Process for producing double-layer flexible cover copper plate

A technology for flexible copper-clad laminates and substrate surfaces, which is applied to the improvement of metal adhesion of insulating substrates, coatings, and liquid chemical plating. The effect of high bond strength and high conductivity

Inactive Publication Date: 2010-11-17
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method can improve the adhesion between the copper foil and the substrate to a certain extent, but the direct result is that the surface of the substrate is uneven, resulting in the surface flatness of the copper clad laminate being tens to hundreds of microns; the current microelectronic integrated circuit line width It has reached the level of 100 nanometers and below, and the copper clad laminate prepared by the above method is obviously not applicable

Method used

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  • Process for producing double-layer flexible cover copper plate

Examples

Experimental program
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Effect test

Embodiment 1

[0021] A polyethylene terephthalate substrate with a thickness of 50 microns and an area of ​​20 cm × 30 cm was washed with deionized water, dried, and placed in a concentration of 0.1% γ-aminoethylaminopropyl trimethyl soak in an ethanol solution of oxysilane for 1 hour, take it out, rinse with ethanol, and dry to obtain a surface-hydroxylated polyethylene terephthalate substrate.

[0022] The surface hydroxylated polyethylene terephthalate substrate is placed in the acetone solution of 1% 2-mercaptoethyltrimethoxysilane, soaked for 3 hours, taken out, rinsed with acetone, dried, A polyethylene terephthalate substrate with surface thiol was obtained.

[0023] Dissolve 4g of copper sulfate, 10g of sodium potassium tartrate, 8g of sodium citrate, 6g of disodium edetate, 6g of dimethylamine borane, and 1.5g of sodium hydroxide in 500mL of deionized water. After the dissolution is complete, add deionized water , until the volume of the solution is 1L, the copper electroless plat...

Embodiment 2

[0026] A polytrimethylene terephthalate substrate with a thickness of 50 microns and an area of ​​20 cm × 30 cm was washed with deionized water, dried, and placed in methanol with a concentration of 0.5% 3-aminopropyltrimethoxysilane. soak in the solution for 1.5 hours, take it out, rinse with ethanol, and dry to obtain a surface-hydroxylated polytrimethylene terephthalate substrate.

[0027] Put the surface hydroxylated polytrimethylene terephthalate substrate in a butanone solution with a concentration of 0.1% 2-mercaptoethyltriethoxysilane, soak for 6 hours, take it out, rinse it with butanone, and dry it , to obtain a surface mercapto-polytrimethylene terephthalate substrate.

[0028] Dissolve 8g of copper sulfate, 5g of sodium potassium tartrate, 12g of sodium citrate, 4g of disodium edetate, 8g of dimethylamine borane, and 2g of sodium hydroxide in 500mL of deionized water. After the dissolution is complete, add deionized water. When the volume of the solution is 1 L, t...

Embodiment 3

[0031] Wash a polybutylene terephthalate substrate with a thickness of 50 microns and an area of ​​20 cm × 30 cm with deionized water, dry it, and place it in a concentration of 1% γ-aminoethylaminopropyl three Soak in an acetone solution of ethoxysilane for 2 hours, take it out, rinse with acetone, and dry to obtain a surface-hydroxylated polybutylene terephthalate substrate.

[0032] The surface hydroxylated polybutylene terephthalate substrate is placed in a tetrahydrofuran solution of 5% 3-mercaptopropyltrimethoxysilane, soaked for 4.5 hours, taken out, rinsed with tetrahydrofuran, and dried. A surface-mercaptolated polybutylene terephthalate substrate was obtained.

[0033] Dissolve 6g of copper sulfate, 7.5g of sodium potassium tartrate, 10g of sodium citrate, 8g of disodium edetate, 6g of dimethylamine borane, and 1g of sodium hydroxide in 500mL of deionized water. After the dissolution is complete, add deionized water , until the volume of the solution is 1L, the copp...

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Abstract

The invention belongs to the field of micronano-electronic material, and relates to a method for preparing a two-layer flexible copper-clad lamination. The preparation method obtains the two-layer flexible copper-clad lamination through modifying surface of a flexible polyester substrate and self-assembling a chemical copper plating, and comprises the following steps: hydroxylating and sulfhydrylating surface of the flexible polyester substrate, and self assembling the chemical copper plating to obtain the flexible copper-clad lamination. A copper film and the substrate are connected through a chemical bond, and are generated in situ, so the prepared copper-clad lamination has the advantages of lightness and thinness, high tractility, high bonding strength, high conductivity, high flatness, acid resistance, alkali resistance, organic solvent resistance and the like, and can be widely applied to flexible circuit boards and flexible electronic devices, such as a flexible field effect transistor, a flexible solar cell, a flexible light emitting diode and the like.

Description

technical field [0001] The invention belongs to the technical field of micro-nano electronic materials, and in particular relates to a preparation method of a two-layer flexible copper-clad laminate. Background technique [0002] Flexible copper clad laminate (Flexible Copper Clad Lamination, FCCL) is the basic material for the production of flexible printed circuit boards, so the production process of flexible copper clad laminates has a great impact on the performance and appearance of electronic products. The traditional FCCL is mainly formed by bonding the insulating substrate and the metal copper foil with an adhesive, so it is called a three-layer flexible copper clad laminate (3L-FCCL). However, the flexible copper-clad laminate has low heat resistance, poor dimensional stability, and a thick base material. The two-layer flexible copper clad laminate is thinner, has higher flexibility, heat resistance and other excellent properties, and can meet the requirements of h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/40C23C18/20H05K3/38
Inventor 吕银祥
Owner FUDAN UNIV
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