Polymer semi-conductive photoresist with side chain containing azide group as well as preparation method and application of polymer semi-conductive photoresist

A polymer and group technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, photosensitive materials for optomechanical equipment, etc., can solve the problem of lack of semiconducting photoresist and achieve excellent carrier transport Performance and solubility characteristics, efficient cross-linking reaction, convenient and easy-to-obtain raw materials

Pending Publication Date: 2022-05-13
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is still a lack of semiconducting photoresists with both carrier transport and patterning functions

Method used

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  • Polymer semi-conductive photoresist with side chain containing azide group as well as preparation method and application of polymer semi-conductive photoresist
  • Polymer semi-conductive photoresist with side chain containing azide group as well as preparation method and application of polymer semi-conductive photoresist
  • Polymer semi-conductive photoresist with side chain containing azide group as well as preparation method and application of polymer semi-conductive photoresist

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] Synthesis of compound shown in formula II (in its formula II, R 1 is 2-decyltetradecyl, N 3 group at the end of the alkyl side chain)

[0063]

[0064] Concrete reaction step condition is as follows:

[0065] chemical reaction flow chart figure 1 shown. Dissolve compound 1 (0.96mmol) in 30mL DMF, add compound 2NaN 3 (3.83mmol), reacted at room temperature for 7 hours, and stopped the reaction. Multiple extractions were performed with copious amounts of water and dichloromethane. The organic phase was removed by rotary evaporation, and the product 3 (0.48mmol, yield: 49.9%) was obtained by separation with a silica gel column; the structural confirmation data were as follows: 1 H NMR (400MHz, CDCl 3 ): δ=8.63(d, J=4.4Hz, 2H), 7.22(d, J=4.0Hz, 2H), 3.92(d, J=8.0Hz, 4H), 3.25(t, J=6.8Hz, 4H ), 1.88(m,2H), 1.60-1.55(m,4H), 1.30-1.21(m,76H), 0.88(t,6H); HR-MS: Calculated for C 62 h 101 Br 2 N 8 o 2 S 2 (M + ): 1211.5850, mass spectrum peak: 1211.5858.

Embodiment 2

[0067] The synthesis of polymkeric substance shown in formula I (wherein, R 1 with R 2 is 2-octyldodecyl, N 3 group at R 1 The end of the alkyl main chain; Ar is a substituent of dithiophene; when x:y=1:0, the defined polymer is PDPP4T-N 3 ):

[0068]

[0069] chemical reaction flow chart figure 2 As shown, the product 3 (0.050mmol) obtained in Example 1 of the present invention and 5,5'-bis(trimethylstannyl)-2,2'-bithiophene 4 (0.050mmol) were dissolved in anhydrous toluene , blow nitrogen for 10 minutes, add 1.48 μmol of catalyst tris(dibenzylideneacetone) dipalladium and 5.93 μmol of ligand o-tricresylphosphine, react at 100°C for 3 hours under the protection of nitrogen, then cool to room temperature, and the reaction system Poured into 100mL methanol, precipitated solid, filtered. The obtained solid was removed by a Soxhlet extractor with methanol, n-hexane and acetone in order to remove the catalyst, unreacted raw materials and oligomers, and finally the target...

Embodiment 3

[0071] The specific steps for realizing patterning based on the polymer described in Formula I of the present invention are: the PDPP4T-N prepared in Example 2 of the present invention 3 Polymer (structural formula such as Figure 5 shown in ) dissolved in chloroform solution at room temperature, wherein PDPP4T-N 3 The concentration is 3 mg / ml. Then, the solution was spin-coated on the silicon wafer by a homogenizer at a speed of 3000 rpm, and the film thickness was about 20 nanometers. Then cover the mask plate on the film, and irradiate it with a 365-nanometer ultraviolet LED lamp for 400 seconds, and the lamp power is 85 milliwatts per square centimeter. Then soak the lighted film in chloroform for 30 seconds, take it out and rinse it twice with 5 ml of isopropanol, and blow dry the silicon wafer with nitrogen to realize patterning. Figure 8 shown.

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Abstract

The invention discloses an organic polymer semiconductor photoresist with a side chain containing an azide group as well as a preparation method and application of the organic polymer semiconductor photoresist. Organic semiconductor device patterning which is efficiently cross-linked by utilizing 365nm ultraviolet light is realized. The structural formula of the semiconductor photoresist provided by the invention is as shown in the following formula I. In the formula I, Ar is selected from any one of aryl, heteroaryl, substituent-containing aryl and substituent-containing heteroaryl, and the internal bonding mode of the group is selected from at least one of single bond, double bond and triple bond; the heteroaryl is selected from any one of monocyclic heteroaryl, bicyclic heteroaryl and tricyclic heteroaryl, and heteroatoms in the heteroaryl are selected from at least one of oxygen, sulfur and selenium; according to the preparation method, the polymer is obtained through a carbon-carbon coupling reaction. And efficient patterning of the organic semiconductor device is realized.

Description

technical field [0001] The invention belongs to the field of organic semiconductor materials, and in particular relates to a polymer semiconductor photoresist whose side chain contains azide groups, a preparation method thereof and an application in organic photoelectric devices. Background technique [0002] Conjugated polymers have optoelectronic properties comparable to traditional inorganic semiconductor materials, but also have unique mechanical flexibility, and have great application prospects in flexible electronic devices (Science, 2017, 355, 59). However, there are still many limitations in the real application of organic semiconducting polymers in flexible circuits, such as the inability to perform large-scale patterning through traditional photolithography processes, and their solubility also limits the non-orthogonal solvent integration of multilayer materials. Therefore, the development of new methods for photolithographic processing of polymer semiconductors is...

Claims

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Application Information

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IPC IPC(8): C08G61/12C07D487/04G03F7/012H01L51/00
CPCC08G61/126C08G61/124C07D487/04G03F7/012C08G2261/12C08G2261/18C08G2261/143C08G2261/3223C08G2261/3241C08G2261/414C08G2261/51C08G2261/64C08G2261/91C08G2261/95H10K85/151Y02E10/549
Inventor张德清高晨英李诚张关心张西沙
OwnerINST OF CHEM CHINESE ACAD OF SCI