Rare-earth plating aid for hot dip tinning and preparation method thereof

Abstract

The invention discloses a rare-earth plating aid for hot dip tinning and a preparation method thereof. 1 liter of rare-earth plating aid comprises the following raw materials by weight: 80 to 150 grams of inorganic salt, 50 to 100 grams of organic acid, 15 to 25 grams of organic amine salt, 2 to 12 grams of rare-earth compounds and a solvent, wherein the raw materials are mixed, and the solvent is added to 1 liter of constant volume. According to the rare-earth plating aid, the heat stability and the capacity of removing an oxidation film of the plating aid are improved, the corrosivity is reduced, and the capacity of molten tin liquor to the adsorption, moistening and spreading of copper matrixes (copper plating layers) is improved obviously under the modified action of the rare-earth compounds; and a tinning layer of which the thickness is 6 to 9 micrometers can be obtained by one-time dip plating, and powerful guarantee is provided for the weldability and oxidation resistance of products such as electronic leads.

Description

1. Technical field [0001] The invention relates to a plating flux and a preparation method thereof, in particular to a rare earth flux for hot-dip tinning of copper wires and copper-clad metal composite wires (copper-clad steel wires, copper-clad aluminum wires, etc.) The invention relates to an agent and a preparation method thereof, belonging to the technical field of welding and hot-dip plating. 2. Background technology [0002] Copper wire, copper-clad steel wire, etc. are the lead-out wires of electronic components such as capacitors and resistors, cable conductors, and electromagnetic shielding braided sheathed busbars. The purpose of tinning the surface is to obtain good solderability and improve Corrosion resistance of the wire. The solderability of the lead wires of electronic components directly affects the quality of electronic products and the reliability of the whole machine; good corrosion resistance can ensure the safe transmission of power, and has high anti...

AI Technical Summary

Problems solved by technology

The literature (Electric Wire and Cable, 2007, (6): 29) states that domestic copper wire tinning production lines generally use aqueous solutions of zinc chloride and ammonium chloride as plating fluxes, which have certain reducibility and can damage the surface of tin liquid. Oxide film, but it will also react with tin liquid to consume part of tin

The literature (Optical Fiber and Cable and Its Application Technology, 2010, (5): 32) uses a mixture of rosin as the main component as a plating flux in the production of tinned round copper wires, but it is easy to stick to hands and pollute the surface during operation. And when the concentration is too high, it will cause discoloration of tinned round copper wire at high temperature

[0006] The hot-dip tin-plating fluxes in the above-mentioned patents and documents all have problems such as unsatisfactory ability to remove oxide film, inconvenient operation, and impact on the environment to varying degrees, and they have not been able to obtain a thickness larger than 3 μm under the condition of one-time immersion plating. Thickness of the tin coating cannot fully guarantee the solderability and protective performance of the hot-dip tin coating for the leads of electronic products and copper wires (copper-clad steel wires, copper-clad aluminum wires, etc.) for wires and cables.