Adhesive used for high-heat resistance leadless low-dielectric copper-clad plate and preparation method thereof

A copper-clad laminate and low-dielectric technology, which is applied in the adhesive and preparation field of high heat-resistant lead-free low-dielectric copper-clad laminate, can solve the problem of long curing time, high curing temperature, and high material cost. problems, to achieve the effect of improving dielectric properties and heat and humidity resistance, high heat resistance and chemical resistance, and reducing hydroxyl content

Inactive Publication Date: 2017-02-08
NANYA NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the actual application process, when the acid anhydride curing agent is used with epoxy resin, although the dielectric properties of the resin can be improved, the curing temperature is high, the curing time is long, and the processability is poor, which leads to resin and epoxy resin. The adhesion between copper foils is poor; at the same time, the glass transition temperature of the prepared copper clad laminate is also low
[0004] When cyanate ester is used alone as epoxy curing agent, the application in electronic products can guarantee Higher transmission rate and transmission efficiency, but the manufacturability, toughness and moisture resistance of the epoxy resin composition prepared by it are poor, and the price of cyanate ester is relatively expensive, and the cost of materials prepared by it is relatively high, to a certain extent reduces its scope of application

Method used

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  • Adhesive used for high-heat resistance leadless low-dielectric copper-clad plate and preparation method thereof
  • Adhesive used for high-heat resistance leadless low-dielectric copper-clad plate and preparation method thereof
  • Adhesive used for high-heat resistance leadless low-dielectric copper-clad plate and preparation method thereof

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Experimental program
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Embodiment 1～3 and comparative example 1～3

[0053] An adhesive suitable for high heat resistance lead-free low dielectric copper clad laminates. The main raw materials are low dielectric epoxy resin, modified polymeric anhydride curing agent, cyanate ester curing agent and active ester curing agent. Agents, brominated flame retardants, inorganic fillers, organic solvents and toughening agents.

[0054] material name Example 1 Example 2 Example 3 Comparative example 1 Comparative example 2 Comparative example 3 Low Dielectric Epoxy 18 17 19 18 21 20 Modified polymeric anhydride 15 16 17 18 16 ---- Cyanate Curing Agent 12 13 12 12 ---- 16 Active ester curing agent 3 4 2 ---- 12 12 Brominated Flame Retardants 16 16 16 16 16 16 Silane 0.18 0.15 0.15 0.18 0.15 0.16 metal curing accelerator 0.02 0.02 0.02 0.01 ---- 0.02 Amine Accelerator 0.02 0.01 0.01 ---- 0.02 0.02 imidazole accelerator 0.01 0.01 0.01 0.01 0...

Embodiment 4

[0077] The adhesive for high heat-resistant lead-free low-dielectric copper-clad laminates is prepared from the following components and raw materials in parts by weight:

[0078] Low dielectric epoxy resin 70, modified polymeric anhydride 40, cyanate ester curing agent 40, active ester curing agent 40, brominated flame retardant 50, silane 1, metal curing accelerator 0.1, amine accelerator 0.1, imidazole accelerator 0.1, inorganic filler 60, toughening agent 8.

[0079] The low-dielectric epoxy resin used is a mixture of biphenyl epoxy resin and naphthalene ring epoxy resin, and the modified polymeric anhydride is a terpolymer formed by modifying styrene-maleic anhydride copolymer with aromatic amine compounds , The weight average molecular weight is 2000, the cyanate ester curing agent is a bisphenol type cyanate ester curing agent, the weight average molecular weight is 500, and the active ester curing agent is selected from active ester curing agents containing naphthalene...

Embodiment 5

[0085] The adhesive for high heat-resistant lead-free low-dielectric copper-clad laminates is prepared from the following components and raw materials in parts by weight:

[0086] Low dielectric epoxy resin 20, modified polymeric anhydride 15, cyanate ester curing agent 5, active ester curing agent 5, bromine-containing flame retardant 10, silane 0.05, metal curing accelerator 0.001, amine accelerator 0.001, imidazole accelerator 0.005, inorganic filler 10, toughening agent 1.

[0087] The low-dielectric epoxy resin used is naphthylene ether type epoxy resin, the modified polymeric anhydride is XQR-147 resin produced by Dow Chemical in the United States, and the cyanate-based curing agent is bis(4-cyanate- 3,5-dimethylphenyl) methane, weight average molecular weight 700, active ester curing agent is active ester containing dicyclopentadiene biphenol structure. The metal-based curing accelerator is zinc acetylacetonate iron octoate, the amine-based accelerator is 2,4,6-tris(di...

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Abstract

The invention relates to an adhesive used for a high-heat resistance leadless low-dielectric copper-clad plate and a preparation method thereof. The adhesive comprises the following components in parts by weight: 15-70 parts of low dielectric epoxy resin, 15-40 parts of modified polymerized acid anhydride, 5-40 parts of a cyanate esters curing agent, 2-40 parts of an active esters curing agent, 10-50 parts of a bromine-containing fire retardant, 0.05-1.000 parts of silane, 0.001-0.1 parts of a metals curing accelerator, 0.001-0.1 parts of an amines promoter, 0.005-0.1 parts of an imidazoles promoter, 10-60 parts of an inorganic filling material, and 1-8 parts of a flexibilizer. Compared with the prior art, the copper-clad plate has the advantages of high heat resistance, low water absorption, low dielectric loss and excellent resistance to heat and humidity.

Description

technical field [0001] The invention relates to an adhesive, in particular to an adhesive used for high heat-resistant lead-free and low-dielectric copper-clad laminates and a preparation method thereof. Background technique [0002] The 21st century will become a video era, and various electronic products with multiple functions and diversifications are increasingly becoming an indispensable part of people's lives. The information carrying capacity of electronic products is gradually increasing, and the signal processing speed is also continuously improving. Electronic signals are required to have a high transmission rate in the printed circuit board and its loaded components. In order to solve the problem of concentrated heat loss and difficulty in dissipation caused by the thinning and high-speed intensification of electronic products, the substrate material is required to have Lower dielectric loss tangent to reduce signal loss and heat generation. At the same time, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J135/06C09J11/04C09J11/06
CPCC09J163/00C08L2201/02C08L2201/08C08L2203/20C08L2205/025C08L2205/03C09J11/04C09J11/06C08L63/00C08L35/06C08K13/02C08K5/098C08K5/17C08K5/3445C08K2003/282C08K3/36C08K3/38C08K5/03
Inventor 密亚男粟俊华张东包欣洋
Owner NANYA NEW MATERIAL TECH CO LTD
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