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The method of sic/graphene oxide composite modified epoxy resin

A graphene composite and epoxy resin technology, applied in the field of composite materials, can solve problems such as poor thermal conductivity, complicated preparation process, and great influence on material properties, and achieve the effects of improving mechanical properties, avoiding agglomeration, and improving bonding

Active Publication Date: 2020-11-20
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to overcome the shortcomings of existing epoxy resins such as poor thermal conductivity, excessive addition of fillers that have a great impact on material properties, and complicated preparation processes, etc., and provide a SiC / graphene oxide composite modified epoxy resin Methods

Method used

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  • The method of sic/graphene oxide composite modified epoxy resin

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] 1) Preparation of graphene oxide / SiC epoxy diluent

[0026] Put 5g of nano-SiC (6.25%, mass ratio to epoxy resin, the same below) powder in a hydrochloric acid solution with a mass fraction of 5%, stir for 2 hours, and wash with a sufficient amount of deionized water after solid-liquid separation. Take a certain amount of graphite oxide slurry prepared by the Hummers method, and ultrasonically disperse it in deionized water to obtain a graphene oxide aqueous dispersion with a concentration of 1 mg / mL. The treated SiC powder was dispersed in 100 mL of graphene oxide (0.125%) aqueous dispersion, and then 2 mL of aminosilane coupling agent (KH550) was added, and heated to 80° C. for 4 h. Add 4g (5%) butyl glycidyl ether to the system again, remove the water in the system by distillation under reduced pressure, then carry out ultrasonic treatment, obtain the graphene oxide / SiC epoxy diluent that filler is evenly dispersed;

[0027] 2) Preparation of graphene oxide / SiC epox...

Embodiment 2

[0030] 1) Preparation of graphene oxide / SiC epoxy diluent

[0031] 10g (10%) nano-SiC powder was placed in a hydrochloric acid solution with a mass fraction of 5%, stirred for 2 hours, and washed with a sufficient amount of deionized water after solid-liquid separation. Take a certain amount of graphite oxide slurry prepared by the Hummers method, and ultrasonically disperse it in deionized water to obtain a graphene oxide aqueous dispersion with a concentration of 1.5 mg / mL. The treated SiC powder was dispersed in 100 mL of graphene oxide water (0.15%) dispersion, 3 ml of aminosilane coupling agent (KH550) was added to the system, and heated to 90° C. for 4 h. Add 15g (15%) ethylene glycol glycidyl ether to the system again, remove the water in the system by distillation under reduced pressure, then carry out ultrasonic treatment, obtain the graphene oxide / SiC epoxy diluent that filler is evenly dispersed;

[0032] 2) Preparation of graphene oxide / SiC epoxy resin composites ...

Embodiment 3

[0035] 1) Preparation of graphene oxide / SiC epoxy diluent

[0036]6g (5%) nano-SiC powder was placed in a hydrochloric acid solution with a mass fraction of 5%, stirred for 2 hours, and washed with a sufficient amount of deionized water after solid-liquid separation. Take a certain amount of graphite oxide slurry prepared by the Hummers method, and ultrasonically disperse it in deionized water to obtain a graphene oxide aqueous dispersion with a concentration of 1.5 mg / mL. The treated SiC powder was dispersed in 100 mL of graphene oxide water (0.125%) dispersion, then 2 mL of aminosilane coupling agent (KH550) was added to the system, and heated to 100 ° C for 4 h. Add 12g (10%) ethylene glycol glycidyl ether to the system again, remove the water in the system by distillation under reduced pressure, then carry out ultrasonic treatment, obtain the graphene oxide / SiC epoxy diluent that filler is evenly dispersed;

[0037] 2) Preparation of graphene oxide / SiC epoxy resin composi...

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Abstract

The invention relates to a method for preparing SiC / graphene oxide composite modified epoxy resin. The method specifically comprises the following processes: adding nano SiC and a silane coupling agent into an aqueous graphene oxide dispersion for ultrasonic treatment; then replacing moisture in a system with an epoxy active diluent; mixing an obtained mixture with epoxy resin and a processing aid; and curing and molding to obtain an SiC / graphene oxide modified epoxy resin composite. After treatment, SiC and graphene oxide achieves nanoscale uniform dispersion in an epoxy resin matrix and forms a heat conducting network; and since SiC and graphene oxide have relatively high heat conductivity, the two fillers are collocated to significantly improve the heat conductivity of the epoxy resin.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a method for SiC / graphene oxide composite modified epoxy resin. Background technique [0002] Silicon carbide (SiC), also known as corundum, is generally made of quartz sand, petroleum coke, wood chips and other raw materials through high-temperature smelting in a resistance furnace. Silicon carbide is a wide bandgap semiconductor with very stable chemical properties and good high temperature resistance. Silicon carbide also has corrosion resistance and good semiconductor performance, and is widely used in various electronic information industries. In addition, silicon carbide also has extremely high thermal conductivity and low thermal expansion coefficient, so it can be used as a good thermal conductivity material. However, when SiC is used alone as a thermally conductive filler to prepare thermally conductive composite materials, the amount of SiC added is relati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L83/04C08L39/06C08K9/02C08K9/06C08K9/00C08K9/04C08K3/34C08K3/04C08K5/42C08K5/521C09K5/14
CPCC08K2201/011C08L63/00C09K5/14C08L83/04C08K9/02C08K9/06C08K9/00C08K9/04C08K3/34C08K3/042C08K5/42C08L39/06C08K5/521
Inventor 吴力立杨光王光耀王新李木
Owner WUHAN UNIV OF TECH
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