Ethynylphenyl-terminated silicon-containing aryl propargyl ether resin and its synthesis, ternary resin and its preparation, composite material and its preparation

A technology of ethynyl phenyl, propargyl ether, which is applied in the fields of polymer chemistry, polymer physics and polymer material modification, and can solve the problems of poor thermal stability and low mechanical properties of composite materials
CN108752374BActive Publication Date: 2020-10-09EAST CHINA UNIV OF SCI & TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
EAST CHINA UNIV OF SCI & TECH
Publication Date
2020-10-09

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Abstract

The invention discloses ethynyl phenyl-terminated silicon-containing aryl propargyl ether resin and synthesis thereof, ternary resin and preparation thereof, and a composite material and preparation thereof. The structural formula of the silicon-containing aryl propargyl ether resin is shown in a formula II, and the polymerization degree n is equal to 2 to 3. The formed silicon-containing aryl propargyl ether resin with a novel terminal group structure improves the heat stability, and improves the mechanical property of ethynyl phenyl-terminated silicon-containing aryl propargyl ether modifiedresin through blending with cyanate ester and benzoxazine, thereby providing the ethynyl phenyl-terminated silicon-containing aryl propargyl ether resin with excellent mechanical property and good heat resistance, and is applied to preparation of carbon fiber reinforced composite materials.
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Description

technical field

[0001] The invention relates to the technical fields of polymer chemistry, polymer physics and polymer material modification, in particular to a silicon-containing aryl propargyl ether resin terminated by ethynyl phenyl group and its synthesis, ternary resin and its preparation and compounding Materials and their preparation. Background technique

[0002] The carrier speed of aerospace and transportation is getting faster and faster, and the development of thin and light electronic products requires materials with high heat resistance, light weight and good strength. The development of high-tech polymer materials can meet the needs of aerospace and electronic information for new materials.

[0003] In order to overcome the decline of the physical-mechanical properties of composite materials caused by the water absorption (~5%) of epoxy resin and bismaleimide resin in a hot and humid environment, U.S. Patent (US4 885 403, 1989) discloses a Preparation of bis...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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