34results about "PIc I-O input output" patented technology

A method for monitoring a manufacturing process features acquiring metrology data for semiconductor wafers at the conclusion of a final process step for the manufacturing process (“Step a”). Data is acquired for a plurality of process variables for a first process step for manufacturing semiconductor wafers (“Step b”). A first mathematical model of the first process step is created based on the metrology data and the acquired data for the plurality of process variables for the first process step (“Step c”). Steps b and c are repeated for at least a second process step for manufacturing the semiconductor wafers (“Step d”). An nth mathematical model is created based on the metrology data and the data for the plurality of process variables for each of the n process steps (“Step e”). A top level mathematical model is created based on the metrology data and the models created by steps c, d and e (“Step f”). The top level mathematical model of Step f is based on those process variables that have a substantial effect on the metrology data.

A method and apparatus for data analysis according to various aspects of the present invention is configured to automatically identify a characteristic of a component fabrication process guided by characteristics of the test data for the components.

Manufacturing execution systems relating to methods, systems, and software program for validation of pharmaceutical manufacturing processes and quality assurance process are described and disclosed herein. Consequently, the methods provide a means to perform validation on an integrated level whereby the quality control unit can ensure data and product integrity and minimize cost.

Manufacturing execution systems relating to methods, systems, and software program for validation of pharmaceutical manufacturing processes and quality assurance process are described and disclosed herein. Consequently, the methods provide a means to perform validation on an integrated level whereby the quality control unit can ensure data and product integrity and minimize cost.

A method of monitoring a processing system in real-time using low-pressure based modeling techniques that include processing one or more of wafers in a processing chamber; determining a measured dynamic process response for a rate of change for a process parameter; executing a real-time dynamic model to generate a predicted dynamic process response; determining a dynamic estimation error using a difference between the predicted dynamic process response and the expected process response; and comparing the dynamic estimation error to operational limits.

Methods, systems, and software program for validation of pharmaceutical manufacturing processes and quality assurance process are described and disclosed herein. Consequently, the methods provide a means to perform validation on an integrated level whereby the quality control unit can ensure data and product integrity and minimize cost.

Method and system for defect detection in manufacturing integrated circuits. In an embodiment, the invention provides a method for identifying one or more sources for possible causing manufacturing detects in integrated circuits. The method includes a step for providing a plurality of semiconductor substrates. The method includes a step for processing the plurality of semiconductor substrates in a plurality of processing steps using a plurality of processing tools. The method additionally includes a step for providing a database, which includes data associated with the processing of the plurality of semiconductor substrates. The method further includes a step for testing the plurality of semiconductor wafers after the processing of the plurality of semiconductor substrates. Additionally, the method includes a step for detecting at least one defect characteristic associated with the plurality of the semiconductor substrates that have been processed. Moreover, the method includes a step for identifying a set of processing steps. For example, the set of processing step are possibly associated with the defect characteristic.

Embodiments of the present invention pertain to methods of evaluating processes for manufacturing components. In one embodiment, an average probability of a first component to fail is calculated based on a measurement of a parameter where the first component was built using a new process. Another average probability of a second component to fail is calculated based on a measurement of the parameter where the second component was built using an existing process. A process index is calculated by determining a difference between the average probabilities for the second component and the first component. An estimation is made as to whether the new process is better than the existing process based on the process index.

The invention relates to a method and a system for detecting deflects in the manufacture of an integrated circuit. In one embodiment, the invention provides a method for detecting one or more sources possibly causing manufacturing deflects of the integrated circuit. The method comprises a step of providing a plurality of semiconductor substrates, a step of using a plurality of processing devices to process the plurality of semiconductor substrates in a plurality of processing steps, a step of providing a data base including the data related to the processing of the plurality of semiconductor substrates, a step of detecting a plurality of semiconductor chips after the processing of the plurality of semiconductor substrates, a step of detecting at least one defective feature related to the plurality of processed semiconductor substrates and a step of detecting a processing step collection, for example, the processing step collection is possibly related to the defective feature.

A method for inputting a foreign substance inspection map created by foreign substance inspection for a wafer surface after each processing process in a wafer processing process, inputting a die sort map created by a die sort test after the wafer processing process, setting region segments in the wafer, setting a region number for each segment, calculating foreign substance density of the region segments, based on the foreign substance inspection map, and plotting the foreign substance density, using the region numbers, to calculate a foreign substance inspection map waveform characteristic amount, calculating failure density in the region segments, based on the die sort map, and plotting the failure density, using the region numbers, to calculate a die sort map waveform characteristic amount, calculating similarity between the foreign substance inspection map waveform characteristic amount and the die sort map waveform characteristic amount, and identifying a processing process cause of failure occurrence.