Low-temperature composite high-heat-conductivity ceramic material and preparation method thereof

Abstract

The invention provides a low-temperature composite high-heat-conductivity ceramic material which is composed of the following components in parts by weight: 60-70 parts of modified polysiloxane, 30-40 parts of aluminum oxide-aluminum nitride mixed powder and 1-3 parts of coupling agent. The molecular formula of the modified polysiloxane is [RnSiO[4-n / 2]]n, wherein R is the modified part which is a titanium-containing group or phenyl group. The invention also provides a preparation method of the low-temperature composite high-heat-conductivity ceramic material, which comprises the following steps: mixing all the raw materials together, grinding, sintering, and carrying out dry-process powder ball milling to obtain the required ceramic material. The ceramic material has the advantages of high heat conductivity coefficient, high / low-temperature resistance, chemical corrosion resistance, high formability, simple technique, high production efficiency and the like.

Description

technical field [0001] The invention belongs to the field of high molecular polymer materials, and in particular relates to a low-temperature composite high-thermal conductivity ceramic material and a preparation method thereof. Background technique [0002] In the fields of high-temperature structures such as machinery, aerospace, energy and military, commonly used metal materials and metal alloy materials are difficult to meet the requirements in terms of operating temperature and density, so people have to seek new materials to replace them. In order to replace the current materials, the new materials must have the following properties: light weight, good thermal stability, high fracture toughness, high fracture strength, good oxidation resistance, good thermal shock resistance, etc. Ceramic materials have high strength, high modulus, and good oxidation resistance and corrosion resistance. Compared with metal and alloy materials, ceramic materials have lower density and b...

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Problems solved by technology

[0003] The preparation process of traditional ceramics generally adopts powder sintering method. The general process is: powder preparation-molding-sintering-processing. Although the preparation technology improvement technology emerges endlessly, it still has its own insurmountable limitations:

[0004] 1. The sintering temperature is high. Although the sintering temperature can be reduced by adding sintering aids, adding sintering aids will reduce the high temperature performance of the material;

[0005] 2. Material molding is difficult; ceramic molding technology cannot meet the manufacturing requirements of high-precision and complex parts;

[0006] 3. The material processing is relatively difficult, the strength of the green body is relatively low, and it cannot be finely processed, while the strength of the sintered body is very high, very hard, the processing cost is high, and processing is difficult;

[0007] 4. When preparing multi-phase materials, due to powder mixing, uniform distribution at the molecular level cannot be achieved, so that the uniformity of the material is limited, thereby affecting its high-temperature performance

[0018] The existing precursor technology is rarely used in the molding of ceramics in the LED field. Generally speaking, the cost of using the precursor is higher, and the production conditions are more demanding than traditional ceramics, and its application fields are limited.

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