Leadless high-heat resistance glue solution for producing copper-clad plates

A high heat-resistant, copper-clad laminate technology, applied in the direction of layered products, lamination, lamination equipment, etc., can solve the problems of high production cost, insufficient toughness, low peel strength, etc., to achieve good product performance and reduce energy consumption , the effect of good machinability

Active Publication Date: 2017-10-13
建滔电子材料(江阴)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the board cured by the phenolic resin system has the advantages of heat resistance, because the material is too hard and brittle, and the toughness i

Method used

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  • Leadless high-heat resistance glue solution for producing copper-clad plates
  • Leadless high-heat resistance glue solution for producing copper-clad plates
  • Leadless high-heat resistance glue solution for producing copper-clad plates

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0035] Example 1:

[0036] A preparation method of 4-(N-maleimide)phenol glycidyl ether containing imide ring epoxy monomer, the steps of which include:

[0037] a) Add 5.39 parts of maleic anhydride dissolved in acetone to a flask equipped with a constant pressure dropping funnel; add 8.6 parts by mass of p-bromoaniline dissolved in an appropriate amount of acetone into the constant pressure dropping funnel, and drip into the bottle at the temperature of ice water bath After the addition is complete, react at room temperature overnight; stop the reaction, filter with suction, collect the filter cake, and place it in a vacuum oven to dry to obtain the intermediate product N-(4-bromophenyl) maleamic acid.

[0038] b) Take 11.11 parts by mass of the dried product, appropriate amount of toluene and DMF, and 1.0 part by mass of p-toluenesulfonic acid into the reflux reaction device with a water trap, and raise the temperature to the reflux temperature of toluene; react for about 4h, The...

Example Embodiment

[0040] Example 2:

[0041] A preparation method of FR-4 copper clad laminate adapted to lead-free manufacturing process, the steps include:

[0042] materials

[0043] Put the above-mentioned materials into the shearing kettle according to the ratio, and add the solvent DMF and acetone to adjust into a glue with a solid content of about 65%. The glue is formed at 283S / 171℃, and the viscosity is coated with four cups of 38S.

[0044] The cured sheet is made by impregnating the above glue with E-type glass fiber cloth, which is made into FR-4 copper clad sheet according to the common process in the industry. The main properties of the sheet are shown in Table 1.

Example Embodiment

[0045] Example 3:

[0046] materials

[0047] Put the above-mentioned materials into the shearing kettle according to the proportion, and add the solvent DMF and methyl ethyl ketone to adjust into a glue with a solid content of about 63%. The glue is formed at 305S / 171℃, and the viscosity is coated with four cups of 33S.

[0048] The cured sheet is made by impregnating the above glue with E-type glass fiber cloth, which is made into FR-4 copper clad sheet according to the common process in the industry. The main properties of the sheet are shown in Table 1.

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PUM

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Abstract

The invention relates to a leadless high-heat resistance glue solution for producing copper-clad plates. Main raw materials of the glue solution include 30-60 parts of low brominated epoxy resin, 10-30 parts of high brominated epoxy resin, 5-10 parts of tetrafunctional epoxy resin, 20-40 parts of 4-(N-maleimido)phenol glycidyl ether, 2.5-4 parts of dicyandiamide, 0.05-0.2 parts of a curing accelerator, 20-50 parts of an inorganic filler and 0.5-2 parts of a silane coupling agent KH560, wherein the 4-(N-maleimido)phenol glycidyl ether is prepared from maleic anhydride, p-bromoaniline and glycidol. The FR-4 CCL copper-clad plates made by using the glue solution have excellent comprehensive performances and meet requirements of high-end PCB.

Description

Technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a glue solution used in the production of high heat resistance (FR-4) copper clad laminates adapted to a lead-free manufacturing process. Background technique [0002] Due to the implementation of the EU RoHS directive, the global electronics industry has already entered the era of lead-free soldering. In lead-free soldering, the melting point of the solder used is higher than that of lead solder by 30-40℃, and the soldering time above the melting point is about 50 seconds longer. Therefore, the heat received by the board during the soldering process increases greatly, which requires copper clad laminates Must have better heat resistance. The glass transition temperature of traditional FR-4 copper clad laminates is only about 130°C, and the thermal decomposition temperature is generally only 300-310°C. The heat resistance is low. Although it can be used in general elect...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K3/36C08K5/5435C08K3/22C08K3/34C08J5/24C08J5/04B32B37/12B32B37/06B32B37/10B32B38/08
CPCB32B37/06B32B37/10B32B37/12B32B38/08B32B2037/1269C08J5/043C08J5/24C08J2363/00C08K2003/2224C08K2003/2227C08K2003/3045C08L63/00C08L2201/08C08L2205/025C08L2205/035C08K3/36C08K5/5435C08K3/22C08K3/34C08K13/02C08K3/346C08K3/30
Inventor 高兴元
Owner 建滔电子材料(江阴)有限公司
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