One-component solvent-free polyurethane adhesive for photovoltaic module back panel compounding and preparation method of polyurethane adhesive

A solvent-free polyurethane and polyurethane adhesive technology, applied in polyurea/polyurethane adhesives, adhesive additives, polymer adhesive additives, etc., can solve safety and health hazards, fire and explosion hazards, large equipment investment, etc. problem, achieve high initial bonding strength, excellent hydrolysis resistance, and fast speed

Inactive Publication Date: 2019-02-22
高鼎精细化工(昆山)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, solvent-based glue is mostly used for backplane composite adhesives. This kind of glue is a two-component polyurethane glue. Before use, the glue must be formulated according to the proportion. different materials (PVDF, EVA) for lamination, because of the solvent, the solvent smell makes people uncomfortable during use, and the solvent is flammable and explosive, and it is prone to fire and explosion hazards when used. The use of solvent

Method used

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  • One-component solvent-free polyurethane adhesive for photovoltaic module back panel compounding and preparation method of polyurethane adhesive
  • One-component solvent-free polyurethane adhesive for photovoltaic module back panel compounding and preparation method of polyurethane adhesive
  • One-component solvent-free polyurethane adhesive for photovoltaic module back panel compounding and preparation method of polyurethane adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091] like figure 1 As shown, the present invention prepares a kind of method for the one-component solvent-free polyurethane adhesive of photovoltaic module backboard compound and comprises the following steps:

[0092] Use two kinds of polyol esters: polyneopentyl glycol phthalate (molecular weight is 1000), polyoxypropylene diol molecular weight is (molecular weight is 1000), in stirring reactor, drop into above-mentioned two kinds of raw materials, in addition, again An antioxidant is added, and the amount of the antioxidant added is 0.15-0.5% of the total weight of the raw materials.

[0093] Heat and melt the raw materials in the stirring polymerization reactor, stir and mix evenly, heat slowly so that the temperature of the material reaches 110-120°C, vacuumize the reactor to reduce the vacuum degree in the reactor to below 50torr, and then start dehydration, and continue the negative pressure state 1- After 3 hours, fill with nitrogen and return to normal pressure to...

Embodiment 2

[0102] The process of this embodiment is the same as that of Example 1, the difference is: polyneopentyl adipate isophthalate (molecular weight is 2200), polytetramethylene ether glycol (molecular weight is 1000), polyoxyethylene Propylene glycol (molecular weight is 400), the weight ratio is set to 400:400:200. In the formula, the equivalent ratio of isocyanate group to hydroxyl group is 1.7:1, the diisocyanate is hydrogenated phenylmethane diisocyanate (H12MDI), which improves the initial bonding performance of the adhesive, the antioxidant is hindered phenolic antioxidant CHINOX 1010, and the catalyst is Dibutyltin dilaurate and increase the addition amount to improve the curing speed after processing and compounding. The leveling agent is acrylate copolymer polymer MODAFLOW Resin, and the light stabilizer is 2-(2'-hydroxy-5'methyl)-benzene Triazole (CHISORB P).

[0103] The basic formula of the present embodiment product is as follows (weight ratio):

[0104] Table 3 Examp...

Embodiment 3

[0110] The present embodiment polyol ester uses polyneopentyl glycol phthalate (molecular weight is 1000), polyethylene adipate (molecular weight is 1000), polyoxypropylene glycol (molecular weight is 400) , the weight ratio is set to 400:300:200. The equivalent ratio of isocyanate group to hydroxyl group in the formula is 1.65:1, the isocyanate is isophorone diisocyanate (IPDI), the antioxidant is hindered phenolic antioxidant CHINOX 1010, the catalyst is dibutyltin dilaurate, and the leveling agent is The agent is acrylate copolymer polymer MODAFLOW Resin, and the light stabilizer is 2-(2'-hydroxy-5'methyl)-benzotriazole (CHISORB P).

[0111] The basic formula of the present embodiment product is as follows (weight ratio):

[0112] Table 4 Example 3 product basic formula

[0113]

[0114]

[0115] Finally, perform a performance test, such as Figure 4 The infrared spectrogram analysis shown, followed by aging performance is shown in Table 5.

[0116] performance an...

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Abstract

The invention discloses a one-component solvent-free polyurethane adhesive for photovoltaic module back panel compounding and a preparation method of the polyurethane adhesive and belongs to the technical field of photovoltaic module back panels. The method comprises the following steps: by using one or multiple polyhydric alcohols and taking one or multiple diisocyanates as basic raw materials, matching a catalyst, a flatting agent, an antioxidant, a light stabilizer and other additives, and performing high temperature polymerization, thereby obtaining the polyurethane prepolymer. The productdisclosed by the invention belongs to one-component solvent-free polyurethane adhesives. Curing is performed without using a cross-linking agent, but cross-linking is realized by reacting NCO functional groups with reactivity at the tail end of molecular chains of resins and moisture. The product has solid content of 100% and does not contain any solvent, no solvent is used in the process, a drying tunnel is not needed for reducing the cost, and the security and environmental protection problems are solved. Moreover, the solvent-free polyurethane adhesive product produced by the method disclosed by the invention has excellent adhesive force, excellent weather resistance, dual-85 aging resistance and PCT accelerated aging performance on PET (Polyethylene Terephthalate), EVA (Ethylene-VinylAcetate), PVDF (Polyvinylidene Fluoride) fluororesin films and the like.

Description

technical field [0001] The invention relates to a single-component solvent-free polyurethane adhesive for compounding photovoltaic module backplanes and a preparation method thereof. It belongs to the technical field of solar photovoltaic backplanes. Background technique [0002] There are many kinds of polyurethanes. Polyurethanes with different uses and performance requirements can be prepared according to the types of polyols, diisocyanates, chain extenders, basic raw materials, molecular weights, differences in structure and functionality, as well as their respective ratios and synthetic routes. . Among them, the diisocyanates for preparing polyurethane mainly include TDI, MDI, PAPI, HDI, IPDI, etc. Polyols can be divided into two categories: polyether and polyester. Polyurethane synthesized from polyether polyols has excellent weather resistance and frost resistance. Excellent, the polyurethane synthesized from polyester polyol has excellent mechanical properties, wea...

Claims

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Application Information

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IPC IPC(8): C09J175/08C09J175/06C09J11/06C09J11/08C08G18/42C08G18/48C08G18/75
CPCC08G18/4018C08G18/4211C08G18/4238C08G18/4825C08G18/755C08L2201/08C08L2203/206C09J11/06C09J11/08C09J175/06C09J175/08C08L33/04C08K5/1345C08K5/3475
Inventor 林永欣许志明左成朵金雅明
Owner 高鼎精细化工(昆山)有限公司
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