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Printing ink hole plugging method for high-thermal-conductivity PCB (Printed Circuit Board)

A PCB board, high thermal conductivity technology, applied in the direction of printed circuit, printed circuit parts, electrical components, etc., can solve the problems of poor thermal conductivity, lack of ink plug hole method, easy heat accumulation and expansion, etc., to improve thermal conductivity and improve plug hole Excellent rate, acid and alkali corrosion resistance

Active Publication Date: 2022-07-05
SHENZHEN BANMING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Aiming at the problem that the existing high thermal conductivity PCB board lacks an applicable ink plugging method, the present invention provides an ink plugging method for a high thermal conductivity PCB board, in which the high thermal conductivity plugging resin ink is used to raise the temperature to 30-50°C Finally, ink plug holes are made on the high thermal conductivity PCB to ensure the plugging effect, thermal conductivity and other physical and chemical properties of the ink plug holes
[0009] At the same time, the present invention aims at the problem of poor thermal conductivity and easy heat accumulation and expansion in the existing plug hole resin ink in the high aspect ratio hole, and develops a high thermal conductivity plug with high thermal conductivity and heat resistance, high insulation and high thixotropy. Hole resin ink, suitable for ink plugging of high thermal conductivity PCB boards, can be used for processing PCB boards

Method used

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  • Printing ink hole plugging method for high-thermal-conductivity PCB (Printed Circuit Board)
  • Printing ink hole plugging method for high-thermal-conductivity PCB (Printed Circuit Board)
  • Printing ink hole plugging method for high-thermal-conductivity PCB (Printed Circuit Board)

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preparation example Construction

[0074] The preparation steps of the modified nano-powder are as follows: drying the preferred nano-powder at 100-120° C. for 30-60 min; then adding a continuous powder surface modifier. Then add a coupling agent to the inside, and the added coupling agent is 0.1-0.5% of the mass of the nano-powder. Preferably, the coupling agent is one of a silane coupling agent, an aluminate coupling agent, a titanate coupling agent, and a zirconium aluminate coupling agent. When the coupling agent is added, the advanced One or more of fatty acids and their salts, organic ammonium salts and other various types of surfactants, phosphate esters, unsaturated organic acids and water-soluble organic high polymers are added in combination. After thorough mixing, the modified nano-powder is obtained by cooling.

[0075] The preparation method of the modified micron powder is different from the preparation method of the modified nano-powder in that the added coupling agent is 0.5-1.0% of the mass of...

Embodiment 1

[0085] In parts by weight, the high thermal conductivity plugging resin ink includes:

[0086] 20 parts of epoxy resin

[0087] Glycidyl Reactive Diluent 30 parts

[0088] Latent curing agent 6 parts

[0089] Defoamer 0.01 part

[0090] 60 parts of modified inorganic powder;

[0091] Among them, the epoxy resin is a mixture of bisphenol A epoxy resin: bisphenol S type epoxy: phenol formaldehyde epoxy resin with a mass ratio of 5:2:3; glycidyl reactive diluent is triphenyl glycidyl ether-based methane : mixture of diglycidyl aniline mass ratio of 3:7; latent curing agent is a mixture of o-methylphenyl biguanide and diaminodiphenyl sulfone; modified inorganic powder is aluminum nitride modified by silane coupling agent The mixture with boron nitride, including 10 parts of modified nano powder and 50 parts of modified micron powder.

[0092]The preparation steps of the modified nano-powder are as follows: the nano-powder, that is, the mixture of nano-scale aluminum nitride a...

Embodiment 2

[0096] In parts by weight, the high thermal conductivity plugging resin ink includes:

[0097] 25 parts of epoxy resin

[0098] Glycidyl Reactive Diluent 30 parts

[0099] Latent curing agent 6 parts

[0100] Defoamer 0.01 part

[0101] 70 parts of modified inorganic powder;

[0102] Wherein, the epoxy resin is a mixture of bisphenol A epoxy resin: bisphenol S type epoxy resin: phenol formaldehyde epoxy resin mass ratio of 4:3:3; triphenyl glycidyl ether-based methane: diglycidyl aniline mass ratio of 3:7 mixture; latent curing agent is a mixture of o-methylphenyl biguanide and diaminodiphenyl sulfone; modified inorganic powder is a mixture of aluminum nitride and boron nitride modified by silane coupling agent, Among them, there are 10 parts of modified nano-powder and 60 parts of modified micro-powder.

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Abstract

The invention relates to the technical field of hole plugging resin of a circuit board, in particular to an ink hole plugging method of a high-thermal-conductivity PCB (printed circuit board). The printing ink hole plugging method for the high-thermal-conductivity PCB comprises the following steps of: heating high-thermal-conductivity hole plugging resin printing ink to 30-50 DEG C, and filling the high-thermal-conductivity hole plugging resin printing ink into a blind hole or a through hole of the high-thermal-conductivity PCB by adopting a vacuum hole plugging process or a silk-screen printing process; the high-thermal-conductivity plug hole resin ink is prepared from the following components in parts by weight: 20 to 40 parts of epoxy resin, 10 to 30 parts of glycidyl reactive diluent, 1 to 6 parts of latent curing agent, 0.1 to 1 part of curing accelerator, 0.01 to 0.3 part of defoaming agent and 40 to 70 parts of modified inorganic powder. The high-thermal-conductivity hole plugging resin ink is used for performing ink hole plugging on a high-thermal-conductivity PCB with a high aspect ratio hole, the hole plugging effect is good, the plugged hole is well combined with a copper surface after being cured, and the phenomena of cracking or layered expansion and the like are avoided; and the thermal conductivity and the surface platability of the PCB after hole plugging are good.

Description

technical field [0001] The invention relates to the technical field of plugging resin for circuit boards, in particular to a method for plugging ink holes of a high thermal conductivity type PCB board. Background technique [0002] In recent years, with the rapid development of electronic products, there are more and more High Density Interconnect Technology (HDI) designs in printed circuit boards (PCBs). This technology achieves PCB high-density interconnection, high reliability, ultra-thin multilayer and high reliability by designing blind buried vias and reducing line width and line spacing. [0003] In the PCB manufacturing process, the use of plug hole technology can obtain a larger wiring area, and at the same time can avoid damage to the outer layer. With the rapid development of high-density multilayer circuit board technology, from thin and light mobile devices to large-sized communication devices. The PCB board is getting thicker and thicker, the number of layers...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K1/02
CPCH05K3/0094H05K1/0204
Inventor 陈洪郝意蔡小松
Owner SHENZHEN BANMING SCI & TECH CO LTD