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Method for preparing composite brush plated deformation line diamond wire saw

A technology of diamond wire sawing and electric brush plating, which is applied in the direction of cutting tools, electrolytic coatings, and manufacturing tools of sawing machine devices, and can solve problems such as low deposition speed and production efficiency, high cost of diamond wire saws, and decreased cutting performance of wire saws. Achieve low cost, reduced surface defects, and less internal defects

Inactive Publication Date: 2011-10-19
长沙和谦新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the electroplated diamond wire saw still has the following disadvantages: the defect of the baseline and the residual tensile stress; the stress and defects of the coating (such as bubbles, pits, pinholes); the coating has a small holding force on the diamond; the residual tensile stress of the wire saw; Poor chip removal performance; low deposition rate and production efficiency
These disadvantages make the cost of the diamond wire saw high, the abrasive material falls off during the cutting process, and the wire saw suddenly breaks, resulting in a decrease in the cutting performance of the wire saw and a short service life.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029]The 35 μm surface metallized diamond and 90 μm yttrium oxide were ultrasonically cleaned with ethanol solution, the ultrasonic frequency was 25kHz, the cleaning time was 30min and 20min respectively, and then cleaned 10 times with distilled water respectively, and dried for later use. The 0.3mm steel wire is used as the baseline, the baseline is used as the cathode, the brush plating pen is used as the anode, and the anode uses graphite electrodes as the inner core, and is wrapped with filter paper, degreased cotton, chemical fiber and polyester cotton cloth from the inside to the outside, and the concentration is 8%. The ethoxylated alkyl sodium sulfate is used to clean and decontaminate the baseline. The process parameters are: positive polarity, voltage 12V, temperature 35°C, flow rate 1m / min, and then use deionized water to clean; then use ammonium sulfate with a concentration of 5% to Baseline activation treatment, process parameters: reverse polarity, voltage 8V, fl...

Embodiment 2

[0031] The 20 μm diamond and 80 μm titanium nitride were ultrasonically cleaned with acetone solution, the ultrasonic frequency was 20 kHz, and the cleaning time was 40 min and 30 min respectively, and then washed 15 times with distilled water, and dried for later use. The 0.25mm stainless steel wire is used as the baseline, the baseline is used as the cathode, the electric brush plating pen is used as the anode, and the anode is made of a platinum-iridium electrode as the inner core. 12% fatty alcohol polyoxyethylene ether for baseline cleaning and decontamination, process parameters: positive polarity, voltage 10V, temperature 40°C, flow rate 1.2m / min, and then use deionized water to clean; then use 8% lemon Baseline activation treatment with acid, process parameters: reverse polarity, voltage 10V, flow rate 1m / min, and then wash with deionized water. Pre-brush metal nickel to the baseline, with the baseline as the cathode, and the brush plating pen as the anode, the ingredi...

Embodiment 3

[0033] The 40 μm surface metallized diamond and 150 μm silicon oxide were ultrasonically cleaned with ethanol solution, the ultrasonic frequency was 35 kHz, and the cleaning time was 20 min and 20 min respectively, and then were cleaned 8 times with distilled water, and dried for later use. The 0.5mm molybdenum wire is used as the baseline, the baseline is used as the cathode, and the brush plating pen is used as the anode. % coconut oil fatty acid diethanolamide to clean and decontaminate the baseline, process parameters: positive polarity, voltage 15V, temperature 25°C, flow rate 1.5m / min, and then use deionized water to clean; then use 4% silicic acid to clean Baseline activation treatment, process parameters: reverse polarity, voltage 12V, flow rate 1.2m / min, and then rinse with deionized water. Pre-brush nickel metal to the baseline, with the baseline as the cathode, and the brush plating pen as the anode, the ingredients in the pre-brush plating solution: nickel chloride...

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PUM

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Abstract

A method for preparing a composite brush plated deformation line diamond wire saw, comprising the following steps of: preparing materials, selecting diamond or surface metallized diamond and nonconductive free particles, ultrasonically washing, using distilled water to repeatedly wash and bake; taking a straight line metal wire with the diameter of 0.1-2 mm as a cathode and an electric brush plating pen as an anode, washing the metal wire, pre-brush plating the metal wire, and then washing with deionized water; electric brush plating an amorphous state plating layer, taking pre-brushed plated metal wire as a cathode and the electric brush plating pen as the anode, and electric brush plating the amorphous state plating layer to obtain the diamond wire saw; and deforming the diamond wire saw through a deformer, thermally processing to obtain a latter deformation line diamond wire saw. The preparation technology has a simple device, high production efficiency, and recycle use of plating solution; and the produced wire saw has few shortcoming, a good performance and a long service life.

Description

technical field [0001] The invention relates to a preparation method of a diamond wire saw, in particular to a preparation method of a diamond wire saw with a deformed wire after composite brush plating. Background technique [0002] With the development of industry, hard and brittle materials are widely used in various fields. Hard and brittle materials include silicon crystals, gemstones, quartz crystals, ceramics, etc. Their high hardness and high brittleness bring certain difficulties to processing. The cutting of hard and brittle materials is the key procedure of its processing. The new technology and equipment of cutting processing are constantly developing, among which the wire saw cutting technology is developing rapidly. According to the different usage forms of abrasives, wire saws can be divided into two types: free abrasive wire saws and fixed abrasive wire saws, among which there are two types of fixed abrasive wire saws: resin bond and metal bond. By comparin...

Claims

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Application Information

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IPC IPC(8): C25D15/00C25D5/06B23D61/18B28D1/12
Inventor 不公告发明人
Owner 长沙和谦新材料科技有限公司
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