexible copper clad laminate (FCCL) is the most widely used one. . [0003] Flexible copper clad laminates are divided into flexible copper clad laminates with glue and flexible copper clad laminates without gl...

Claims

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Application Information

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IPC IPC(8): H05K1/03H05K3/00
Inventor 张超李成章江林
Owner CHONGQING YUNTIANHUA HIGH END NEW MATERIALS DEV CO LTD
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