Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chip-type through-hole gold electrode chip capacitor and preparation method thereof

An electrode chip and capacitor technology, applied in the direction of multilayer capacitors, fixed capacitor dielectrics, fixed capacitor terminals, etc., can solve the problems of limited microwave circuit application, low internal inductance, high insulation resistance, and avoid mutual diffusion problems and parasitic inductance. Small, high solderability effect

Inactive Publication Date: 2018-11-30
CHINA ZHENHUA GRP YUNKE ELECTRONICS
View PDF3 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

MLCC has the advantages of large capacity, small size, low internal inductance, high insulation resistance and small leakage current. It is widely used in oscillation, coupling, filtering and bypass circuits in various electronic machines. However, due to poor radio frequency parameters and medium Disadvantages such as large loss limit its application in microwave circuits
SLC has excellent radio frequency characteristics, but has disadvantages such as small capacity and low withstand voltage

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip-type through-hole gold electrode chip capacitor and preparation method thereof
  • Chip-type through-hole gold electrode chip capacitor and preparation method thereof
  • Chip-type through-hole gold electrode chip capacitor and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] 1) Preparation of Through-hole Chip Gold Electrode Chip Capacitor Products

[0041] Weigh 3000g according to the following raw material proportions, including barium titanate (BaTiO3) 2700g-2960g, niobium pentoxide (Nb2O5) 10g-45g, neodymium oxide (Nd2O3) 15g-30g, calcium carbonate (CaCO3) 20g-25g, Silicon (SiO2) 3g-4.5g, manganese carbonate (MnCO3) 3g, zinc oxide (ZnO) 2g-5g, boric acid (H2BO3) 10g-50g, zinc borosilicate glass (by mass percentage, ZnO: 65%; B 2 o 3 : 25%; SiO 2 : 10%) 20g ~ 100g. The purity of the above raw materials are analytically pure. After the above powders are weighed separately, they are sand-milled and mixed, dried and placed in a high-temperature box furnace for pre-firing treatment, sprayed and pulverized to make ceramic medium porcelain materials, and then prepared by batching, casting, and cutting into a porcelain diaphragm.

[0042] Taking the product design of CT0505052X101M3X as an example, first prepare the special through-hole st...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
electrical resistivityaaaaaaaaaa
breakdown field strengthaaaaaaaaaa
sintering temperatureaaaaaaaaaa
Login to View More

Abstract

The invention discloses a chip-type through-hole gold electrode chip capacitor and a preparation method thereof. The preparation method comprises the following steps of taking a low-sintered X7R ceramic material of a barium titanate system as a main base material, enabling an oxidant and a glass sintering aid to be grinded and mixed according to a proportion, and then drying the mixture to obtaina dry mixture; performing pre-burning on the dried mixture, and carrying out drying, crushing and refining to obtain multi-layer low-temperature sintered capacitor ceramic powder; enabling the multi-layer low-temperature sintered capacitor ceramic powder, absolute ethyl alcohol and a dispersing agent, a defoaming agent and an adhesive to be mixed and ball-milled to obtain slurry, enabling the slurry to be poured on a PET carrier film of an injection port of a casting machine, wherein a stable and tough micron-scale thickness ceramic membrane strip is formed after the mixture passes through a scraper and a heating region; and equivalently, a capacitive element which integrates the advantages of an MLCC and an SLC can be prepared by simulation design of the product structure parameters, development of the low-sintered ceramic dielectric material, application of filling hole gold slurry and inner electrode gold slurry, an end surface electrode forming mode and other process technologies.

Description

technical field [0001] The invention belongs to the technical field of electronic devices, and in particular relates to a chip capacitor with through-hole gold electrodes and a preparation method thereof. Background technique [0002] Driven by the continuous development of surface mount technology (SMT), miniaturization of the whole machine, and high frequency, capacitors have begun to develop in the direction of chip, miniaturization, and high frequency. The parasitic inductance of chip capacitors is almost zero, and the total inductance can be reduced to the inductance of the component itself. Almost all capacitors used in high-speed and high-density PCB boards choose chip capacitors. [0003] So far, the capacitors widely used in electronic mobile communication lines and electronic equipment are mainly chip multi-layer chip capacitors MLCC (Multi-layer Ceramic Capacitor) and chip microwave single-layer chip capacitors SLC (Single-layer Ceramic Capacitor) ). MLCC has th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/12H01G4/228H01G4/30
Inventor 何创创庞锦标班秀峰刘婷李小东韩玉成
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products