A surface treatment method for high-purity metal sputtering target

A metal sputtering and surface treatment technology, applied in heat treatment furnaces, heat treatment equipment, furnaces, etc., can solve problems such as easy corrosion, high risk, and difficult operation, and achieve stress and dislocation elimination, low material loss, and universal sex high effect

Active Publication Date: 2018-06-19
GRIKIN ADVANCED MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In order to eliminate the surface hardening layer of the target, researchers have carried out a lot of work. In the patent CN101700616, the surface of the target is processed. During the processing, alcohol spray is used to improve the smoothness of the target through polishing. Since alcohol is flammable, this method is highly dangerous. ; In the patent US6749103, the target material is polished after machining, and then pickled and corroded. This method requires pickling solution. The target material is easily corroded to the target back plate material during the acid solution soaking process, and the operation is difficult and will Pollution of the environment; Patent WO2008067150 uses magnetron sputtering equipment to sputter the surface of the target to eliminate the hardened layer on the surface of the target. This method uses a specific sputtering machine to sputter the target, which is not universal

Method used

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  • A surface treatment method for high-purity metal sputtering target
  • A surface treatment method for high-purity metal sputtering target
  • A surface treatment method for high-purity metal sputtering target

Examples

Experimental program
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Effect test

Embodiment 1

[0030] (1) Use a diamond knife with higher hardness to precisely machine the surface of the cobalt target, control the finishing feed and machining speed, the feed amount is controlled below 0.5mm, the machining speed of the machine tool is controlled at 200 rpm, and the surface after machining Roughness≤0.8μm;

[0031] (2) The surface of the target material obtained in step (1) is ground with a wire drawing cloth, so that the surface of the target material forms diffuse emission and reduces the surface reflectance; cleans the surface of the target material to prevent surface contamination from affecting the heat treatment quality;

[0032] (3) Under vacuum conditions, the carbon dioxide laser machine uses the lap reciprocating scanning method to scan the surface of the target material obtained in step (2). The power of the laser machine is 2kW, and the target material is inclined 15° during the scanning process to prevent the beam reflected from the surface from burning the la...

Embodiment 2

[0036] Steps (1) and (2) are with embodiment 1;

[0037] (3) Under vacuum conditions, the electron beam is used to scan the sputtering surface of the metal target, and the power density of the electron beam spot is controlled at 2kW / cm when the surface is heated. 2 , the heating rate is 100°C / s, the temperature is heated to 420°C, and the holding time is 10s, so that the metal surface is heated to above the recrystallization temperature. During the scanning process, the spiral scanning method is adopted, the scanning speed is 40mm / s, and a target material with a diameter of Φ440mm is used, and the scanning process takes about 5 minutes. Rapid recrystallization occurs on the surface of the target material, eliminating the work hardening layer on the surface of the material.

Embodiment 3

[0039] Steps (1) and (2) are with embodiment 1;

[0040] (3) Under vacuum conditions, halogen lamps are used to rapidly heat the sputtering surface of the metal target. The heating method is the overall irradiation of the target surface. The heat treatment time is affected by the irradiation range of the halogen lamp. It takes about 3 minutes to irradiate a target with a diameter of Φ440mm. Recrystallization occurs on the surface of the target material to eliminate the work hardening layer on the surface of the material.

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Abstract

The invention belongs to the technical field of preparation and processing of a target material, and particularly relates to a surface treatment method of a high pure metal sputtering target material. The surface treatment method comprises the following steps: the target material is firstly subjected to surface precision machining, surface grinding and surface cleaning and then subjected to rapid surface heat treatment by adopting a continuous wave laser heat treatment method, an electron beam scanning method or noncoherent broadband frequency light source method, a hardened layer on the surface of the target material recrystallizes through the skin effect generated by rapid heat treatment, stress and dislocation in the hardened layer is eliminated, and a recrystallization texture basically consistent with the matrix is obtained. The surface treatment method is simple in process, high in speed, high in universality, suitable for target materials of different sizes, free of material pollution during the preparation process, low in material loss and environment friendly.

Description

technical field [0001] The invention belongs to the technical field of target preparation and processing, and particularly relates to a surface treatment method for a high-purity metal sputtering target. Background technique [0002] Metal sputtering targets used in semiconductor integrated circuits (ICs) always introduce hardened layers during machining (such as turning, grinding, mechanical polishing), especially cobalt targets, titanium targets, tantalum targets, nickel targets commonly used in integrated circuits The target and its alloy target, due to the high hardness of the material and the large size of the product, will wear the tool during the surface turning process, and the cutting ability will weaken after the tool wear and passivation, and a large number of dislocations and Surface roughness and hardness increase. The hardened layer on the surface of the material increases the work function of metal atoms on the surface of the target during sputtering, resulti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C21D9/00
CPCC21D9/0068
Inventor 罗俊锋徐国进丁照崇李勇军崔佳熊晓东万小勇陈明
Owner GRIKIN ADVANCED MATERIALS
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