3results about How to "Guaranteed adhesion strength" patented technology

The utility model discloses a separation type facial mask bag which comprises a bag body, a liquid cavity and a facial mask cavity are arranged in the bag body, a first easy-to-uncover strip and a second easy-to-uncover strip are arranged on the two sides of the interior of the bag body between the liquid cavity and the facial mask cavity respectively, and the first easy-to-uncover strip and the second easy-to-uncover strip are attached in a separable mode through hot melt adhesive. The first easy-to-tear strip and the second easy-to-tear strip are provided with transverse embossments, and vertical embossments are arranged at the two ends of the transverse embossments and form locking edges. A clamping block is arranged on the top face of the first easy-to-tear strip, and a connecting groove matched with the clamping block is formed in the top face of the second easy-to-tear strip.

This invention belongs to the field of PCB board testing technology, specifically relating to a testing method for PTH (Polymerization Thermoplastic Hole) controlled-depth stepped copper foil. The method includes multiple PCB boards to be tested, all of which undergo drilling, controlled-depth step drilling, and stepped hole drilling. A baking board is used to support and heat the PCB boards. The heated PCB boards undergo copper plating, thickening, and full-board electroplating. The electroplated PCB boards are then rolled into SET boards and reflow soldered. This invention tests different types of substrates using different copper plating processes to identify the causes of PCB delamination after reflow soldering and wave soldering. Based on this, the copper plating solution is improved by adding polyethylene glycol and a mixture of polyethylene glycol and ethylenediaminetetraacetic acid (EDTA) to the solution in stages and adjusting the pH value to find a pH environment suitable for tensile testing. This ensures that the copper layer adhesion strength is maintained after copper plating and addition, reducing the generation of defective boards.

The application belongs to the field of high polymer materials, and discloses a polymer reversible interlocking network adhesive film, a preparation method and application thereof.The polymer reversible interlocking network adhesive film comprises the following components by weight percentage: crosslinking polymer A containing dynamic disulfide bond 50%-75%, crosslinking polymer B containing dynamic borate ester bond 25%-50%.The polymer reversible interlocking network adhesive film prepared by the application has good dissipation performance, fully guarantees the bonding cohesive strength inside the adhesive film;under heating ultrasonic and vacuum hot pressing, the polymer reversible interlocking network adhesive film has substrate-induced self-layering effect, fully guarantees the adhesion strength of the bonding interface;from the interface to the inside, the bonding effect is fully guaranteed, and the strong bonding of two different substrates, i.e., glass and TPT fluorine-containing back plate, is realized on the basis of not damaging the substrate.The reversible covalent bond balance reaction in the polymer reversible interlocking network adhesive film can promote the recycling and repeated bonding of the adhesive film.