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A heat-resistant pressure sensor material and its preparation method

A pressure sensor and heat-resistant technology, applied in the measurement of the property force of the piezoelectric resistance material, the measurement of fluid pressure, the measurement of fluid pressure by changing the ohmic resistance, etc., can solve the problem of large structure size, inability to provide electrical output, quality To improve the heat resistance and anti-aging performance, improve the overall performance and reduce the dielectric loss

Active Publication Date: 2021-10-29
中电鼎康(天长)科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Pressure sensor is the most commonly used sensor in industrial practice. It is widely used in various industrial automatic control environments, involving water conservancy and hydropower, railway transportation, intelligent buildings, production automatic control, aerospace, military industry, petrochemical, oil wells, electric power, ships, machine tools In many industries such as pipelines and pipelines, traditional pressure sensors are mainly mechanical structural devices, and the deformation of elastic elements is used to indicate pressure. However, this structure is large in size and heavy in weight, and cannot provide electrical output.

Method used

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  • A heat-resistant pressure sensor material and its preparation method

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Embodiment 1

[0026] A heat-resistant pressure sensor material, the heat-resistant pressure sensor material is made of the following raw materials in parts by weight: 12 parts of chromium, 3 parts of carbon, 8 parts of titanium dioxide, 1 part of graphene, 2 parts of rare earth elements, and 6 parts of silicon carbide , 2 parts of silicon dioxide, 3 parts of aluminum oxide, 3 parts of barium titanate, 6 parts of titanium tetrachloride, 1 part of sodium hydroxide, 0.2 parts of ethylenediaminetetraacetic acid, 0.8 parts of magnesium oxide, 2 parts of dispersant , 6 parts of adhesive.

[0027] The rare earth element is at least one of lanthanum, cerium, neodymium, gadolinium, terbium, dysprosium, ytterbium, and lutetium; the mass ratio of the dispersant polyacrylamide, sodium lauryl sulfate, and methyl amyl alcohol is 3:2: 1; the binder is a mixture of polyvinyl alcohol and polydimethylsiloxane in a mass ratio of 5:2.

[0028] The preparation method of the heat-resistant pressure sensor mater...

Embodiment 2

[0036] A heat-resistant pressure sensor material, the heat-resistant pressure sensor material is made of the following raw materials in parts by weight: 14 parts of chromium, 5 parts of carbon, 10 parts of titanium dioxide, 2 parts of graphene, 4 parts of rare earth elements, and 10 parts of silicon carbide , 4 parts of silicon dioxide, 5 parts of aluminum oxide, 5 parts of barium titanate, 8 parts of titanium tetrachloride, 2 parts of sodium hydroxide, 0.4 parts of ethylenediaminetetraacetic acid, 1.2 parts of magnesium oxide, and 3 parts of dispersant , 10 parts of adhesive.

[0037] The rare earth element is at least one of lanthanum, cerium, neodymium, gadolinium, terbium, dysprosium, ytterbium, and lutetium; the mass ratio of the dispersant polyacrylamide, sodium lauryl sulfate, and methyl amyl alcohol is 3:2: 1; the binder is a mixture of polyvinyl alcohol and polydimethylsiloxane in a mass ratio of 5:2.

[0038] The preparation method of the heat-resistant pressure sen...

Embodiment 3

[0046] A heat-resistant pressure sensor material, the heat-resistant pressure sensor material is made of the following raw materials in parts by weight: 13 parts of chromium, 4 parts of carbon, 9 parts of titanium dioxide, 1.5 parts of graphene, 3 parts of rare earth elements, and 8 parts of silicon carbide , 3 parts of silicon dioxide, 4 parts of aluminum oxide, 4 parts of barium titanate, 7 parts of titanium tetrachloride, 1.5 parts of sodium hydroxide, 0.3 parts of ethylenediaminetetraacetic acid, 1 part of magnesium oxide, 2.5 parts of dispersant , 8 parts of adhesive.

[0047] The rare earth element is at least one of lanthanum, cerium, neodymium, gadolinium, terbium, dysprosium, ytterbium, and lutetium; the mass ratio of the dispersant polyacrylamide, sodium lauryl sulfate, and methyl amyl alcohol is 3:2: 1; the binder is a mixture of polyvinyl alcohol and polydimethylsiloxane in a mass ratio of 5:2.

[0048] The preparation method of the heat-resistant pressure sensor ...

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Abstract

The invention provides a heat-resistant pressure sensor material and a preparation method thereof, which relate to the technical field of pressure sensors. The heat-resistant pressure sensor material is made of the following raw materials in parts by weight: 12-14 parts of chromium, 3-5 parts of carbon, 8-10 parts of titanium dioxide, 1-2 parts of graphene, 2-4 parts of rare earth elements, silicon carbide 6‑10 parts, 2‑4 parts of silicon dioxide, 3‑5 parts of aluminum oxide, 3‑5 parts of barium titanate, 6‑8 parts of titanium tetrachloride, 1‑2 parts of sodium hydroxide, ethylenediamine 0.2-0.4 parts of tetraacetic acid, 0.8-1.2 parts of magnesium oxide, 2-3 parts of dispersant, and 6-10 parts of binder. The invention overcomes the deficiencies of the prior art, improves the heat resistance performance of the sensor material, reduces the influence of the high temperature environment on the sensor detection, and enhances the aging resistance performance of the product at the same time, and is suitable for popularization and production use.

Description

technical field [0001] The invention relates to the technical field of pressure sensor processing, in particular to a heat-resistant pressure sensor material and a preparation method thereof. Background technique [0002] Pressure sensor is the most commonly used sensor in industrial practice. It is widely used in various industrial automatic control environments, involving water conservancy and hydropower, railway transportation, intelligent buildings, production automatic control, aerospace, military industry, petrochemical, oil wells, electric power, ships, machine tools In many industries such as pipelines and pipelines, traditional pressure sensors are mainly mechanical structural devices, and the deformation of elastic elements is used to indicate pressure, but this structure is large in size and heavy in weight, and cannot provide electrical output. With the development of semiconductor technology, semiconductor pressure sensors have emerged as the times require. It ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B26/32C04B18/02C04B24/26G01L1/18G01L1/26G01L9/06G01L19/06H01C7/10C04B103/40
CPCC04B18/023C04B26/32C04B40/0039C04B2103/408C04B2111/00844G01L1/18G01L1/26G01L9/06G01L19/0681H01C7/10C04B24/2623C04B14/305C04B14/024C04B24/2652C04B24/16C04B24/02C04B14/34C04B14/303C04B14/06C04B14/324C04B14/304C04B22/12C04B22/062C04B14/022
Inventor 赵建兵朱安丽毛文秀黄炜赵庆祝田开芳
Owner 中电鼎康(天长)科技有限公司