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A high-strength aging-resistant composite solder sheet and its preparation method

A composite welding, aging-resistant technology, applied in welding equipment, welding/cutting media/materials, manufacturing tools, etc., can solve the problems affecting the solderability interface reliability of solder sheets, poor product quality consistency, and high material costs , to achieve the effect of improving thermal aging performance and thermal migration resistance, improving the consistency of quality and performance, and improving strength and thermal aging resistance.

Active Publication Date: 2022-06-28
宁波宁理合勤能源科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing technology generally adopts methods such as nano-silver paste sintering, composite silver paste sintering, and adding reinforcing phase particles to traditional solder (such as patent CN201810361358.5, patent CN201810383172.X, patent CN201910384352.4, patent CN201610948850.3, etc.) Solder interconnect layer with higher strength and relatively good heat aging resistance, but this type of method has higher material cost and poor product quality consistency
Other methods (such as patent CN201710149734.X) that use foam metal to infiltrate zinc-based or tin-based solder and roll to prepare composite solder sheet, although a "supporting skeleton" with high strength is formed inside the solder sheet, which improves the solder sheet itself. Mechanical strength, but the foam metal itself is still diffusely distributed on the surface, which will inevitably affect the later solderability of the formed solder sheet and the interface reliability during service

Method used

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  • A high-strength aging-resistant composite solder sheet and its preparation method
  • A high-strength aging-resistant composite solder sheet and its preparation method
  • A high-strength aging-resistant composite solder sheet and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] To prepare nanowire suspension:

[0044]Weigh 0.2 g of copper-nickel nanowires with a diameter of 100 nanometers and a length of 10-nanometers, place the copper-nickel nanowires in 8 ml of ethanol solution, add 0.025 g of polyvinylpyrrolidone and 0.01 g of oleic acid, and ultrasonically disperse for 15 minutes .

[0045] The copper-nickel nanowires can be replaced with iron-based alloy nanowires, other copper-based alloy nanowires, nickel-based alloy nanowires, etc. In this embodiment, copper-nickel nanowires are used.

[0046] Preparation of double-coated titanium nitride nanopowder:

[0047] Weigh a certain quality of titanium nitride nanopowder with an average particle size of 150 nanometers after decontamination and dispersion treatment. The titanium nitride nanopowder can be replaced with aluminum oxide, silicon carbide, titanium carbide, diamond, etc. with high melting point and good thermal conductivity. Nano-scale powder, titanium nitride nano-powder is used i...

Embodiment 2

[0061] Example 2: Shear strength test of high-strength and aging-resistant composite solder sheets

[0062] The composite solder sheet of the present invention is used as the interconnecting solder, and the 5mm×5mm copper sheet is reflowed to form a Cu / solder / Cu interconnection structure. The Cu substrate can be replaced with other substrates such as Ni, Si, SiC, AlN, and gallium nitride. In this example, a Cu substrate was used, and the shear strength of the samples was tested by a DAGE shear force tester at room temperature. The solder in the control group was SAC305 solder, and 20 parallel samples were tested in both the experimental group and the control group.

[0063] Test results: The average shear strength of the Cu / solder / Cu interconnection structure prepared from the composite structure solder sheet of the present invention is significantly higher than that of the control sample (an increase of about 22.5%).

Embodiment 3

[0064] Example 3: Constant temperature thermal aging test

[0065] Both the experimental group and the control group also adopted the above Cu / solder / Cu interconnect structure, and were placed in a vacuum constant temperature environment of 100 °C and 120 °C for 484 hours of constant temperature thermal aging. During the experiment, at 0 hours, 169 hours, A sample was taken out from the experimental group and the control group at 324 hours and 484 hours, respectively, to observe the interfacial intermetallic compounds (Cu 6 Sn 5 and Cu 3 The average growth thickness of Sn) to judge the constant temperature and heat aging resistance of the solder layer.

[0066] Test results: the growth rates of the two interface intermetallic compounds of the Cu / solder / Cu interconnect structure prepared by the present invention are significantly lower than those of the control group under the aging conditions of 100°C and 120°C.

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Abstract

The invention discloses a high-strength aging-resistant composite solder sheet and a preparation method thereof, and relates to the technical field of solder sheets. A high-strength aging-resistant composite solder sheet includes: two solder sheets, and two solder sheets are arranged between the two solder sheets. A copper-nickel nanowire coating layer, and a composite solder paste layer is arranged between the two copper-nickel nanowire coating layers. Compared with the prior art, the beneficial effect of the present invention is that: aiming at the limitations of the prior art, the present invention significantly improves the quality and performance consistency of the solder sheet while reducing the cost of materials, and does not affect the solderability of the solder sheet. While improving the reliability of the solder sheet and the reliability of the service interface, the strength and thermal aging resistance of the solder sheet are simultaneously improved.

Description

technical field [0001] The invention relates to the technical field of solder sheets, in particular to a high-strength anti-aging composite solder sheet and a preparation method thereof. Background technique [0002] Power modules such as IGBTs are widely used in many fields such as smart grids and electric vehicles. A typical power module package structure usually contains two to three layers of solder with different melting points to achieve mechanical, thermal and electrical interconnections between components such as semiconductor chips, terminals, insulating substrates and metal backplanes. At present, with the continuous improvement of the integration degree of power modules, the thickness of each solder connection layer in the package structure is also continuously reduced, and due to the large difference in the thermal resistivity of different materials in the package structure, the modules generated during the service process. A large amount of Joule heat, usually ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/02B23K35/40
CPCB23K35/02B23K35/40
Inventor 陈光
Owner 宁波宁理合勤能源科技有限公司