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Processing method of high-precision metal patterns on surface of ceramic material product

A ceramic material and metal pattern technology, which is applied in the field of processing metal patterns on the surface of ceramic material products, can solve the problems of easy damage to ceramic substrates, low processing accuracy, and discoloration of patterns, so as to improve product grade, ornamental value, and high precision. Effect

Active Publication Date: 2013-10-09
CHAOZHOU THREE CIRCLE GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Inkjet printing is limited by the accuracy of printer nozzles and printer ink, and the accuracy requirements of 0.5-5 μm are currently unattainable
The method of laser etching is to make the laser laser system laser engrave on the surface of ceramic material products. Due to the high temperature and high heat generated by the laser beam instantly, the ceramic surface will be vaporized, which will easily lead to problems such as pattern discoloration and ceramic substrates are easily damaged.
[0004] In summary, the metal surface layer on the surface of ceramic material products processed by the above existing methods is very rough, and the surface roughness, surface gloss and surface chromaticity are difficult to control, and there are problems such as low processing accuracy, easy deformation of graphics, and easy damage to ceramics. Substrate and other issues make it impossible to process micro-nano-level high-precision metal patterns

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] This embodiment provides a method for processing a high-precision metal LOGO pattern on a ceramic mobile phone base plate, said method comprising the following steps:

[0031] (1) Pretreatment: Use corundum powder with a powder particle size of 0.001-5 μm to mechanically grind and polish the white or black zirconia ceramic mobile phone bottom plate into a mirror state, so that the surface roughness Ra of the ceramic mobile phone bottom plate is controlled at 0.5 μm or less ;

[0032] (2) Metal coating: After cleaning the pretreated ceramic mobile phone bottom plate, apply magnesium-aluminum alloy film on the surface of the ceramic mobile phone bottom plate by magnetron sputtering. The temperature is 50-350°C, and then argon gas is introduced, and the magnesium-aluminum alloy is used as the target material, and the magnetron sputtering target is turned on for sputtering, and the vacuum degree is kept at 0.001-10Pa, and the sputtering is carried out for 1-10 minutes, so a...

Embodiment 2

[0039] This embodiment provides a method for processing a high-precision metal LOGO pattern on a ceramic mobile phone base plate, said method comprising the following steps:

[0040] (1) Pretreatment: Use silicon carbide powder with a powder particle size of 0.001-5 μm to mechanically grind and polish the white or black zirconia ceramic mobile phone bottom plate into a mirror state, so that the surface roughness Ra of the ceramic mobile phone bottom plate is controlled at 0.5 μm or less. the following;

[0041] (2) Metal coating: After cleaning the pretreated ceramic mobile phone bottom plate, use multi-arc ion plating to coat titanium film on the surface of the ceramic mobile phone bottom plate. Specifically, hang the ceramic watch in the furnace, vacuumize, and control the temperature in the furnace to 50 ~350°C, with titanium as the target material, a mixed gas of nitrogen, ethylene, and argon is introduced, so that the color, hardness and wear resistance of the metal film ...

Embodiment 3

[0048] This embodiment provides a method for processing a high-precision metal circuit on an alumina substrate, the method comprising the following steps:

[0049] (1) Pretreatment: Use zirconia ceramic powder with a powder particle size of 0.001-5 μm to mechanically grind and polish the alumina substrate into a mirror state, so that the surface roughness Ra of the alumina substrate is controlled at 0.5 μm or less;

[0050] (2) Metal coating: After the pretreated alumina substrate is cleaned, the copper-nickel alloy film is plated on the surface of the ceramic watch by physical vapor deposition, and the thickness of the copper-nickel alloy film is 0.01-100 μm;

[0051] (3) Coating photosensitive material: Coating UV ink on the copper-nickel alloy film of the alumina substrate by scraping, controlling the thickness of the UV ink at 0.01-50 μm, and then drying at 20-135 °C;

[0052] (4) Exposure and development: cover the designed film or mask plate pattern on the UV ink on the ...

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Abstract

The invention discloses a processing method of high-precision metal patterns on the surface of a ceramic material product. The processing method comprises the following steps of: carrying out pretreatment on the ceramic material product firstly, plating a metal film with the thickness of 0.01 micron to 100 microns on the surface of the ceramic material product, then coating a corrosion-resistant photosensitive material on the metal film, carrying out exposure and development on the metal film, etching the metal film by virtue of an etching solution finally, removing the cured photosensitive material after etching, exposing metal film layer patterns, and further carrying out electroplating or chemical plating treatment on the surface of a metal film layer according to the needs. The processing method is used for manufacturing high-precision micro-nano metal patterns on the surface of the ceramic material product. With the adoption of the processing method, as the manufactured metal patterns have the characteristics that colors and the electric conductivity are adjustable, the patterns can be arbitrarily designed, the grade and the ornamental value of the ceramic material product can be increased, a ceramic substrate is not damaged, and the cost is low.

Description

technical field [0001] The invention relates to a method for processing metal patterns on the surface of ceramic material products, in particular to a method for processing high-precision metal patterns on the surface of ceramic material products. Background technique [0002] With the development of science and technology, people have higher and higher requirements for making high-precision metal circuits or patterns on the surface of ceramic materials. At present, the traditional processing methods of metal patterns on the surface of ceramic materials mainly include screen printing, metal thermal spraying, inkjet printing, laser etching, etc., but all of them have the problem of low precision. [0003] Screen printing is first screen printing and then sintering at a certain temperature to obtain a surface metal pattern. Screen printing is limited by the diameter of the screen and the characteristics of the paste, and its printing accuracy is difficult to reach below 100μm...

Claims

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Application Information

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IPC IPC(8): C04B41/88
Inventor 马艳红徐苏龙
Owner CHAOZHOU THREE CIRCLE GRP
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