Ultra-thin alumina ceramic substrate preparation method

A technology of alumina ceramics and alumina, which is applied in the field of alumina ceramics, can solve the problems of high sintering temperature of alumina ceramic substrates, achieve the effects of shortening the time of alumina surface modification, high surface energy, and improving work efficiency

Inactive Publication Date: 2019-11-12
FUJIAN HUAQING ELECTRONICS MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Therefore, in view of the above content, the present invention provides a method for preparing an ultra-thin alumina ceramic substrate to solve the problem of excessive sintering temperature of the alumina ceramic substrate in the prior art

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0027] A method for preparing an ultra-thin alumina ceramic substrate, comprising the following steps:

[0028] (1) Surface modification of alumina powder: add 99.9% alumina powder to ethanol solution containing 5wt% stearic acid, the weight ratio of alumina powder to ethanol solution is 1:20, stir at 70°C for 60min After cooling to 40°C, filter and wash with n-hexane, and dry to obtain modified alumina powder;

[0029] (2) Preparation of slurry: Add modified alumina powder, yttrium oxide, isopropanol, ethyl acetate, and phosphoric acid ester into a ball mill for ball milling for 8 hours, wherein modified alumina powder, yttrium oxide, isopropanol, The weight ratio of ethyl acetate and phosphate is 1:0.02:1:0.5:0.06, then add polyvinyl butyral, polyethylene glycol 400, and propylene glycol butyl ether to continue ball milling for 8 hours, and finally add ethylene glycol for vacuum Stir for 30 minutes to obtain a slurry with good fluidity and stability. The weight ratio of the...

Embodiment 2

[0035] A method for preparing an ultra-thin alumina ceramic substrate, comprising the following steps:

[0036] (1) Surface modification of alumina powder: add 99.9% alumina powder to ethanol solution containing 5wt% palmitic acid, the weight ratio of alumina powder to ethanol solution is 1:30, stir at 80°C for 30min, After cooling to 40°C, filter and wash with n-hexane, and dry to obtain modified alumina powder;

[0037](2) Preparation of slurry: Add modified alumina powder, yttrium chloride, isopropanol, ethyl acetate, and sodium polyacrylate to ball mill for 10 hours, wherein modified alumina powder, yttrium chloride, isopropanol The weight ratio of propanol, ethyl acetate, and sodium polyacrylate is 1:0.01:1.6:0.8:0.05, then add polyvinyl butyral, polyethylene glycol 600, and propylene glycol butyl ether to continue ball milling for 5 hours, and finally add ethyl Diol was vacuum stirred for 35min to obtain a good fluidity and stable slurry, the weight ratio of the modifie...

Embodiment 3

[0043] A method for preparing an ultra-thin alumina ceramic substrate, comprising the following steps:

[0044] (1) Surface modification of alumina powder: add 99.9% alumina powder to ethanol solution containing 5wt% methanesulfonic acid, the weight ratio of alumina powder to ethanol solution is 1:40, stir at 75°C for 45min , cooled to 40°C, filtered and washed with n-hexane, dried to obtain modified alumina powder;

[0045] (2) Preparation of slurry: Add modified alumina powder, cerium oxide, lanthanum chloride, isopropanol, ethyl acetate, and sodium polyacrylate to ball mill for 12 hours, wherein modified alumina powder, cerium oxide , lanthanum chloride, isopropanol, ethyl acetate, and sodium polyacrylate in a weight ratio of 1:0.02:0.01:1.4:0.7:0.04, and then add polyvinyl butyral, polyethylene glycol 1000, and propylene glycol The ether continued to be milled for 6 hours, and finally ethylene glycol was added for vacuum stirring for 25 minutes to obtain a slurry with goo...

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Abstract

The invention relates to the technical field of alumina ceramics, particularly to an ultra-thin alumina ceramic substrate preparation method. A purpose of the present invention is to solve the problemof too high sintering temperature of the alumina ceramic substrate in the prior art. The method comprises: (1) carrying out surface modification on aluminum oxide powder; (2) preparing a slurry; (3)carrying out casting molding; (4) stamping, wherein the billet tape obtained in the step (3) is stamped to obtain a billet sheet; (5) discharging glue, wherein the billet sheet is placed into a glue discharge furnace, and is subjected to first glue discharge under a nitrogen atmosphere, heating is performed to a temperature of 450-550 DEG C at a heating rate of 0.8-2 DEG C/min, thermal insulationis performed for 35-60 min, second glue discharge is performed in an air atmosphere, heating is performed to a temperature of 180-250 DEG C at a heating rate of 2-5 DEG C/min, and thermal insulation is performed for 80-120 min; and (5) sintering, wherein the billet sheet after the glue discharge in the step (5) is placed into a sintering furnace, and is sintered for 12-20 h at a sintering temperature of 1550-1600 DEG C.

Description

technical field [0001] The invention relates to the technical field of alumina ceramics, in particular to a method for preparing an ultra-thin alumina ceramic substrate. Background technique [0002] With the continuous development of modern communication technology, electronic components are constantly developing towards simplification, miniaturization, and high integration, and the demand for ceramic materials is also increasing. Alumina ceramics have good performance in terms of strength, heat resistance, thermal shock resistance, electrical insulation and corrosion resistance, and are abundant in raw materials and affordable, and are widely used in electronics industry packaging and integrated circuits. The production of ultra-thin alumina ceramic substrates generally uses high-purity alumina as raw material, which can be sintered at high temperature (greater than 1700°C) to form a dense structure. The requirements for sintering equipment are high, and the production cos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/10C04B35/622C04B35/626C04B35/634C04B35/638C04B35/64
CPCC04B35/10C04B35/622C04B35/62605C04B35/63404C04B35/6342C04B35/638C04B35/64C04B2235/6025C04B2235/6562C04B2235/6567C04B2235/658
Inventor 杨大胜施纯锡
Owner FUJIAN HUAQING ELECTRONICS MATERIAL TECH
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