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Heat dissipation printing ink and preparation method thereof

A technology of ink and oil modification, applied in the field of coatings, can solve problems affecting the performance of coating films, and achieve the effects of improving mechanical properties, reducing ink temperature, and good corrosion resistance

Pending Publication Date: 2021-12-14
惠州市韵点新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing heat-dissipating inks improve thermal conductivity by adding a large amount of thermally conductive fillers to the matrix resin. The selection of resin and the mixing properties of fillers and resins will affect the performance of the coating film.

Method used

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  • Heat dissipation printing ink and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A heat dissipation ink, comprising the following components calculated in parts by mass: 25 parts of polyimide modified epoxy resin, 25 parts of polytetrafluoroethylene resin, 10 parts of tung oil modified alkyd resin, boron nitride coating 20 parts of aluminum oxide, 20 parts of nano-silicon carbide, 20 parts of nano-aluminum silicate, 5 parts of anilinomethyltriethoxysilane, 5 parts of aluminum stearate, 5 parts of polydimethylsiloxane, and 15 parts of diol phenyl ether, 15 parts of phenol, 15 parts of hexamethoxymethylmelamine, and 10 parts of lauric acid.

[0027] Wherein, the tung oil modified alkyd resin is prepared from tung oil, diethylene glycol and trimellitic anhydride.

Embodiment 2

[0029] A heat dissipation ink, comprising the following components calculated in parts by mass: 25 parts of polyimide modified epoxy resin, 25 parts of polytetrafluoroethylene resin, 10 parts of tung oil modified alkyd resin, 20 parts of aluminum oxide 20 parts, nano silicon carbide 20 parts, nano aluminum silicate 20 parts, anilinomethyltriethoxysilane 5 parts, aluminum stearate 5 parts, polydimethylsiloxane 5 parts, ethylene glycol phenyl ether 15 parts , 15 parts of phenol, 15 parts of hexamethoxymethylmelamine, and 10 parts of lauric acid.

[0030] Wherein, the tung oil modified alkyd resin is prepared from tung oil, diethylene glycol and trimellitic anhydride.

Embodiment 3

[0032] A heat dissipation ink, comprising the following components calculated in parts by mass: 25 parts of polyimide modified epoxy resin, 25 parts of polytetrafluoroethylene resin, 10 parts of tung oil modified alkyd resin, boron nitride coating 20 parts of aluminum oxide, 20 parts of nano-silicon carbide, 20 parts of nano-aluminum silicate, 5 parts of anilinomethyltriethoxysilane, 5 parts of aluminum stearate, 5 parts of polydimethylsiloxane, and 15 parts of glycol phenyl ether, 15 parts of phenol, 25 parts of phthalic anhydride.

[0033] Wherein, the tung oil modified alkyd resin is prepared from tung oil, diethylene glycol and trimellitic anhydride.

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PUM

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Abstract

The invention belongs to the technical field of coatings. The invention provides heat dissipation printing ink. The heat dissipation printing ink comprises the following components in parts by mass: 20 to 25 parts of polyimide modified epoxy resin, 15 to 25 parts of polytetrafluoroethylene resin, 5 to 10 parts of oil modified alkyd resin, 45 to 60 parts of a filler, 1 to 5 parts of a coupling agent, 1 to 5 parts of an anti-settling agent, 1 to 5 parts of a flatting agent, 25 to 30 parts of an organic solvent and 25 to 35 parts of a curing agent. The heat dissipation printing ink is good in film forming performance, high in film forming speed and low in film forming temperature; a formed paint film has good base material adhesion, temperature change resistance, weather resistance, corrosion resistance, scraping resistance and abrasion resistance; and the paint film is high in heat radiation rate, low in heat resistance, high in heat conductivity coefficient, low in heat resistance and good in heat dissipation effect.

Description

technical field [0001] The invention belongs to the technical field of coatings, and in particular relates to a heat-dissipating ink and a preparation method thereof. Background technique [0002] With the development of modern technology, various electronic components tend to be miniaturized and efficient gradually. Since electronic components generally have the characteristics of small size, long continuous working time and closed working environment, with the continuous increase of the input power of electronic components , will cause the heat flux density of the electronic components to be very high, and the heat generation will be large. If the heat cannot be dissipated in time, the temperature of the electronic product or some parts thereof will be too high, which will greatly shorten the service life of the capacitor, reduce the working performance and cause waste of resources. Therefore, coating thermally conductive paint on the surface of electronic components is t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/106C09D11/102C09D11/105C09D11/03C09D163/00C09D127/18C09D7/65C09D7/62C09D7/61C09D5/08C09D5/25
CPCC09D11/106C09D11/102C09D11/105C09D11/03C09D163/00C09D127/18C09D7/65C09D7/62C09D7/61C09D5/08C09D5/00C08K2003/2227C08K2003/385C08K2201/011C08L27/18C08L67/08C08K9/02C08K3/22C08K3/38C08K3/34C08L63/00
Inventor 冯浩周勋
Owner 惠州市韵点新材料科技股份有限公司
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