Molecular sieve-containing alumina hydrate composition and shaped body, preparation method and application, catalyst and preparation method

Abstract

The invention discloses a hydrated alumina composition and its preparation method, molded body and application. The composition contains hydrated alumina, BETA molecular sieve, ZSM type molecular sieve and a compound with at least two proton acceptor sites. The combination The value of the object is below 5. The invention also discloses a catalyst with hydrogenation catalysis using the shaped body formed of the hydrated alumina composition as a carrier, a preparation method and a hydrocracking method. The present invention uses hydrated alumina wet gel as the starting material to prepare a molded body with higher strength, omits the step of drying the hydrated alumina wet gel, simplifies the overall process flow, and reduces the overall operating energy consumption. Dust pollution caused by using pseudo-boehmite dry glue powder as raw material is avoided, which greatly improves the working environment. The shaped body prepared from the hydrated alumina composition serves as a supported catalyst and exhibits higher catalytic activity in hydrocracking of hydrocarbon oil.

Description

technical field [0001] The present invention relates to the technical field of alumina forming, in particular, the present invention relates to a hydrated alumina composition containing molecular sieves and a preparation method thereof, and the present invention also relates to a hydrated alumina formed body and a hydrated alumina formed from the hydrated alumina composition. Alumina molded body, the present invention further relates to a catalyst with hydrogenation catalysis using the molded body formed from the hydrated alumina composition as a carrier, a preparation method thereof, and a hydrocracking method using the catalyst. Background technique [0002] In the traditional method, the alumina formed body containing BETA molecular sieve and ZSM type molecular sieve, especially the γ-alumina formed body containing BETA molecular sieve and ZSM type molecular sieve molecular sieve, because of its good pore structure, suitable specific surface and High thermal stability, of...

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Problems solved by technology

[0014] (1) Pseudo-boehmite that has not been completely dried has strong viscosity, is difficult to transfer, and easily causes secondary dust pollution;

[0015] (2) Drying starts from the surface. The drying of the wet solid product separated from the mixture obtained from the gelling reaction is incomplete drying, so there is a sandwich biscuit phenomenon, that is, the surface of part of the pseudo-boehmite is dried (that is, the dried surface is substantially free of free water), while the interior is still wet (that is, for the non-dried interior, the content of free water is basically maintained at the level before drying), since the surface is dried, Therefore, hard particles are formed. When peptizing agent and / or binder are added to this incompletely dried pseudo-boehmite and kneaded, the hard particles formed during the drying process are in the process of extrusion. It is easy to cause blockage and affect production efficiency;

[0016] (3) It is difficult to stably control the dry base of pseudo-boehmite. The instability of the dry base will cause great interference to the molding process, making the molding process very unstable, resulting in an increase in the amount of unqualified products and low production efficiency;

[0017] (4) CN103769118A adopts a conventional molding process when molding, yet because the dry basis (35%-50%) of the pseudo-boehmite it adopts is far lower than the conventional dry basis content (about 70%), that is The water content is high, and there is basically no extrusion pressure during the extrusion molding process. Therefore, the carrier obtained after the extrudate is dried and roasted has basically no mechanical strength. As long as a little external force is applied, it will be pulverized and has no possibility of industrial application. sex, which is the biggest problem facing the technology

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