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Ultraviolet light chain type initiated self-reaction low-viscosity high-thickness full-curing glue

A self-reaction, ultraviolet light technology, applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve the problems of material reaction speed and material performance fluctuations, cumbersome operation steps, etc., to achieve exempt performance Fluctuation, good wetting performance, fast curing effect

Active Publication Date: 2021-07-09
YANTAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the operation steps of the unsaturated resin system are very cumbersome in actual use, and the reaction speed and material properties of the material often fluctuate greatly due to inaccurate weighing of the material.

Method used

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  • Ultraviolet light chain type initiated self-reaction low-viscosity high-thickness full-curing glue
  • Ultraviolet light chain type initiated self-reaction low-viscosity high-thickness full-curing glue
  • Ultraviolet light chain type initiated self-reaction low-viscosity high-thickness full-curing glue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] 10 parts of polyurethane methacrylate (molecular weight about 3000g / mol) synthesized from polytetrahydrofuran diol, hydroxyethyl methacrylate and isophorone diisocyanate, ethoxylated trimethylolpropane trimethacrylate 10 parts of ester, 30 parts of tricyclodecane dimethanol dimethacrylate, 50 parts of phenoxyethyl methacrylate, 30 parts of dicyclopentenyl methacrylate, 2.0 parts of photoinitiator benzoin dimethyl ether , 1.0 parts of 2,4,6-trimethylbenzoyl diphenylphosphine oxide, 0.6 parts of Tego931 defoamer (Evonik, Germany).

[0047] 1. Weigh the above components according to their mass composition, mix them, and let them stand for defoaming. At 25°C, its viscosity was tested to be 67mPa.s.

[0048] 2. Pour it into a polyethylene mold with a diameter of about 30mm and a height of 35mm, and control the actual height of the poured glue not to exceed 30mm. Under the irradiation of 1000W mercury lamps (2 pieces, with a wavelength of 350-450nm), measure the temperature...

Embodiment 2

[0056] Polyethylene glycol propylene glycol copolymerized glycol, 30 parts of polyurethane acrylate (molecular weight about 500g / mol) synthesized from hydroxyethyl acrylate and toluene diisocyanate, 5 parts of diethylene glycol diacrylate phthalate, acrylic acid 30 parts of isobornyl ester, 20 parts of N-vinyl caprolactam, 20 parts of hydroxyethyl acrylate, 0.05 parts of benzophenone, 0.05 parts of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, Junlei 8310 defoamer (Zhengzhou Junlei Chemical Industry) 0.1 part.

[0057] 1. Weigh the above components according to their mass composition, mix them, and let them stand for defoaming. At 25°C, its viscosity was tested to be 61mPa.s.

[0058] 2. Pour it into a polyethylene mold with a diameter of about 30mm and a height of 35mm, and control the actual height of the poured glue not to exceed 30mm. Under the irradiation of a 1000W mercury lamp (wavelength 350-450nm), measure the temperature at the center of the glue block with a t...

Embodiment 3

[0073] 15 parts of polyurethane methacrylate (molecular weight about 2000g / mol) synthesized from polybutylene adipate, hydroxyethyl methacrylate and diphenylmethane diisocyanate, 5 parts of propoxylated glycerin trimethacrylate Parts, 5 parts of 1,6-hexanediol dimethacrylate, 10 parts of triethylene glycol dimethacrylate phthalate, 35 parts of hydroxyethyl methacrylate, o-phenylphenoxyethyl methyl 30 parts of acrylic acid ester, 2.0 parts of 1-hydroxycyclohexyl phenyl ketone, 0.2 parts of ethyl 2,4,6-trimethylbenzoylphenyl phosphonate, Sago-1655 defoamer (Guangzhou Situ Source Chemical Co., Ltd.) 0.3 parts.

[0074] 1. Weigh the above components according to their mass composition, mix them, and let them stand for defoaming. At 25°C, its viscosity was tested to be 64mPa.s.

[0075] 2. Pour it into a polyethylene mold with a diameter of about 30mm and a height of 35mm, and control the actual height of the poured glue not to exceed 30mm. Under the irradiation of 45W LED lamp ...

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Abstract

The invention discloses an ultraviolet light chain type initiated self-reaction low-viscosity high-thickness full-curing glue. The ultraviolet curing glue is prepared from the following substances in parts by mass: 10 to 30 parts of polyurethane (methyl) acrylate, 0 to 10 parts of trifunctional / multifunctional (methyl) acrylate, 5 to 30 parts of bifunctional (methyl) acrylate, 50 to 80 parts of monofunctional (methyl) acrylate and 0.1 to 3.0 parts of photoinitiator. The ultraviolet curing glue is low in viscosity, easy to defoam, good in wettability, convenient to use, high in curing speed, moderate in heat release, high in test block transparency and good in surface state, is suitable for packaging of electronic products, and is particularly suitable for packaging detection of metallographic cold-embedded printed circuit boards needing rapid testing.

Description

technical field [0001] The invention belongs to the field of organic polymer encapsulation materials, and in particular relates to an ultraviolet light curing glue and its application in the field of metallographic cold mosaic. Background technique [0002] In the field of printed circuit board (PCB) quality inspection, in order to find defects in the preparation process of PCB boards and problems with manufacturing process parameters, two-component epoxy resin-organic amine systems and transition metal-catalyzed unsaturated resins are commonly used Embedded packaging of the PCB board. In order to facilitate detection, it is required that the glue for encapsulating the PCB board has low viscosity and good wettability to the PCB board. After curing, the resin block obtained has less air bubbles, high transparency, moderate hardness, and is easy to polish. [0003] The two-component epoxy resin-organic amine system has good comprehensive mechanical properties and low volume s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14
CPCC09J175/14
Inventor 郑耀臣乔程辉郭文玉李美娜徐硕安秀喆张新涛
Owner YANTAI UNIV
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