A kind of method for preparing complex surfactant/la-ni-mo-w co-deposition coating on copper substrate
A technology of surfactant and copper matrix is applied in the field of preparing compound surfactant/La-Ni-Mo-W co-deposition coating, which can solve the problem of no introduction of rare earth elements and surfactants, poor coating stability and chemical activity , low hydrogen evolution overpotential and other problems, to achieve the effect of simple preparation method, high corrosion resistance and high chemical activity
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Embodiment 1
[0023] The specification of the copper substrate is: 50mm×20mm×3mm.
[0024] ①Polishing of copper sheet: Use 400#, 800#, 1200#, 2000# metallographic sandpaper to polish the copper sheet in turn to remove the oxide layer on the surface of the copper sheet. Then rinse with deionized water and set aside.
[0025] ② Degreasing of copper sheet: put the copper sheet into 100ml sodium hydroxide solution with a concentration of 20wt%, and ultrasonically treat it at 55°C for 15 minutes to remove oil. Then rinse with deionized water and set aside.
[0026] ③ Etching of the copper sheet: Put the copper sheet into 100ml of nitric acid solution with a concentration of 30wt%, treat it at 30°C for 4 minutes, then rinse it repeatedly with deionized water, and set it aside.
[0027] ④ Copper sheet activation: Put the copper sheet into 100ml hydrochloric acid solution with a concentration of 10wt%, treat it at 20°C for 7 minutes, then rinse it repeatedly with deionized water, and set it aside...
Embodiment 2
[0034] The specification of the copper substrate is: 50mm×20mm×3mm.
[0035] ①Polishing of copper sheet: Use 400#, 800#, 1200#, 2000# metallographic sandpaper to polish the copper sheet in turn to remove the oxide layer on the surface of the copper sheet. Then rinse with deionized water and set aside.
[0036] ② Degreasing of copper sheet: put the copper sheet into 100ml sodium hydroxide solution with a concentration of 20wt%, and ultrasonically treat it at 55°C for 15 minutes to remove oil. Then rinse with deionized water and set aside.
[0037] ③ Etching of the copper sheet: Put the copper sheet into 100ml of nitric acid solution with a concentration of 30wt%, treat it at 30°C for 4 minutes, then rinse it repeatedly with deionized water, and set it aside.
[0038] ④ Copper sheet activation: Put the copper sheet into 100ml hydrochloric acid solution with a concentration of 10wt%, treat it at 20°C for 7 minutes, then rinse it repeatedly with deionized water, and set it aside...
Embodiment 3
[0045] The specification of the copper substrate is: 50mm×20mm×3mm.
[0046] ①Polishing of copper sheet: Use 400#, 800#, 1200#, 2000# metallographic sandpaper to polish the copper sheet in turn to remove the oxide layer on the surface of the copper sheet. Then rinse with deionized water and set aside.
[0047] ② Degreasing of copper sheet: put the copper sheet into 100ml sodium hydroxide solution with a concentration of 20wt%, and ultrasonically treat it at 55°C for 15 minutes to remove oil. Then rinse with deionized water and set aside.
[0048] ③ Etching of the copper sheet: Put the copper sheet into 100ml of nitric acid solution with a concentration of 30wt%, treat it at 30°C for 4 minutes, then rinse it repeatedly with deionized water, and set it aside.
[0049] ④ Copper sheet activation: Put the copper sheet into 100ml hydrochloric acid solution with a concentration of 15wt%, treat it at 20°C for 7 minutes, then rinse it repeatedly with deionized water, and set it aside...
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