Epoxy structural adhesive and preparation method thereof

A technology of epoxy structural adhesive and epoxy resin, applied in the direction of epoxy resin adhesive, adhesive, adhesive type, etc., can solve the problems of large shrinkage, easy delamination, and lower glass transition temperature.

Pending Publication Date: 2021-02-09
深圳市安伯斯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the use of liquid nitrile rubber and plasticizer as toughening components, this high-temperature-resistant flexible adhesive achieves the flexibility and reinforcement of the colloid to a certain extent, but because these two components are compatible with epoxy resin Poor resistance, easy to delaminate during placement, and the two resins did not form a "sea island structure" when curing, which lowered the glass transition temperature, low strength under high temperature and high humidity, and poor impact resistance
[0005] Chinese patent CN104004483A discloses an epoxy adhesive with impact resistance, high toughness and high temperature resistance. The raw material composition is: A component includes: bisphenol A and 4,4-diaminodiphenyl in a weight ratio of 70:30 Methane tetraglycidyl amine resin mixed matrix, toughening agent, coupling agent KH560 and alumina filler; B component includes: reactive polyamide res...

Method used

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  • Epoxy structural adhesive and preparation method thereof
  • Epoxy structural adhesive and preparation method thereof
  • Epoxy structural adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0077] Synthesis of Aluminate Coupling Agent

[0078] In a four-necked flask equipped with a stirrer, a distillation tube, a gas inlet tube and an internal thermometer, first add 100 g of aluminum isopropoxide and 368.5 g of oleyl acetoacetate, heat the mixture to 80 ° C, and then add 50 drops / min A mixed solution consisting of 285g dioctyl phosphate and 100ml toluene was added dropwise at a speed of 2 The mild flowing gas was decompressed to remove the isopropanol and toluene solvent formed during the reaction. When the desired degree of conversion was achieved, the batch was cooled to 55°C and the pressure depressurized to remove the remaining volatiles. Finally The product mixture was then cooled to room temperature to obtain an aluminate coupling agent.

Embodiment 1

[0080] Preparation of component A:

[0081] 1) Add epoxy resin, diluent and toughening agent to the planetary high-speed mixer, keep vacuum, stir at a high speed of 1500 rpm until mixed evenly, and control the temperature not to exceed 65°C;

[0082] 2) Then add fillers, modifiers, and dispersants in sequence, and continue to stir evenly at a high speed of 250 rpm under vacuum;

[0083] 3) Finally, add the coupling agent and pigment under the protection of nitrogen, adjust the temperature of the circulating water bath to 40-45°C, keep the temperature of the material at 40°C, and stir in a high-speed vacuum at a speed of 500 rpm for 40 minutes.

[0084] 4) Then adjust the rotation speed of the planetary machine to 20 r / min for vacuum degassing for 20 minutes, then pass through a 10-micron stainless steel filter for packaging to obtain component A.

[0085] Preparation of component B:

[0086] 1) Add epoxy resin first under a nitrogen atmosphere, and heat up to 105-120°C for 2...

Embodiment 2

[0095] Preparation of component A:

[0096] 1) Add epoxy resin, diluent and toughening agent into the planetary high-speed mixer, keep vacuum, stir at a high speed of 1800 rpm until mixed evenly, and control the temperature not to exceed 65°C;

[0097] 2) Then add fillers, modifiers, and dispersants in sequence, and continue to stir evenly at a high speed of 300 rpm under vacuum;

[0098] 3) Finally, add coupling agent and pigment under the protection of nitrogen, adjust the temperature of the circulating water bath to 40-45°C, keep the temperature of the material at 40°C, and stir at a speed of 500-850 rpm for 50 minutes under high-speed vacuum.

[0099] 4) Then adjust the rotation speed of the planetary machine to 20-40 rpm for vacuum degassing for 30 minutes, then pass through a 10-micron stainless steel filter for packaging to obtain component A.

[0100] Preparation of component B:

[0101] 1) Add epoxy resin first under nitrogen atmosphere, and heat up to 105-120°C for v...

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Abstract

The invention discloses an epoxy structural adhesive which comprises a component A and a component B. The component A comprises epoxy resin. The component B comprises epoxy resin and a curing agent, the curing agent is polyetheramine, and the epoxy resin and the polyetheramine are subjected to an addition reaction in advance to form a chain extension pre-polymerized epoxy curing agent. According to the double-component epoxy structural adhesive, the polyetheramine is added into the component B to serve as a curing agent, and the curing agent and the epoxy resin form an epoxy curing agent, so that the curing agent is moderate in viscosity, retains flexible blocks of the polyetheramine, is high in activity at low temperature, can promote rapid curing of the epoxy resin at low temperature, and is good in water resistance and low in surface tension; the epoxy structural adhesive has the advantages of excellent mechanical properties and flexibility, high strength and favorable temperature resistance, and thus, has excellent impact resistance.

Description

technical field [0001] The invention relates to the technical field of thermosetting epoxy adhesives, in particular to an impact-resistant epoxy structural adhesive and a preparation method thereof. Background technique [0002] Structural adhesives are usually thermosetting resin compositions that replace or enhance conventional joining techniques such as screws, bolts, studs, staples, rivets, and metal fusion processes (e.g., welding, brazing, and soldering) . Structural adhesives are used in industries, electronic small parts and engineering structural parts, etc., and are required to have high mechanical strength and high impact resistance. [0003] In the trend of the automotive industry towards lightweight parts, electronic devices also use some heat-sensitive optical components. Structural adhesives need to show good operating time and curing speed, so two-component mixed-cured two-component is often used. Epoxy adhesives, different from one-component epoxy adhesive...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08C08G59/50
CPCC09J163/00C09J11/04C09J11/06C09J11/08C08G59/5013C08L2205/035C08K2003/2241C08L51/04C08L83/04C08K13/02C08K5/10C08K3/36C08K5/5435C08K3/22
Inventor 叶明浩范中元陈廷忠代阳
Owner 深圳市安伯斯科技有限公司
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