Multi-element metal composite scribing cutter with high mechanical performance and method for manufacturing multi-element metal composite scribing cutter

Abstract

The invention discloses a multi-element metal composite scribing cutter with the high mechanical performance and a method for manufacturing the multi-element metal composite scribing cutter. The multi-element metal composite scribing cutter with the high mechanical performance comprises three portions including a tough internal bonded fiber net, an aluminum alloy composite material and a dense micro-arc oxidation film layer. Cold-work hardened composite copper-based materials are woven to particularly obtain the tough internal bonded fiber net, cold wire drawing treatment is further carried out on adhesive softened copper wires to obtain the cold-work hardened composite copper-based materials, and aluminum bronze QAl10-4-4, bamboo charcoal powder with the particle sizes ranging from 0.01 mm to 0.03 mm, polyacrylonitrile resin and polyethylene oxide are fused to obtain the adhesive softened copper wires; 7A75 aluminum alloy powder and polyvinyl alcohol are mixed with each other and thenare secondarily sintered to particularly obtain the aluminum alloy composite material; the aluminum alloy composite material wraps the tough internal bonded fiber net, and the dense micro-arc oxidation film layer fixedly grows on the surfaces of the aluminum alloy composite material. The multi-element metal composite scribing cutter and the method have the advantages that the multi-element metalcomposite scribing cutter is high in surface hardness and impact resistance, good in self-bonding strength and heat dissipation performance and little in cutting heat generation and is self-lubricated, and cores are good in toughness.

Description

technical field [0001] The invention relates to the field of special materials, in particular to a multi-element metal composite high-mechanical performance scribing knife and a manufacturing method thereof. Background technique [0002] The inner circle cutting technology is often used in the silicon wafer slicing process, which developed and matured in the late 1970s. As the diameter of the silicon wafer increases, the size of the inner circle blade required in the inner circle cutting process increases, and the tension force of the blade also increases accordingly. At the same time, the thickening of the cutting edge of the blade increases the cutting loss, and the high-speed cutting increases the damage layer on the surface of the silicon wafer and the loss of the tool. These shortcomings restrict the improvement of the efficiency of the inner circle cutting technology in the direction of large film diameter and the reduction of production costs. In addition to the dif...

AI Technical Summary

Problems solved by technology

[0003] However, wire cutting technology has obvious weaknesses compared with inner circle cutting technology. First, the average error of sheet thickness is relatively large (about twice that of inner circle cutting technology).

Second, it is not easy to realize intelligent detection and control in the cutting process

The third is that the success rate of the cutting process is high and the risk is high. Once the wire breaks and cannot be saved, a single crystal rod will be wasted directly

Fourth, single-chip quality control cannot be achieved. The cutting quality of a batch of wafers can only be detected after one cutting is completed, and the cutting quality between wafers is also different.

[0005] The slicing knives in the prior art are in a contradictory state due to their size, bonding force, strength and present. At present, there is no one with high surface hardness, good core toughness, strong impact resistance, good self-bonding force, good heat dissipation performance, etc. Self-lubricating slicing knife for cutting semiconductors with low cutting heat