Method and apparatus for non-conductively interconnecting integrated circuits

a non-conductive interconnecting, integrated circuit technology, applied in logic circuit coupling/interface arrangement, semiconductor/solid-state device testing/measurement, instruments, etc., can solve the problems of difficult otherwise, difficult rework and bonding yield, and extremely dense packages, so as to reduce turnaround time and cost, the effect of reducing the cost of package engineering
US20050002448A1Inactive Publication Date: 2005-01-06SUN MICROSYSTEMS INC
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Patent Information

Authority / Receiving Office
US Ā· United States
Current Assignee / Owner
SUN MICROSYSTEMS INC
Publication Date
2005-01-06
Estimated Expiration
Not applicable Ā· inactive patent

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Abstract

A method and apparatus for constructing, repairing and operating modular electronic systems utilizes peripheral half-capacitors (i.e., conductive plates on the outside of the modules) to communicate non-conductively between abutting modules. Such systems provide lower cost, improved testability / repairability and greater density than conventional modular packaging techniques, such as printed circuit boards and multi-chip modules. The non-conductive interconnection technique of the invention can be applied to all levels in the packaging hierarchy, from bare semiconductor dies to complete functional sub-units. Numerous exemplary systems and applications are described.
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Description

FIELD OF THE INVENTION

[0001] Packaging Technologies

[0002] The present invention relates generally to the field of electronic and microelectronic packaging and, more particularly, to a multichip package, a method for assembling, testing and repairing systems so packaged, and a method for communicating between circuits so packaged, via capacitive coupling. Of particular interest are digital systems, meaning systems which contain important constituents that operate according to the rules of multistate or binary logic. BACKGROUND OF THE INVENTION

[0003] Electronic systems are usually implemented as hierarchical packages of components. Passive or active electronic elements, such as resistors and transistors, and their wiring are typically combined into memory or logic units, which are then combined into circuits and devices, which are combined into larger functional units, and so forth up to the level of a system.

[0004] Each higher level of hierarchy grants the designer greater produc...

Claims

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