Ultraviolet light chain type initiated self-reaction low-viscosity high-thickness full-curing glue

A self-reaction, ultraviolet light technology, applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve the problems of material reaction speed and material performance fluctuations, cumbersome operation steps, etc., to achieve exempt performance Fluctuation, good wetting performance, fast curing effect
CN113088239AActive Publication Date: 2021-07-09YANTAI UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
YANTAI UNIV
Publication Date
2021-07-09

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Abstract

The invention discloses an ultraviolet light chain type initiated self-reaction low-viscosity high-thickness full-curing glue. The ultraviolet curing glue is prepared from the following substances in parts by mass: 10 to 30 parts of polyurethane (methyl) acrylate, 0 to 10 parts of trifunctional / multifunctional (methyl) acrylate, 5 to 30 parts of bifunctional (methyl) acrylate, 50 to 80 parts of monofunctional (methyl) acrylate and 0.1 to 3.0 parts of photoinitiator. The ultraviolet curing glue is low in viscosity, easy to defoam, good in wettability, convenient to use, high in curing speed, moderate in heat release, high in test block transparency and good in surface state, is suitable for packaging of electronic products, and is particularly suitable for packaging detection of metallographic cold-embedded printed circuit boards needing rapid testing.
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Description

technical field

[0001] The invention belongs to the field of organic polymer encapsulation materials, and in particular relates to an ultraviolet light curing glue and its application in the field of metallographic cold mosaic. Background technique

[0002] In the field of printed circuit board (PCB) quality inspection, in order to find defects in the preparation process of PCB boards and problems with manufacturing process parameters, two-component epoxy resin-organic amine systems and transition metal-catalyzed unsaturated resins are commonly used Embedded packaging of the PCB board. In order to facilitate detection, it is required that the glue for encapsulating the PCB board has low viscosity and good wettability to the PCB board. After curing, the resin block obtained has less air bubbles, high transparency, moderate hardness, and is easy to polish.

[0003] The two-component epoxy resin-organic amine system has good comprehensive mechanical properties and low volume s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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