A kind of method for preparing complex surfactant/la-ni-mo-w co-deposition coating on copper substrate

A technology of surfactant and copper matrix is ​​applied in the field of preparing compound surfactant/La-Ni-Mo-W co-deposition coating, which can solve the problem of no introduction of rare earth elements and surfactants, poor coating stability and chemical activity , low hydrogen evolution overpotential and other problems, to achieve the effect of simple preparation method, high corrosion resistance and high chemical activity

Active Publication Date: 2018-03-09
SHANGHAI INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Nowadays, electrodeposited Ni-Mo-W alloy has been widely concerned for its high catalytic activity, low hydrogen evolution overpotential and excellent wear and corrosion resistance, and also due to the stable Ni-Mo-W coating Due to the disadvantages of poor performance, serious hydrogen evolution in the preparation process, poor stability and chemical activity of the coating, it is urgently needed to be improved.
At present, there are many methods to improve the activity and stability of the coating, but there is no research on the introduction of rare earth elements and surfactants into the electrodeposition process

Method used

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  • A kind of method for preparing complex surfactant/la-ni-mo-w co-deposition coating on copper substrate
  • A kind of method for preparing complex surfactant/la-ni-mo-w co-deposition coating on copper substrate
  • A kind of method for preparing complex surfactant/la-ni-mo-w co-deposition coating on copper substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The specification of the copper substrate is: 50mm×20mm×3mm.

[0024] ①Polishing of copper sheet: Use 400#, 800#, 1200#, 2000# metallographic sandpaper to polish the copper sheet in turn to remove the oxide layer on the surface of the copper sheet. Then rinse with deionized water and set aside.

[0025] ② Degreasing of copper sheet: put the copper sheet into 100ml sodium hydroxide solution with a concentration of 20wt%, and ultrasonically treat it at 55°C for 15 minutes to remove oil. Then rinse with deionized water and set aside.

[0026] ③ Etching of the copper sheet: Put the copper sheet into 100ml of nitric acid solution with a concentration of 30wt%, treat it at 30°C for 4 minutes, then rinse it repeatedly with deionized water, and set it aside.

[0027] ④ Copper sheet activation: Put the copper sheet into 100ml hydrochloric acid solution with a concentration of 10wt%, treat it at 20°C for 7 minutes, then rinse it repeatedly with deionized water, and set it aside...

Embodiment 2

[0034] The specification of the copper substrate is: 50mm×20mm×3mm.

[0035] ①Polishing of copper sheet: Use 400#, 800#, 1200#, 2000# metallographic sandpaper to polish the copper sheet in turn to remove the oxide layer on the surface of the copper sheet. Then rinse with deionized water and set aside.

[0036] ② Degreasing of copper sheet: put the copper sheet into 100ml sodium hydroxide solution with a concentration of 20wt%, and ultrasonically treat it at 55°C for 15 minutes to remove oil. Then rinse with deionized water and set aside.

[0037] ③ Etching of the copper sheet: Put the copper sheet into 100ml of nitric acid solution with a concentration of 30wt%, treat it at 30°C for 4 minutes, then rinse it repeatedly with deionized water, and set it aside.

[0038] ④ Copper sheet activation: Put the copper sheet into 100ml hydrochloric acid solution with a concentration of 10wt%, treat it at 20°C for 7 minutes, then rinse it repeatedly with deionized water, and set it aside...

Embodiment 3

[0045] The specification of the copper substrate is: 50mm×20mm×3mm.

[0046] ①Polishing of copper sheet: Use 400#, 800#, 1200#, 2000# metallographic sandpaper to polish the copper sheet in turn to remove the oxide layer on the surface of the copper sheet. Then rinse with deionized water and set aside.

[0047] ② Degreasing of copper sheet: put the copper sheet into 100ml sodium hydroxide solution with a concentration of 20wt%, and ultrasonically treat it at 55°C for 15 minutes to remove oil. Then rinse with deionized water and set aside.

[0048] ③ Etching of the copper sheet: Put the copper sheet into 100ml of nitric acid solution with a concentration of 30wt%, treat it at 30°C for 4 minutes, then rinse it repeatedly with deionized water, and set it aside.

[0049] ④ Copper sheet activation: Put the copper sheet into 100ml hydrochloric acid solution with a concentration of 15wt%, treat it at 20°C for 7 minutes, then rinse it repeatedly with deionized water, and set it aside...

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Abstract

The invention discloses a method for preparing a compound surfactant / La-Ni-Mo-W codeposited coating on a copper matrix. The method comprises the following steps: pretreating a pure copper sheet by polishing, deoiling and etching; and carrying out electroplating under thermostatic water bath conditions by using the copper sheet as a cathode and a platinum-plated metal titanium screen as an anode, thereby obtaining the compound surfactant / La-Ni-Mo-W codeposited coating. The compound surfactant and rare-earth element lanthanum (La) are added into the nickel (Ni)-molybdenum (Mo)-tungsten (W) plating solution to prepare the codeposited coating; and the obtained compound surfactant / La-Ni-Mo-W codeposited coating has the advantages of uniform thickness, high hardness, favorable wear resistance, favorable corrosion resistance, high stability and high hydrogen evolution activity.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a method for preparing a composite surfactant / La-Ni-Mo-W co-deposition coating on a copper substrate. Background technique [0002] Electroplating (electrodeposition) is the process of using the principle of electrolysis to reduce the cations of the plated metal on the surface of the workpiece to be plated and to plate a thin layer of other metals or alloys on the surface of some metals, so that the surface of the metal or other materials can be attached. The process of one layer of metal film can prevent metal oxidation (such as rust), improve wear resistance, conductivity, light reflection, corrosion resistance (copper sulfate, etc.) and enhance the appearance. With the advancement of science and technology, a single metal coating can no longer meet the needs of society. Composite electroplating (also known as dispersed electroplating) is a composite coating in which so...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/56C25D5/34
CPCC25D3/56C25D5/36
Inventor 蔺华林付宁冯晨萁蒋继波韩生
Owner SHANGHAI INST OF TECH
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