Flexible circuit board base material based on quantum carbon base film and preparation method thereof

A flexible circuit board and carbon-based film technology, which is applied in the manufacture of printed circuits, the improvement of the metal adhesion of insulating substrates, printed circuits, etc., can solve the problems of poor thermal conductivity of FPC, increased Joule heating, circuit fusing, etc., and achieve thermal and electrical conduction Good performance, improved reliability, and controllable thickness

Active Publication Date: 2020-04-07
SHENZHEN DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the high concentration of CPU chips, the wiring width of the line is narrowed. Due to the increase of Joule heat generation, high temperature is generated, especially when a large amount of Joule heat is generated when a large current passes through the line. This will make the traditional The FPC prepared by the FCCL for the flexible printed circuit board substrate has the risk of circuit fusing due to the problem of poor thermal conductivity

Method used

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  • Flexible circuit board base material based on quantum carbon base film and preparation method thereof

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preparation example Construction

[0034] In an embodiment of the second aspect of the present invention, a method for preparing a quantum carbon-based film-based flexible circuit board substrate includes the following steps:

[0035] S1. Plasma modification treatment is carried out on the surface of the quantum carbon-based film, preferably argon plasma, but an acrylic acid graft layer is produced on the surface of the quantum carbon-based film through a grafting reaction;

[0036] S2. Depositing a PI film on the surface of the quantum carbon-based film by CVD chemical vapor deposition reaction.

[0037] The invention uses the quantum carbon-based film to replace the copper foil in the traditional FCCL to prepare a flexible printed circuit board (FPC) base material with high thermal conductivity and high conductivity. The quantum carbon-based film used in the present invention can be a flexible carbon-based film with high conductivity, super flexibility, high thermal conductivity and high frequency obtained by...

Embodiment 1

[0073] Raw materials:

[0074] 3,3’,4,4’-Biphenyltetracarboxylic dianhydride

[0075] m-phenylenediamine

[0076] Nitrogen (carrier / cleaning gas)

[0077] Quantum carbon-based film (thickness: 20μm)

[0078] steam

[0079] instrument:

[0080] CVD vapor deposition device (Finland)

[0081] PEO601 RTA rapid thermal annealing furnace (Germany)

[0082] Preparation steps:

[0083] S1: Argon plasma modification treatment on the surface of the quantum carbon-based film, the steps are as follows:

[0084] (1) Place the quantum carbon-based film in acetone solution or absolute ethanol, clean it with ultrasonic waves, and then vacuum dry it in a vacuum drying oven;

[0085] (2) Argon plasma treatment is carried out after the treatment is completed, the plasma treatment power is 70W, the working pressure is 70Pa, and the treatment time is 15min;

[0086] (3) After the surface of the quantum carbon-based film is modified by plasma, then chemical treatment is used to graft on th...

Embodiment 2

[0096] The difference from Example 1 is that this is PI prepared from monomer raw materials 2,3,3',4'-diphenyl ether tetraacid dianhydride and 3,3'-diaminodiphenyl ether in quantum carbon CVD vapor deposition on the surface of the base film, the deposition cycle and reaction conditions are: 2,3,3',4'-diphenyl ether tetraacid dianhydride gas pulse (deposition temperature: 170 ° C, pulse time: 3.0s)-N 2 (Purge time: 1.5-3.0s)-3,3’-Diaminodiphenyl ether gas pulse (deposition temperature: 150°C, pulse time: 2.0s)-N 2 (Purge time: 1.5-3.0s). All the other are with embodiment 1.

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Abstract

A flexible circuit board base material based on a quantum carbon base film comprises the quantum carbon base film and a PI film deposited and formed on the surface of the quantum carbon base film through chemical vapor deposition reaction, and the quantum carbon base film is subjected to plasma modification treatment and is provided with an acrylic acid grafting layer. The preparation method of the flexible circuit board base material based on the quantum carbon base film comprises the following steps that plasma modification treatment is conducted on the surface of the quantum carbon base film, and then the acrylic acid grafting layer is generated on the surface of the quantum carbon base film through a grafting reaction; and the PI film is deposited and formed on the surface of the quantum carbon base film through adoption of a CVD method. The PI film deposited on the surface of the quantum carbon base film through adoption of the CVD method to obtain the circuit board substrate, sothat the flexible circuit board base material has the advantages of being controllable in thickness, better in uniformity and surface evenness, free of solvent pollution or interference, capable of being deposited into the film on the surface of a complex structure and the like, the quantum carbon base film is used for replacing a traditional conductor copper foil layer, the quantum carbon base film is good in heat conduction and electric conduction performance, large in specific heat and good in heat resistance, and reliability is greatly improved.

Description

technical field [0001] The invention relates to the manufacture of a flexible printed circuit board (FPC), in particular to a flexible circuit board base material based on a quantum carbon-based film and a preparation method thereof. Background technique [0002] PI thin films have attracted much attention for their excellent high temperature resistance, mechanical strength, and chemical resistance. For example, they can be used as interlayer insulating dielectric materials in the microelectronics industry, or as gate insulating layers in all organic thin film transistors. At present, the manufacture of flexible copper clad laminate FCCL has become the largest application field of electronic grade PI film. [0003] FCCL is the processing substrate material of traditional flexible printed circuit board (FPC). Among them, FCCL without adhesive is also called two-layer flexible copper clad laminate (2L-FCCL), which is thin, light, reliable and flexible. Excellent features, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38H05K3/02H05K1/02
CPCH05K3/382H05K3/022H05K1/0209H05K1/028H05K2203/095
Inventor 刘萍谢凡张双庆李秋玉
Owner SHENZHEN DANBOND TECH
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