Heat sink material with high thermal matching performance for semiconductor lighting

A heat sink material and semiconductor technology, applied in the field of heat sink materials, can solve problems such as insufficient thermal matching performance of heat sink materials, and achieve the effects of good mechanical properties, good thermal matching effect, and low thermal conductivity

Inactive Publication Date: 2018-06-08
安徽普发电气有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

And this patent is to provide a heat sink material with high thermal matching performance for semiconductor lighting, so as to achieve the shortcomings of current heat sink materials in thermal matching performance.

Method used

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  • Heat sink material with high thermal matching performance for semiconductor lighting
  • Heat sink material with high thermal matching performance for semiconductor lighting
  • Heat sink material with high thermal matching performance for semiconductor lighting

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A heat sink material with high thermal matching performance for semiconductor lighting, comprising the following components in parts by mass: 30 parts of graphene, 4 parts of boron oxide, 3 parts of corundum powder, 2 parts of nickel conductive glue, 0.5 parts of barium titanate, 3 parts of sodium chloride, 4 parts of citric acid, 10 parts of chromic anhydride, 10 parts of lamp powder, 5 parts of polyurethane, 2 parts of calcium oxide, 2 parts of diatomaceous earth, 2 parts of hydroxyapatite, 4 parts of zirconia sol, 3 parts of rare earth, 9 parts of grape seed extract, 3 parts of dimethyl itaconate, 5 parts of binder, 1 part of coupling agent, 1 part of compatibilizer, 0.8 part of antioxidant, 0.5 part of stabilizer.

[0029] Among them, the diatomite is modified before use. During the treatment, 10 parts by mass of diatomite and 2 parts by mass of glycerin are mixed and stirred, then 0.5 parts by mass of citric acid is added, and stirred at 55°C for 3 Minutes, the sti...

Embodiment 2

[0041] A heat sink material with high thermal matching performance for semiconductor lighting, comprising the following components in parts by mass: 35 parts of graphene, 6 parts of boron oxide, 5 parts of corundum powder, 5 parts of nickel conductive glue, 1.5 parts of barium titanate, 4.5 parts of sodium chloride, 5 parts of citric acid, 12 parts of chromic anhydride, 15 parts of lamp powder, 8 parts of polyurethane, 3 parts of calcium oxide, 2 parts of diatomaceous earth, 3 parts of hydroxyapatite, 4 parts of zirconia sol, 4 parts of rare earth, 11 parts of grape seed extract, 4 parts of dimethyl itaconate, 8 parts of binder, 2 parts of coupling agent, 1 part of compatibilizer, 1.2 parts of antioxidant, and 1 part of stabilizer.

[0042] Among them, the diatomite is modified before use. During the treatment, 10 parts by mass of diatomite and 2 parts by mass of glycerin are mixed and stirred, then 0.5 parts by mass of citric acid is added, and stirred at 55°C for 5 Minutes, ...

Embodiment 3

[0054] A heat sink material with high thermal matching performance for semiconductor lighting, comprising the following components in parts by mass: 40 parts of graphene, 8 parts of boron oxide, 6 parts of corundum powder, 8 parts of nickel conductive glue, 3 parts of barium titanate, 5 parts of sodium chloride, 6 parts of citric acid, 15 parts of chromic anhydride, 20 parts of lamp powder, 10 parts of polyurethane, 4 parts of calcium oxide, 4 parts of diatomaceous earth, 3 parts of hydroxyapatite, 6 parts of zirconia sol, 5 parts of rare earth, 13 parts of grape seed extract, 5 parts of dimethyl itaconate, 12 parts of binder, 2 parts of coupling agent, 2 parts of compatibilizer, 1.4 parts of antioxidant, 2 parts of stabilizer.

[0055] Among them, the diatomite is modified before use. During the treatment, 10 parts by mass of diatomite and 2 parts by mass of glycerin are mixed and stirred, then 0.5 parts by mass of citric acid is added, and stirred at 55°C for 8 Minutes, the ...

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Abstract

The invention provides a heat sink material with high thermal matching performance for semiconductor lighting and relates to the technical field of semiconductor lighting. The heat sink material comprises graphene, boron oxide, alundum powder, a nickel conductive adhesive, barium titanate, sodium chloride, citric acid, chromic anhydride, magnesium oxide, polyurethane, calcium oxide, diatomite, hydroxyapatite, zirconium dioxide sol, rare earth, grape seed extract, dimethyl itaconate, a bonding agent, a coupling agent, a compatibilizer, an antioxidant and a stabilizing agent. The heat sink material with high thermal matching performance for semiconductor lighting, provided by the invention has good comprehensive performance and good mechanical property, excellent insulating property and thermal conductivity, and lower coefficient of expansion, can effectively improve the thermal matching ability and can be widely applied to a semiconductor technology.

Description

Technical field: [0001] The invention relates to the technical field of semiconductor lighting, in particular to a heat sink material with high thermal matching performance for semiconductor lighting. Background technique: [0002] Light-emitting diodes are referred to as LEDs for short. Made of compounds containing Gallium (Ga), Arsenic (As), Phosphorus (P), Nitrogen (N), etc. Visible light can be radiated when electrons and holes recombine, so they can be used to make light-emitting diodes. It is used as an indicator light in circuits and instruments, or as a text or number display. Gallium arsenide diodes emit red light, gallium phosphide diodes emit green light, corundum powder diodes emit yellow light, and gallium nitride diodes emit blue light. Due to chemical properties, it is divided into organic light-emitting diode OLED and inorganic light-emitting diode LED. [0003] LED products are mainly used in the three major fields of backlight, color screen and indoor l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B26/28
CPCC04B26/28C04B2111/92C04B2201/32C04B2201/50C04B24/34C04B24/302C04B24/26C04B14/024C04B14/30C04B14/303C04B14/305C04B22/08C04B22/124C04B24/06C04B24/282C04B22/064C04B24/045C04B2103/0068C04B2103/608C04B18/24C04B14/08C04B14/306C04B14/36C04B14/366C04B14/104
Inventor 缪和平
Owner 安徽普发电气有限公司
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