A kind of heat-and-humidity resistant solvent-free dipping varnish and preparation method thereof
A solvent-free impregnating paint, heat-and-moisture-resistant technology, applied in coatings, polyester coatings, fire-retardant coatings, etc., can solve the problems of poor heat-and-moisture resistance and limited breadth, achieve excellent heat-and-moisture resistance, ensure heat-and-moisture resistance, and improve paint The effect of film adhesion
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Embodiment 1
[0033] A heat-and-humidity resistant solvent-free impregnating varnish of the present invention is prepared from the following raw materials in parts by weight:
[0034] 32kg polybasic acid (8kg isophthalic acid, 6kg succinic acid, 18kg maleic anhydride),
[0035] 28kg polyol A (3kg Saike, 15kg neopentyl glycol, 10kg dipropylene glycol),
[0036] 12kg polyol B (2-butyl-2-ethyl 1,3-propanediol),
[0037] 3kg modified imine resin (tetrahydrophthalic anhydride imine ethyl alcohol),
[0038] 28kg reactive diluent (vinyltoluene),
[0039] 0.1kg stabilizer (hydroquinone),
[0040] 1.2kg initiator (cumene peroxide),
[0041] 0.8 kg of adhesion promoter (vinyl tri-tert-butyl silicon peroxide).
[0042] The preparation method of the heat-and-humidity resistant solvent-free dipping varnish of the present embodiment, comprises the following steps:
[0043] (1) Add 12kg of 2-butyl-2-ethyl 1,3-propanediol, 8kg of isophthalic acid, 3kg of Saike, and 6kg of neopentyl glycol into the re...
Embodiment 2
[0046] A heat-and-humidity resistant solvent-free dipping varnish of the present invention is mainly prepared from the following raw materials in parts by weight:
[0047] 39kg polybasic acid (6kg trimellitic anhydride, 4kg adipic acid, 21kg maleic acid, 8kg dimer fatty acid),
[0048] 13kg Polyol A (6kg Neopentyl Glycol, 7kg Hexylene Glycol),
[0049] 24kg polyol B (16kg2,2,4-trimethyl-1,3-pentanediol, 8kg1,4-cyclohexanedimethanol),
[0050] 6kg modified imine resin (methyltetrahydrophthalic anhydride imine ethyl alcohol),
[0051] 38kg reactive diluent (diallyl phthalate),
[0052] 0.06kg2-tert-butylhydroquinone,
[0053] 0.01kg methyl hydroquinone,
[0054] 1kg tert-butyl perbenzoate,
[0055] 0.2 kg of vinylmethyldi-tert-butylperoxysilane.
[0056] The preparation method of the heat-and-humidity resistant solvent-free dipping varnish of the present embodiment, comprises the following steps:
[0057] (1) Add 16kg of 2,2,4-trimethyl-1,3-pentanediol, 8kg of 1,4-cyclohe...
Embodiment 3
[0060] A heat-and-humidity resistant solvent-free dipping varnish of the present invention is mainly prepared from the following raw materials in parts by weight:
[0061] 33kg polybasic acid (6kg phthalic anhydride, 9kg sebacic acid, 18kg maleic anhydride),
[0062] 8kg polyol A (neopentyl glycol),
[0063] 39kg polyol B (19kg 2-butyl-2-ethyl 1,3-propanediol, 20kg hydrogenated bisphenol A),
[0064] 8kg imine resin (methyltetrahydrophthalic anhydride imide ethyl alcohol),
[0065] 26kg reactive diluent (styrene),
[0066] 0.1kg 2,5-di-tert-butylhydroquinone,
[0067] 1kg ethyl-3,3-bis(tert-butylperoxy)butyrate,
[0068] 3.2kg 1,1-tert-butyl-diperoxy-4-hydroxycyclohexyltrimethoxysilane.
[0069] The preparation method of the heat-and-humidity resistant solvent-free dipping varnish of the present embodiment:
[0070] (1) Add 19kg of 2-butyl-2-ethyl 1,3-propanediol, 20kg of hydrogenated bisphenol A and 6kg of phthalic anhydride into the reaction kettle, and after mixing ev...
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