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Molybdenum-copper alloy surface electroplating method

A molybdenum-copper alloy and parts technology is applied in the field of electroplating on the surface of molybdenum-copper alloy, which can solve the problems affecting the bonding force of the coating, difficult removal, personal injury, etc., and achieves the effect of eliminating vacuum heat treatment, reducing energy consumption and improving production efficiency.

Active Publication Date: 2021-02-19
江苏源泉智能装备科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing electroplating process of molybdenum-copper alloy mainly has the following problems: 1. The oxide film is easy to form on the surface of molybdenum-copper alloy and is difficult to remove, and the substrate cannot be effectively activated before electroplating, thereby affecting the bonding force of the coating; 2. The existing The oxide film removal methods mainly include sandblasting, anodic etching and chromic acid treatment, etc., but the sandblasting method is only suitable for parts with simple shapes and large volumes, and is not suitable for parts with complex shapes and small volumes; Etching method is easy to cause over-corrosion of copper when processing molybdenum-copper alloy; chromic acid treatment method needs to use high content of chromic acid, the process is cumbersome, easy to cause environmental pollution and personal injury, and the yield is low
Long-term process practice has proved that direct plating of gold and silver on molybdenum-copper alloy substrates cannot obtain a coating with good adhesion

Method used

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Examples

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Effect test

Embodiment 1

[0029] A method for surface electroplating of a molybdenum-copper alloy, the electroplating process is as follows:

[0030] Step (1), degreasing: 500 pieces of molybdenum-copper alloy carriers (molybdenum 70%, copper 30%; specification: 14mm * 10mm * 1mm) are put into degreasing liquid, and degreasing liquid is to contain sodium carbonate 35g / L, An aqueous solution of 46g / L trisodium phosphate and 8g / L water glass, the temperature of the solution is 72-76°C, soaked for 30 minutes under the action of ultrasonic waves with an ultrasonic frequency of 25HZ and an ultrasonic current of 2A to completely remove the oil on the surface of the carrier;

[0031] Take out the carrier, wash it in flowing tap water for 5 seconds, and shake the carrier left and right, up and down during cleaning.

[0032] Step (2), pickling: the composition of pickling solution: nitric acid (63%) 90mL / L, sulfuric acid (98%) 420mL / L, hydrochloric acid (36%) 5mL / L; Carrier is put into pickling solution, The t...

Embodiment 2

[0043] A method for surface electroplating of a molybdenum-copper alloy, the electroplating process is as follows:

[0044] Step (1), degreasing: 100 pieces of molybdenum-copper alloy carriers (molybdenum 85%, copper 15%; specification: 24mm * 18mm * 1mm) are put into degreasing liquid (composition of degreasing liquid: sodium carbonate 33g / L, Trisodium phosphate 50g / L, water glass 9g / L), the solution temperature is 71-78°C, under the action of ultrasonic waves with an ultrasonic frequency of 25HZ and an ultrasonic current of 2A, soak for 30 minutes to completely remove the oil on the surface of the carrier;

[0045] Take out the carrier, wash it in flowing tap water for 5 seconds, and shake the carrier left and right, up and down during cleaning.

[0046] Step (2), pickling: the composition of pickling solution: nitric acid (63%) 90mL / L, sulfuric acid (98%) 415ml / L, hydrochloric acid (36%) 5ml / L; Carrier is put into pickling solution, The temperature of the solution is 24°C,...

Embodiment 3

[0057] A method for surface electroplating of a molybdenum-copper alloy, the electroplating process is as follows:

[0058] Step (1), degreasing: put 1000 pieces of molybdenum-copper alloy carriers (molybdenum 70%, copper 30%; specification: 4.1mm × 2.3mm × 0.2mm) into degreasing liquid (composition of degreasing liquid: sodium carbonate 30g / L, trisodium phosphate 50g / L, water glass 8g / L), the solution temperature is 72-76°C, under the action of ultrasonic waves with an ultrasonic frequency of 25HZ and an ultrasonic current of 2A, soak for 30 minutes to completely remove the oil on the surface of the carrier;

[0059] Take out the carrier, wash it in running tap water for 5 seconds, shake the carrier left and right, up and down during cleaning;

[0060] Step (2), pickling: the composition of pickling solution: nitric acid (63%) 90mL / L, sulfuric acid (98%) 420mL / L, hydrochloric acid (36%) 5mL / L; Carrier is put into pickling solution, The temperature of the solution is 22°C, a...

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Abstract

The invention discloses a molybdenum-copper alloy surface electroplating method. The method comprises the steps of oil removal, acid pickling, activation, special nickel plating, acidic chemical nickel plating and subsequent electroplating. According to the method, oil stains on the surface of molybdenum-copper alloy are completely removed through the oil removal procedure, an oxidation film on the surface of the molybdenum-copper alloy is completely removed through the acid pickling procedure and the activation procedure, and copper over-corrosion is avoided while the oxidation film of molybdenum is removed; a very thin complete nickel layer with good binding force is electroplated on the surface of the molybdenum-copper alloy through the special nickel plating procedure, then the thickness of the nickel layer is increased through the acidic chemical nickel plating procedure, atom diffusion of a molybdenum-copper material is prevented, and the binding force of subsequent gold platingand silver plating is guaranteed; and after the molybdenum-copper alloy is subjected to gold plating or silver plating, the binding force can meet the requirement, a gold plating layer or a silver plating layer has no bubbling or stripping phenomenon, and the problem that a metal layer is difficult to plate on molybdenum-copper alloy is solved. The method is suitable for parts with simple shapes and large sizes, and is suitable for parts with complex shapes and small sizes.

Description

technical field [0001] The invention belongs to the field of surface treatment, and relates to a method for electroplating the surface of a molybdenum-copper alloy. Through the method, a plating layer with good binding force can be obtained on the surface of the molybdenum-copper alloy. Background technique [0002] Molybdenum-copper alloy is a powder metallurgy material with excellent properties such as high electrical conductivity, high thermal conductivity, small expansion coefficient, good corrosion resistance, non-magnetic properties and good processing performance. What is especially valuable is that the thermal expansion coefficient, thermal conductivity, and electrical conductivity of the molybdenum copper material can be designed by adjusting the composition of the material, which brings great convenience to the application of the material. Molybdenum-copper alloys are widely used in metallurgy, machinery, petrochemical, national defense, aerospace, electronics and ...

Claims

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Application Information

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IPC IPC(8): C25D5/38C25D5/12C23C28/02C23G1/20C23G1/10C23C18/36C25D3/12C25D3/48
CPCC25D5/38C25D5/12C23C28/023C23G1/205C23G1/106C23C18/36C25D3/12C25D3/48
Inventor 许建伟
Owner 江苏源泉智能装备科技有限公司
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