Method for preparing porous conductive coating on plastic surface
A porous conductive and plastic technology, which is applied in the direction of conductive coating, metal material coating process, coating, etc., can solve the problems of affecting the bonding force of coating film and limited applicability, and achieve the goal of increasing mechanical anchoring, improving efficiency and reducing pollution Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0018] Embodiment 1: electroplating (water plating) acid copper on ABS products
[0019] Organic solvent (using acetone and ethyl acetate, by volume ratio, acetone: ethyl acetate=10: 1) is 45g;
[0020] Non-solvent substance (water) is 2g;
[0021] Resin (ABS) is 2.5g;
[0022] Conductive particles (nano-silver and nano-copper, mass ratio 2:1) are 4g;
[0023] Leveling agent (polydimethylsiloxane) is 0.1g;
[0024] The dispersant (polyvinylpyrrolidone) is 0.1 g.
[0025] Disperse and mix with a magnetic stirrer according to the above-mentioned raw material ratio, and prepare nano-modified polymer emulsion. The electroplating process flow is: ABS workpiece, chemical degreasing, dilute acid (dilute sulfuric acid of 3mol / L and pure acetic acid in volume ratio (4: 1)) Activate for 5 minutes, dry at 50°C for 20 minutes, impregnate nano-modified polymer emulsion, dry at 70°C for 30 minutes, activate with mixed acid for 5 minutes, wash twice with water, and electroplate acid copp...
Embodiment 2
[0026] Embodiment 2: PVD copper plating on unsaturated polyester (BMC)
[0027] The organic solvent (using ethyl acetate, butanone and N-methyl-2-pyrrolidone, by volume, ethyl acetate: butanone: N-methyl-2-pyrrolidone=10:1:1) was 45g;
[0028] Non-solvent substance (ethanol) is 5g;
[0029] Resin (ABS and acrylic resin, by mass ratio, ABS: acrylic resin=10: 1) is 6g;
[0030] Conductive particle (nano-silver and nano-copper, by mass ratio, nano-silver: nano-copper=1: 3) is 5g;
[0031] Leveling agent (polyether modified silicone oil and KH560 silane coupling agent, volume ratio: 1:1) is 0.1g;
[0032] Dispersant (polyethyleneimine) is 0.1g;
[0033] Disperse and mix with a magnetic stirrer according to the above raw material ratios, and prepare nano-modified polymer (SNP) emulsions. The vacuum coating process is: BMC workpieces, chemical degreasing, strong alkali activation for 10 minutes, drying at 50°C for 20 minutes, and spraying nano-modified polymers. Non-toxic polyme...
Embodiment 3
[0034] Embodiment 3: electroplating (water plating) nickel at nylon PA6
[0035] Organic solvent (using butyl acetate, heptanone and N-methyl-2-pyrrolidone, by volume, butyl acetate: heptanone: N-methyl-2-pyrrolidone=10: 1: 1) is 45g;
[0036] Non-solvent substance (water) is 1g;
[0037] Resin (ABS and acrylic resin, by mass ratio, ABS: acrylic resin=3: 0.2) is 3g;
[0038] Conductive particle (nanometer silver and carbon nanotube, by mass ratio, nanosilver: carbon nanotube=2: 1) is 3g;
[0039] Leveling agent (polyether modified silicone oil) is 0.1g;
[0040]The dispersant (polyethyleneimine) was 0.1 g.
[0041] Disperse and mix with a magnetic stirrer according to the above raw material ratio, and prepare nano-modified polymer (SNP) emulsion. The electroplating process is: nylon workpiece, chemical degreasing, dilute acid (6mol / L dilute sulfuric acid and pure acetic acid by volume ratio) (4:1)) activated for 5 minutes, dried at 50°C for 20 minutes, sprayed nano-modifie...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com