High-heat-conductivity boroheteropolysiloxane potting adhesive and preparation method thereof

A technology of heteropolysiloxane and polyborosiloxane, which is applied in the field of high thermal conductivity boropolysiloxane encapsulant and its preparation, can solve the problem of easy generation of bubbles and pores, failure to meet packaging performance requirements, and impact on Composition adhesive sealing and high temperature aging resistance and other issues

Active Publication Date: 2014-09-10
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The condensation curing process is often accompanied by the release of small molecular compounds such as water, methanol, and ethanol, which are prone to bubbles and pores, often failing to meet high-standard packaging performance requirements, and seriously affecting the adhesive sealing and high-temperature aging resistance of the composition.

Method used

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  • High-heat-conductivity boroheteropolysiloxane potting adhesive and preparation method thereof
  • High-heat-conductivity boroheteropolysiloxane potting adhesive and preparation method thereof
  • High-heat-conductivity boroheteropolysiloxane potting adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0043] Example 1: Raw material preparation

[0044] (1) Preparation of vinyl borosiloxane: add 61g of phenylboronic acid and 130g of vinyl dimethylethoxysilane in a 500ml three-necked flask equipped with a thermometer, condenser, mechanical stirrer and heating device, and stir at room temperature Make it dissolve slowly, then add 0.2 g of trifluoromethanesulfonic acid, heat to 60°C and keep for 1 hour, continue heating to 80°C, and reflux for 5 hours. Then remove the by-product ethanol by proper vacuum distillation, cool, neutralize the mixture with 2g of calcium carbonate and keep stirring at room temperature for 1 hour, filter, and obtain 140g of filtrate, which is a liquid vinyl containing phenyl group on the boron atom. Borosiloxane monomer BS1 (ie vinyl borosiloxane).

[0045] (2) Preparation of vinyl polyborosiloxane:

[0046] A. Add 61g of phenylboronic acid and 66g of methylvinyldimethoxysilane into a 250ml three-necked flask equipped with a thermometer, condenser, m...

example 2

[0053] At room temperature, 100g of vinyl-terminated methyl silicone oil (also known as vinyl-terminated polydimethylsiloxane, viscosity 3000mPa·s), 100g of vinylmethyl nano-MQ silicone resin (vinyl content 2.4wt%, M / Q =0.75), 5g vinyl borosiloxane BS1, 0.05g ethynyl cyclohexanol, 0.034g tetrakis (triphenylphosphine) platinum Pt (PPh 3 ) 4 (the content of platinum is 15wt%) (the consumption of platinum is 0.15*0.034=0.0051), 0.5g allyl glycidyl ether, 10g borazine and 120g dry treated boron nitride powder (average particle diameter 10μm ) after mixing evenly, make corresponding modules according to the corresponding test methods, place them in an environment of 50°C for 2 hours, then raise the temperature to 100°C for 4 hours, and measure the composite materials (that is, high thermal conductivity boropolysilicon Oxane potting glue) Shore hardness, thermal conductivity and high temperature aging resistance and bonding strength. The test results are shown in Table 1.

[0054...

example 3

[0059] At room temperature, 100g of vinyl-terminated methyl silicone oil (vinyl-terminated polydimethylsiloxane, viscosity 50000mPa·s), 20g of vinylmethyl nano-MQ silicone resin (vinyl content 4.0wt%, M / Q=1.5 ), 50g vinyl polyborosiloxane PBS2, 0.2g ethynyl cyclohexanol, 0.2g bis(triphenylphosphine) platinum dichloride (PPh 3) 2 PtCl 2 (the content of platinum is 24.2wt%) (the consumption of platinum is 0.242*0.2=0.0484), 5g4-vinyl epoxycyclohexane, 6g borazine and 100g dry treated boron nitride powder (average particle size diameter 10μm) after mixing evenly, according to the corresponding test method to make the corresponding modules, first placed in the environment of 60 ℃ for 2 hours, then heated up to 120 ℃, heat preservation for 3 hours, after cooling, the composite materials (that is, high thermal conductivity boron Heteropolysiloxane potting glue) Shore hardness, thermal conductivity and high temperature aging resistance and bonding strength. The experimental test r...

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Abstract

The invention belongs to the field of potting materials, and discloses a high-heat-conductivity boroheteropolysiloxane potting adhesive and a preparation method thereof. The potting adhesive is composed of the following components in parts by mass: 100 parts of vinylmethyl polysiloxane, 20-100 parts of vinylmethyl nano MQ silicon resin, 5-50 parts of vinyl polyborosiloxane or vinyl borosiloxane, 0.05-0.2 part of acetylenyl cyclohexanol, 0.005-0.05 part of noble metal organic compound catalyst, 0.5-5 parts of vinyl epoxy compound, 1-10 parts of borazine, 10-0 part of methyl hydrogen-containing silicon oil and 50-120 parts of boron nitride ceramic. The high-heat-conductivity boroheteropolysiloxane potting adhesive has the advantages of high heat conductivity, favorable sealing property, high bonding force, favorable elasticity, water and moisture resistance, electric insulation, shock absorption, high temperature resistance and excellent aging resistance, and has wide application prospects in packaging of high-power electronic information components, semiconductor communication and illumination components and other components.

Description

technical field [0001] The invention belongs to the field of packaging materials, and in particular relates to a high thermal conductivity bora polysiloxane potting glue and a preparation method thereof. Background technique [0002] Thermally conductive potting adhesives are widely used in electronic information, LED lighting, aviation, aerospace, national defense and other fields that require heat dissipation and heat transfer. With the rapid development of integration, miniaturization and high power of electronic equipment and semiconductor materials, higher requirements are put forward for packaging materials. In addition to providing protection against moisture, insulation, corrosion and high temperature resistance, packaging materials must It has excellent thermal conductivity, low thermal expansion coefficient and low dielectric constant and dielectric loss. A large number of experiments have proved that the possibility of device failure increases by 2 to 3 times for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J185/04C09J183/05C09J163/10C09J11/04C09J11/06
Inventor 黄月文王斌郑周李雅杰杨璐霏
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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