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Flexible metal substrate connected with back electrode of solar battery and fabrication method thereof

A technology of solar cells and flexible metals, applied in circuits, electrical components, climate sustainability, etc., can solve the problems of changing the metering ratio of elements in the absorbing layer, difficult to control the diffusion amount and uniformity, and unfavorable for large-scale industrial production , to achieve the effect of reducing material cost and manufacturing cost, improving battery production yield, and short preparation time

Active Publication Date: 2011-09-28
HUNAN YONGSHENG NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, Cu will diffuse into the absorbing layer, thereby changing the stoichiometric ratio of elements in the absorbing layer and affecting the film-forming quality of the absorbing layer.
The diffusion amount and uniformity of Cu are difficult to control, which is not conducive to large-scale industrial production
[0010] To sum up, the existing barrier layer and back electrode preparation equipment are costly and consume a lot of energy, and the cracking and shedding of each layer of the substrate, barrier layer, and back electrode reduce the yield of the battery; the insulating barrier layer makes it possible to Expensive and precise etching equipment is required when batteries are connected in series, and the increase in etching process also increases the defective rate of batteries

Method used

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  • Flexible metal substrate connected with back electrode of solar battery and fabrication method thereof
  • Flexible metal substrate connected with back electrode of solar battery and fabrication method thereof
  • Flexible metal substrate connected with back electrode of solar battery and fabrication method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0044] A stainless steel strip with a thickness of 0.2 mm and a roughness of 0.2 μm was selected as the substrate.

[0045] Pre-plating surface pretreatment on the steel strip, that is, degreasing, pre-nickeling treatment. Oil removal is high-temperature chemical oil removal, sodium hydroxide 70g / L, sodium carbonate 40g / L, sodium phosphate 25g / L, sodium silicate 10g / L, temperature 80°C, oil removal for 3 minutes. After degreasing is complete, rinse the surface of the sample with distilled water, and then put it into a pre-nickel plating tank for pre-plating with a layer of nickel to improve the bonding force. Nickel chloride is 240g / L, concentrated hydrochloric acid is 120ml / L, and the current density is 3A. / dm 2 , pre-plating for 1 min.

[0046] Put the treated steel strip into a copper plating tank, and electroplate a 2 micron thick copper plating layer on one side. Copper plating conditions, copper sulfate 180g / L, concentrated sulfuric acid 55g / L, chloride ion 70mg / L, e...

Embodiment 2

[0050] A stainless steel strip with a thickness of 0.10 mm and a roughness of 0.3 was selected as the substrate.

[0051] Surface pretreatment of steel strip before plating. Processing method is identical with embodiment 1.

[0052] Put the treated steel strip into a copper plating bath, and electroplate a 1 micron thick copper plating layer on one side. Plating solution composition copper sulfate 200g / L, concentrated sulfuric acid 60g / L, chloride ion 45mg / L, ethylenediaminetetraacetic acid 65g / L, temperature 30°C, current density 4A / dm 2 .

[0053] A multi-layer nickel coating with a total thickness of 6 microns was electroplated on the copper coating by means of ultrasonic electroplating in a Watts nickel plating solution without brightener. In the continuous electroplating production line, the nickel plating layer with multi-layer structure is obtained by increasing the number of nickel plating tanks. In this example, 5 watt nickel plating tanks are set, and the plating...

Embodiment 3

[0056] A stainless steel strip with a thickness of 0.10 mm and a roughness of 0.2 was selected as the substrate.

[0057] Surface pretreatment of steel strip before plating. The method is the same as in Example 1.

[0058] Put the treated steel strip into a copper plating tank, and electroplate a 3 micron thick copper plating layer on one side. Copper plating conditions, copper sulfate 200g / L, concentrated sulfuric acid 65g / L, chloride ion 50mg / L, ethylenediaminetetraacetic acid 60g / L, temperature 30°C, current density 3A / dm 2 .

[0059]Electroplate 2 layers of nickel plating on top of the copper plating, with a total thickness of 3 microns. The nickel coating is prepared in a nickel sulfamate bath. In this example, 3 plating tanks are set, and the plating solution in each plating tank is the same, the plating solution formula: nickel sulfamate 380g / L, nickel chloride 10g / L, boric acid 40g / L, process parameters: current density 4A / dm 2 , pH value 4.0, temperature 55°C, an...

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Abstract

The invention discloses a flexible metal substrate connected with a back electrode of a solar battery and a fabrication method thereof. The flexible metal substrate has a structure made of stainless steel strip / copper / nickel / nickel-molybdenum alloy, wherein a nickel layer and a nickel-molybdenum alloy coating layer serve as diffusion barrier layers which are both multi-layer coating layers; and the mass content of molybdenum in the nickel-molybdenum alloy coating layer in the diffusion barrier layers is gradually increased from 10% to 80% layer by layer along the growth direction of the coating layer. Therefore, the diffusion of copper and Fe element in the steel strip can be effectively prevented, no new harmful elements are introduced, and the nickel-molybdenum alloy with high molybdenum content can enhance the bonding force between the substrate and a back electrode (Mo layer). Meanwhile, a Cu layer serves as a main current conduction layer, so that the Mo layer is only used as theback contact layer capable of forming good ohmic contact with an absorption layer. The flexible metal substrate used as the substrate of a CIGS (copper indium gallium selenide) solar battery can greatly lower the requirement on the thickness of the Mo layer, and the flexible substrate described in the invention can be manufactured continuously with low cost and high efficiency on a continuous electroplating production line.

Description

technical field [0001] The invention relates to a flexible metal substrate connected to the back electrode of a solar battery, and a preparation method for sequentially preparing a current main conduction layer and a multilayer diffusion barrier layer on the metal substrate by using a low-cost tape-and-roll process. Background technique [0002] Under the background of the energy crisis, solar cells have become a hot spot in the research of alternative energy sources. Among them, thin-film solar cells with chalcopyrite phase (including solar cells such as copper indium selenide, copper indium sulfur, and copper indium gallium selenide, hereinafter referred to as CIGS) thin film solar cells have stable performance and strong radiation resistance. It is the first of all kinds of thin-film solar cells, with a wide spectral response range, and its output power is higher than that of any other type of solar cells under the light intensity of rainy days. It is known internationall...

Claims

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Application Information

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IPC IPC(8): H01L31/02H01L31/0352H01L31/18C25D5/12C25D3/12C25D3/38C25D3/56
CPCY02P70/50
Inventor 潘俊安向奎刘晓铷尹业文向阳郭立波
Owner HUNAN YONGSHENG NEW MATERIALS
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