Preparation method of high-molecular graphene modified epoxy resin

A technology of graphene modification and epoxy resin, which is applied in the preparation of modified epoxy resin and the preparation of polymer graphene modified epoxy resin, which can solve the problems of poor tolerance, impact resistance, electrical conductivity and Poor thermal conductivity and other problems, to achieve the effect of improving heat resistance, strong penetration, and prolonging the service life

Inactive Publication Date: 2019-05-17
苏州博瑞达高分子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Epoxy resin (EP), as a commonly used resin matrix, has excellent adhesive properties, mechanical strength, heat resistance and dielectric properties, but it contains a large amount of epoxy groups after curing, and the crosslinking density is too high. The resulting products are brittle, and have poor impact resistance, electrical conductivity and thermal conductivity, which leads to coatings, construction plastics, rubber products, etc., when they are used outdoors to withstand the test of weather, such as light, cold and heat, wind and rain, bacteria, etc. The comprehensive damage caused by etc., its tolerance is poor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The preparation method of the polymer graphene modified epoxy resin provided by the present embodiment comprises the following components by weight ratio: graphene 5-10, epoxy resin 60-80, poly-n-butyl acrylate 15-20, ortho-phenyl Diformic anhydride 5-9, azobisisobutyronitrile 3-6, diallyl phthalate 2-4, polyglycidyl methacrylate 5-15, resorcinol bisglycidyl ether 28- 43. Urea-formaldehyde melamine resin 17-29, EDTA10-15, CTBN13-15, silicone coupling agent 6-13, aminomethyl propanol 5-8, water 60-90, carbon powder 4-12, aluminum silicate powder 13-15, antimony trioxide 10-15, dispersant 5-10, defoamer 3-5 and disinfectant 2-5.

[0020] In this embodiment, CTBN is preferably liquid carboxy-terminated nitrile rubber or polyurethane, CTBN includes acrylonitrile and silicon dioxide, and the organic silicon coupling agent is γ-aminopropyltriethoxysilane or diethylenetriaminopropyltrimethyl Oxysilane.

[0021] In this embodiment, the graphene is nano-graphite particles, mic...

Embodiment 2

[0023] The preparation method of the polymer graphene modified epoxy resin provided in this embodiment comprises the following components by weight ratio: graphene 8, epoxy resin 72, poly-n-butyl acrylate 18, phthalic anhydride 6, Azodiisobutyronitrile 4, diallyl phthalate 3, polyglycidyl methacrylate 10, resorcinol bisglycidyl ether 30, urea-formaldehyde melamine resin 20, EDTA13, CTBN14, silicone coupling agent 8. Aminomethyl propanol 7, water 80, carbon powder 8, aluminum silicate powder 14, antimony trioxide 11.

Embodiment 3

[0025] The preparation method of the polymer graphene modified epoxy resin provided by this embodiment comprises the following components by weight ratio: The preparation method of the polymer graphene modified epoxy resin provided by this embodiment comprises the following components by weight ratio Parts: graphene 9, epoxy resin 75, poly(n-butyl acrylate) 17, phthalic anhydride 8, azobisisobutyronitrile 6, diallyl phthalate 4, polyglycidyl methacrylate 13. Resorcinol bisglycidyl ether 35, urea-formaldehyde melamine resin 24, EDTA14, CTBN15, silicone coupling agent 11, aminomethyl propanol 5, water 77, carbon powder 11, aluminum silicate powder 13, trioxide Antimony 13, dispersant 7, defoamer 4 and disinfectant 4.

[0026] In the above-mentioned embodiment, by graphene modified epoxy resin, take into account the advantages of both, improve various performance indicators, graphene has a large surface specific area, plus the molecular level dispersion of graphene, can be combin...

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PUM

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Abstract

The invention discloses a preparation method of high-molecular graphene modified epoxy resin, and belongs to the technical field of epoxy resin. The high-molecular graphene modified epoxy resin is prepared from the following components in parts by weight: 5-10 parts of graphene, 60-80 parts of epoxy resin, 15-20 parts of n-butyl polyacrylate, 5-9 parts of phthalic anhydride, 3-6 parts of azodiisobutyronitrile, 2-4 parts of diallyl phthalate, 5-15 parts of polyglycidyl methacrylate, 28-43 parts of diglycidyl resorcinol ether, 17-29 parts of urea-formaldehyde melamine resin, 10-15 parts of EDTA,13-15 parts of CTBN, 6-13 parts of an organosilicone coupler, 5-8 parts of aminomethyl propanol, 60-90 parts of water, 4-12 parts of carbon powder, 13-15 parts of aluminum silicate powder, and 10-15parts of antimonous oxide. Through combination of the graphene and the epoxy resin, the advantages of the graphene and the epoxy resin are considered, the heat conducting, toughening and abrasion resisting performance of a compound is improved, and the purpose of improving the weather resistance of the compound is achieved.

Description

technical field [0001] The invention relates to a method for preparing a modified epoxy resin, in particular to a method for preparing a polymer graphene modified epoxy resin, which belongs to the technical field of epoxy resin. Background technique [0002] Graphene is a carbon atom with sp 2 The hybrid orbitals form a hexagonal two-dimensional carbon nanomaterial with a honeycomb lattice. [0003] Graphene has excellent optical, electrical, and mechanical properties, and has important application prospects in materials science, micro-nano processing, energy, biomedicine, and drug delivery, and is considered to be a revolutionary material in the future. [0004] In 2004, two-dimensional graphene was successfully prepared, which became another major breakthrough in the field of carbon material research after fullerene and carbon nanotubes. Graphene has excellent optical properties, electromagnetic properties, thermal conductivity and mechanical properties, and can be widel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L33/08C08L33/14C08L61/30C08K13/02C08K3/04C08K3/34C08K3/22
Inventor 薛明
Owner 苏州博瑞达高分子材料有限公司
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