Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Composite dielectric material, copper-clad foil prepreg manufactured and copper-clad foil laminated board by using composite dielectric material

A technology for copper clad laminates and dielectric materials, applied in the field of copper clad laminates, can solve the problems of poor heat resistance, heat resistance cannot meet high heat resistance, etc., and achieves simple processing methods and good processability. , the effect of high dielectric constant

Active Publication Date: 2012-08-22
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
View PDF7 Cites 37 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to the fact that most of the base resins used in the prior art are ordinary epoxy resins with low heat resistance, the ubiquitous problem is that the heat resistance is poor, and its glass transition temperature (Tg) is only about 130°C.
However, the heat resistance of traditional epoxy resin-based copper clad laminates cannot meet the requirements of high heat resistance (Tg≥200°C)

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Composite dielectric material, copper-clad foil prepreg manufactured and copper-clad foil laminated board by using composite dielectric material
  • Composite dielectric material, copper-clad foil prepreg manufactured and copper-clad foil laminated board by using composite dielectric material
  • Composite dielectric material, copper-clad foil prepreg manufactured and copper-clad foil laminated board by using composite dielectric material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] A kind of composite dielectric material of the present invention, the prepreg that adopts it to make and copper-clad laminated board production process are as follows figure 1 shown. The specific steps are as follows:

[0046] Step 1: BT Resin / BaTiO 3 Preparation of composite dielectric materials

[0047] Weigh 70g of BaTiO with a particle size of 100nm after high temperature treatment at 350°C 3 The particles were added to 7g of 3-(2,3-glycidoxy)propyltrimethoxysilane (KH-560) and 200mL of butanone solvent, stirred and ultrasonically oscillated for 12 hours at 70°C, and then the solution was Heating while stirring until the solvent volatilized completely, the modified BaTiO 3 The particles are dried and ground for later use.

[0048] With 50g bisphenol A type cyanate ester, 30g diphenylmethane type bismaleimide, 10g 2,2'-diallyl bisphenol A and 10g bisphenol A type epoxy resin (E-44) in Stir and mix evenly at 120°C, and maintain this temperature for 30 minutes to...

Embodiment 2-8

[0055] According to the same preparation method as described in Example 1, the difference is that the amount of each component is the amount shown in Table 1. The unit of each group consumption in Table 1 is parts by weight.

Embodiment 9

[0062] Step 1: Preparation of BT resin / aluminum composite dielectric material

[0063] Disperse 80g of nano-aluminum powder in absolute ethanol dissolved in polyethylene glycol (PEG-6000), and disperse in an ultrasonic generator for 120 minutes before use. In the four-neck bottle, add pretreated nano-aluminum powder suspension 70g, styrene monomer 30g, initiator AIBN 3g, dispersion stabilizer PVP 0.5g and reaction medium in order, and initiate dispersion polymerization reaction under nitrogen protection. It was reacted at 70°C for 24h. After the reaction, the sample was subjected to centrifugal sedimentation in an ultra-high-speed centrifuge, and the lower layer of particles was repeatedly washed with absolute ethanol. The washed lower particles were extracted with acetone for 24 hours, poured into a petri dish, and vacuum-dried at low temperature to obtain polystyrene-coated nano-aluminum powder.

[0064]With 50g bisphenol A type cyanate ester, 30g diphenylmethane type bism...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Particle sizeaaaaaaaaaa
Capacitance densityaaaaaaaaaa
Glass transition temperatureaaaaaaaaaa
Login to View More

Abstract

The invention discloses a composite dielectric material, a prepreg manufactured and a copper-clad foil laminated board by using the composite dielectric material, wherein the composite dielectric material comprises the components by mass percent: 4-30% of bismaleimide compound, 7-30% of cyanate ester monomer, 2-20% of epoxy resin, 2-20% of allylphenol compound, 0.5-5% of catalyst and 30-80% of inorganic filler, wherein the inorganic filler is high-dielectric oxide and / or conductive particles, and can be evenly dispersed in organic matrix by surface grafting or surface coating modification; the prepreg manufactured by the composite dielectric material can be obtained by coating the composite dielectric material on the surface of copper foil and carrying out heat treatment at 80-100 DEG C. The copper-clad foil laminated board is obtained by laminating the prepreg at the temperature of 120-200 DEG C. The copper-clad foil laminated board has the excellent characteristics of high glass transition temperature, high dielectric constant, low dielectric loss, high peel strength and the like, thus being used for manufacturing a high-temperature resistant embedded capacitor printed circuit board (PCB).

Description

【Technical field】 [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a composite dielectric material, a copper-clad prepreg prepared by using the composite dielectric material, and a copper-clad laminate with a high dielectric constant dielectric layer. 【Background technique】 [0002] In recent years, with the development of electronic devices towards light weight, thinner, miniaturized and high performance at an astonishing speed, electronic packaging technology has entered the development stage of high-density system-in-package. System-in-package requires that passive components including capacitors, inductors, and resistors be buried inside the organic substrate to save board space. Moreover, integrating passive components can also provide better electrical performance, higher reliability, lower cost and more design options. Capacitors account for up to 60% of all passive components. System-in-Package requires embed...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L79/04C08L63/00C08L63/02C08G73/06C08K9/10C08K9/04C08K9/06C08K3/24C08K3/08C08K3/04B32B15/08B32B15/20B32B27/18
Inventor 孙蓉曾小亮于淑会
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com