Plating solution, conductive material, and surface treatment method of conductive material

Inactive Publication Date: 2006-10-19
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0024] The plating solution of the present invention contains a copper salt and an organic phosphonic acid compound, so for example when using the plating solution of the present invention and an anode containing copper to form a protective film comprised of copper on the surface of a conductive material, it is possible to form a protective film superior in adhesion and improve the corrosion resistance and heat resistance of the conductive material.
[0025] Further, the plating solution of the present invention contains, in addition to t

Problems solved by technology

However, such Sm—Co-based rare earth permanent magnets have the problem of using as materials the expensive Sm and Co, so end up becoming high in cost.
However, such permanent magnets include as main ingredients easily oxidizable rare earth elements and iron, so have relatively low corrosion resistances, are degraded in performance, and have problems in production variance.
However, this publication uses copper cyanide for the plating bath, so has the problems of a weak adhesion between the magnet body and the plating film and a lack of reliability.
However, this publication uses a copper pyrophosphate plating bath, so has the problem that the R—Fe—B-based permanent magnet with the greater tendency for ioniza

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example

Example 1

[0088] A sintered body having the composition of 14Nd-1Dy-7B-78Fe (numerals indicate atomic ratio) produced by the powder metallurgy method was heat treated in the Ar atmosphere at 600° C. for 2 hours, worked to a size of 50×50×5 (mm), and barrel polished to round the edges and obtain a permanent magnet body.

[0089] Next, a sample of this permanent magnet body was washed by an alkaline degreasing solution, then activated at its surface by a 3% nitric acid solution, then washed well by pure water. The sample of this permanent magnet body was then formed on its surface with a protective film by the method explained below.

[0090] First, as the plating bath for forming the protective film, copper sulfate in an amount of 0.2 mol / liter, aminotrimethylene phosphonic acid in 0.6 mol / liter, ammonium sulfate in 0.01 mol / liter, potassium hydroxide in 2 mol / liter, and brightening agents were used to construct a pH 8.0 1-liter plating bath at 60° C.

[0091] Next, this plating bath was u...

Example

Example 2

[0095] Except for using a plating bath (pH=9.0) containing copper phosphate in an amount of 0.3 mol / liter, diethylene triamine pentamethylene phosphonic acid in 1.0 mol / liter, sodium carbonate in 0.5 mol / liter, sodium hydroxide in 2 mol / liter, and brightening agents, the same procedure was followed as in Example 1 to plate 100 batches and obtain 100 samples. For each of the obtained samples, the same procedure was followed as in Example 1 to evaluate the corrosion resistance, heat resistance and protective film adhesion. As a result, in both the first batch sample and 100th batch sample, no points of rust or blisters could be observed. Further, the rate an drop of characteristics was 0.01% in each case and, further, the peeling force was 50 MPa or more in each case, i.e., the results were good.

Example

Example 3

[0096] Except for using a plating bath (pH=12) containing copper (II) acetate in an amount of 0.5 mol / liter, diethylene triamine pentamethylene phosphonic acid in 0.1 mol / liter, alanine in 0.5 mol / liter potassium hydroxide in 2 mol / liter, and brightening agents, the same procedure was followed as in Example 1 to plate 100 batches and obtain 100 samples. For each of the obtained samples, the same procedure was followed as in Example 1 to evaluate the corrosion resistance, heat resistance and protective film adhesion. As a result, in both the first batch sample and 100th batch sample, no points of rust or blisters could be observed, Further, the rate in drop of characteristics was 0.01% in each case and, further, the peeling force was 50 MPa or more in each case, i.e., the results were good.

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Abstract

A plating solution including a copper salt, an organic phosphonic acid compound, and at least one compound or ions selected from an amine, α-amino acid, ammonium ions, carbonic acid ions, carboxylic acid ions, dicarboxylic acid ions, sulfuric acid ions, and thiosulfuric acid ions and a method of treating the surface of a conductive material using this plating solution.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a plating solution, a method of treating the surface of a conductive material using this plating solution, and a conductive material treated on its surface by this surface treatment method. [0003] 2. Description of the Related Art [0004] Permanent magnets, which is one type of conductive material, are being widely used for motors and actuators of various types of equipment. As such permanent magnets, Sm—Co-based rare earth permanent magnets obtained by powder metallurgy are being mass produced due to their relatively high performance. However, such Sm—Co-based rare earth permanent magnets have the problem of using as materials the expensive Sm and Co, so end up becoming high in cost. [0005] Among the rare earth, the smaller atomic weight rare earth elements such as cerium (Ce), praseodymium (Pr), and neodymium (Nd) are present more abundantly than samarium (Sm) and are relatively low...

Claims

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Application Information

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IPC IPC(8): C25D3/38
CPCC25D3/38C25D7/001H01F41/26H01F41/026
Inventor SAKAMOTO, TAKESHIMORIKAWA, HIROYASUYAMAMOTO, YASUYUKIFUKUDA, KEIICHI
Owner TDK CORPARATION
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