Cooling liquid for cutting solar silicon wafer through diamond wire

Abstract

The invention discloses a cooling liquid for cutting a solar silicon wafer through a diamond wire. The cooling liquid consists of the following raw materials in parts by weight: 2-3 parts of triethanolamine, 2-4 parts of glycerin, 2-3 parts of methoxy polyethylene glycol, 3-5 parts of hydroxyethyl acrylate, 2-3 parts of fatty alcohol-polyoxyethylene ether, 3-4 parts of p-toluenesulfonic acid, 2-5 parts of fumaric acid, 1-2 parts of phthalic anhydride, 2-4 parts of maleinimide, 1-3 parts of cis-butenedioic acid, 2-4 parts of diisopropanolamine, 2-3 parts of n-butylamine, 1-2 parts of tri-isopropanolamine, 2-3 parts of potassium sorbate, 1-3 parts of phenoxyethanol, 2-3 parts of methylparaben, 2-3 parts of ethylenediamine tetraacetic acid, 2-5 parts of titanium dioxide, 2-4 parts of methyl methacrylate, 3-5 parts of acetone, and 50-70 parts of deionized water. The cooling liquid for cutting the solar silicon wafer through the diamond wire can be well applied to cutting with the diamond wire, is good in lubrication and cooling effects, low in cost and free of pollution, can effectively reduce the breakage rate, has a good dispersion function on silicon powder and iron impurities generated in the cutting process, and ensures the surface property of the silicon wafer.

Description

technical field [0001] The invention relates to the technical field of cooling liquid, in particular to a cooling liquid used for diamond wire cutting solar silicon wafers. Background technique [0002] At present, with the rapid development of the world economy, energy consumption is increasing, and all countries in the world need the application and popularization of new energy. As the greenhouse gas effect caused by carbon dioxide emissions causes global warming and causes natural disasters, the demand for clean and renewable energy is particularly strong in countries around the world. With the application and popularization of new energy, the rapid growth momentum of the photovoltaic industry has been further strengthened and valued. As an indispensable high-end auxiliary material for cutting monocrystalline silicon and polycrystalline silicon in the photovoltaic industry, cutting steel wire has an unusual role in the production chain of the photovoltaic industry. impor...

AI Technical Summary

Problems solved by technology

The existing diamond wire coolant is the material used in the cutting process of diamond wire. At present, most of the diamond wire coolant directly uses polyethylene glycol. Although it has a certain effect to a certain extent, it still has a certain effect. There are many disadvantages, such as sensitivity to water, poor effect of dispersing silicon powder and iron powder, and certain environmental pollution, high cost