High-temperature sheet-type tantalum capacitor and manufacturing method thereof

A technology of tantalum capacitors and manufacturing methods, which is applied in the direction of capacitors, electrolytic capacitors, capacitor parts, etc., can solve problems such as not being able to withstand high temperature working environments, and achieve the effects of small size, good high temperature resistance, and excellent and stable performance

Active Publication Date: 2013-10-23
ZHUZHOU HONGDA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the disadvantage that the existing chip tantalum capacitors cannot withstand high temperature working environment, and provide a chip

Method used

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  • High-temperature sheet-type tantalum capacitor and manufacturing method thereof
  • High-temperature sheet-type tantalum capacitor and manufacturing method thereof
  • High-temperature sheet-type tantalum capacitor and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0022] Example one

[0023] figure 1 and figure 2 A schematic diagram of the basic structure of the present invention is given. It can be seen from the drawings that the present invention is a chip solid electrolytic tantalum capacitor, which is basically the same in structure as the traditional chip solid electrolytic tantalum capacitor. Designed to press the tantalum powder particles into a shape, vacuum sintering to obtain the anode tantalum core 3, then electrochemically form a tantalum pentoxide dielectric film, and then coat manganese dioxide as the cathode, and finally assemble the pellets with epoxy resin 6 Products are molded and sealed. But because it is a high-temperature product, a new manufacturing process is adopted, as follows:

[0024] A. Anode design: Choose tantalum metal powder with uniform particle size and larger particle size, calculate the weight of tantalum powder according to the forming voltage of 2~6 times the rated voltage, press it into a square...

Example Embodiment

[0028] Example two

[0029] figure 1 and image 3 A schematic diagram of a dual-core structure of the present invention is given. The high-temperature chip tantalum capacitor includes a negative electrode holder 1, a bonding silver paste 2, an anode tantalum core 3, a tantalum wire 4, a positive lead frame 5, and a high-temperature The epoxy resin 6 of the outer layer of the chip tantalum capacitor, the negative electrode holder 1 is connected to the anode tantalum core 3 by bonding silver paste 2, and the high temperature chip tantalum capacitor adopts a dual-core structure, including two anode tantalum cores 3 and two tantalum wires 4 respectively connected to the two anode tantalum cores 3, the two anode tantalum cores 3 are bonded together with the silver paste 2, and the two tantalum wires 4 are spot-welded on the positive lead frame 5 side by side.

[0030] The working principle and manufacturing method of the second embodiment are the same as that of the first embodiment...

Example Embodiment

[0031] Example three

[0032] figure 1 and Figure 4 A schematic diagram of another multi-core structure of the present invention is given. The high-temperature chip tantalum capacitor includes a negative electrode holder 1, a bonding silver paste 2, an anode tantalum core 3, a tantalum wire 4, a positive lead frame 5, and a high-temperature The epoxy resin 6 of the outer layer of the chip tantalum capacitor, the negative electrode holder 1 is connected to the anode tantalum core 3 by bonding silver paste 2, and the high temperature chip tantalum capacitor adopts a multi-core structure, including three (or There are three or more anode tantalum cores 3 and three (or more than three) tantalum wires 4 respectively connected to the anode tantalum core 3. The anode tantalum cores 3 are all connected together by bonding silver paste 2, and the tantalum wires 4 are Spot welded on the positive electrode lead frame 5 side by side.

[0033] The working principle and manufacturing metho...

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Abstract

The invention discloses a high-temperature sheet-type tantalum capacitor and a manufacturing method of the high-temperature sheet-type tantalum capacitor. The manufacturing method of the high-temperature sheet-type tantalum capacitor comprises the steps that an anode is designed, namely, the weight of tantalum powder is calculated according to formation voltage which is 2-6 times of the nominal voltage, and a porous matrix anode tantalum core is formed through sintering; dielectric film is formed, namely, aqueous solution with electrolyte being boric acid or nitric acid or phosphoric acid or ammonium dihydrogen phosphate or ethylene glycol is selected as formation solution, and tantalum pentoxide dielectric film which is uniform in thickness and good in uniformity is formed on the surface of the anode tantalum core; a manganese dioxide cathode is manufactured, namely, the anode tantalum core is put into manganous nitrate with different proportions, repeated operation is conducted, and a manganese dioxide cathode layer is formed; the high-temperature sheet-type tantalum capacitor is assembled. The high-temperature sheet-type tantalum capacitor can resist high temperature of 200 DEG C, has good high-temperature-resisting capacity, and is small in size, good and stable in performance, and capable of being widely applied to the fields of power supply control parts of airplane noses or guided missiles or the like and the fields of petroleum drilling electronic circuits and the like.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a high-temperature chip tantalum capacitor and a manufacturing method thereof. Background technique [0002] At present, with the rapid development of science and technology, human beings are exploring the interior of the earth and outer space more and more deeply, which puts forward higher requirements for electronic components, and chip tantalum capacitors are an important branch of tantalum electrolytic capacitors. , widely used in mobile communications, program-controlled switches, notebook computers, handheld computers, business communications, computers, camcorders, automotive electronics and other small electronic equipment surface mount equipment, but also in aviation, aerospace, marine ( In terms of ground cables, communications, oil drilling, etc., ultra-thin, large capacity, low equivalent series resistance, high frequency, high temperature, and high reliability a...

Claims

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Application Information

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IPC IPC(8): H01G9/042H01G9/07H01G9/08H01G9/26
Inventor 易金锋李俊伟
Owner ZHUZHOU HONGDA ELECTRONICS
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