Rare-earth plating aid for hot dip tinning and preparation method thereof

A kind of flux and hot dip plating technology, applied in hot dip plating process, coating, metal material coating process and other directions, can solve the problem that the solderability and protective performance of hot dip tin plating layer of electronic product leads cannot be fully guaranteed, Unsatisfactory ability to remove oxide film, discoloration of tinned round copper wire, etc., to improve thermal stability and ability to remove oxide film, strong ability to remove oxide film of copper substrate, and reduce corrosion effect

Inactive Publication Date: 2012-09-12
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The literature (Electric Wire and Cable, 2007, (6): 29) states that domestic copper wire tinning production lines generally use aqueous solutions of zinc chloride and ammonium chloride as plating fluxes, which have certain reducibility and can damage the surface of tin liquid. Oxide film, but it will also react with tin liquid to consume part of tin
The literature (Optical Fiber and Cable and Its Application Technology, 2010, (5): 32) uses a mixture of rosin as the main component as a plating flux in the production of tinned round copper wires, but it is easy to stick to hands and pollute the surface during operation. And when the concentration is too high, it will

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Dissolve 80g of inorganic salt (56g of zinc chloride + 24g of ammonium chloride) in 100mL of hydrochloric acid solution with a mass concentration of 36%, stir well and set aside, it is liquid A. Dissolve 100g of lactic acid in 400mL of ethanol, then dissolve 20g of aniline hydrochloride in it, and finally dissolve 2g of cerium chloride, stir evenly and set aside, it is liquid B. Slowly pour liquid A into liquid B, then add ethanol to make the volume up to 1L, and stir evenly to obtain the rare earth flux for hot-dip tin plating.

[0043] After the copper wire (or copper-clad steel wire, copper-clad aluminum wire) has been pretreated by degreasing and cleaning, it is continuously immersed in the rare earth modified plating flux, and then quickly passes through the molten tin pot (the time in the tin bath is 1.5 ~2s), the thickness of the hot-dip tin coating obtained by using the rare earth modified plating flux is 8.5~9.0μm.

Embodiment 2

[0045] Dissolve 100g of inorganic salt (70g of zinc chloride + 30g of ammonium chloride) in 120mL of hydrochloric acid solution with a mass concentration of 36%, stir well and set aside, it is liquid A. Dissolve 50g of salicylic acid in 400mL of ethanol, then dissolve 20g of aniline hydrochloride in it, and finally dissolve 6g of lanthanum chloride, stir well and set aside, it is liquid B. Slowly pour liquid A into liquid B, add distilled water to make the volume up to 1L, and stir evenly to obtain the rare earth flux for hot-dip tin plating.

[0046] After the copper wire (or copper-clad steel wire, copper-clad aluminum wire) has been pretreated by degreasing and cleaning, it is continuously immersed in the rare earth modified plating flux, and then quickly passes through the molten tin pot (the time in the tin bath is 1.5 ~2s), the thickness of the hot-dip tin coating obtained by using the rare earth modified plating flux is 7.5~8.0μm.

Embodiment 3

[0048] Dissolve 150g of inorganic salt (105g of zinc chloride + 45g of ammonium chloride) in 170mL of hydrochloric acid solution with a mass concentration of 36%, stir well and set aside, it is liquid A. Dissolve 50g of stearic acid in 400mL of ethanol, then dissolve 20g of aniline hydrochloride in it, and finally dissolve 4g of yttrium chloride, stir evenly and set aside, it is liquid B. Slowly pour liquid A into liquid B, add distilled water to make the volume up to 1L, and stir evenly to obtain the rare earth flux for hot-dip tin plating.

[0049] After the copper wire (or copper-clad steel wire, copper-clad aluminum wire) has been pretreated by degreasing and cleaning, it is continuously immersed in the rare earth modified plating flux, and then quickly passes through the molten tin pot (the time in the tin bath is 1.5 ~2s), the thickness of the hot-dip tin coating obtained by using the rare earth modified plating flux is 6.0~7.0μm.

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Abstract

The invention discloses a rare-earth plating aid for hot dip tinning and a preparation method thereof. 1 liter of rare-earth plating aid comprises the following raw materials by weight: 80 to 150 grams of inorganic salt, 50 to 100 grams of organic acid, 15 to 25 grams of organic amine salt, 2 to 12 grams of rare-earth compounds and a solvent, wherein the raw materials are mixed, and the solvent is added to 1 liter of constant volume. According to the rare-earth plating aid, the heat stability and the capacity of removing an oxidation film of the plating aid are improved, the corrosivity is reduced, and the capacity of molten tin liquor to the adsorption, moistening and spreading of copper matrixes (copper plating layers) is improved obviously under the modified action of the rare-earth compounds; and a tinning layer of which the thickness is 6 to 9 micrometers can be obtained by one-time dip plating, and powerful guarantee is provided for the weldability and oxidation resistance of products such as electronic leads.

Description

1. Technical field [0001] The invention relates to a plating flux and a preparation method thereof, in particular to a rare earth flux for hot-dip tinning of copper wires and copper-clad metal composite wires (copper-clad steel wires, copper-clad aluminum wires, etc.) The invention relates to an agent and a preparation method thereof, belonging to the technical field of welding and hot-dip plating. 2. Background technology [0002] Copper wire, copper-clad steel wire, etc. are the lead-out wires of electronic components such as capacitors and resistors, cable conductors, and electromagnetic shielding braided sheathed busbars. The purpose of tinning the surface is to obtain good solderability and improve Corrosion resistance of the wire. The solderability of the lead wires of electronic components directly affects the quality of electronic products and the reliability of the whole machine; good corrosion resistance can ensure the safe transmission of power, and has high anti...

Claims

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Application Information

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IPC IPC(8): C23C2/08
Inventor 宣天鹏汪亮张万利周赟
Owner HEFEI UNIV OF TECH
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