Chip-type through-hole gold electrode chip capacitor and preparation method thereof
An electrode chip and capacitor technology, applied in the direction of multilayer capacitors, fixed capacitor dielectrics, fixed capacitor terminals, etc., can solve the problems of limited microwave circuit application, low internal inductance, high insulation resistance, and avoid mutual diffusion problems and parasitic inductance. Small, high solderability effect
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[0040] 1) Preparation of Through-hole Chip Gold Electrode Chip Capacitor Products
[0041] Weigh 3000g according to the following raw material proportions, including barium titanate (BaTiO3) 2700g-2960g, niobium pentoxide (Nb2O5) 10g-45g, neodymium oxide (Nd2O3) 15g-30g, calcium carbonate (CaCO3) 20g-25g, Silicon (SiO2) 3g-4.5g, manganese carbonate (MnCO3) 3g, zinc oxide (ZnO) 2g-5g, boric acid (H2BO3) 10g-50g, zinc borosilicate glass (by mass percentage, ZnO: 65%; B 2 o 3 : 25%; SiO 2 : 10%) 20g ~ 100g. The purity of the above raw materials are analytically pure. After the above powders are weighed separately, they are sand-milled and mixed, dried and placed in a high-temperature box furnace for pre-firing treatment, sprayed and pulverized to make ceramic medium porcelain materials, and then prepared by batching, casting, and cutting into a porcelain diaphragm.
[0042] Taking the product design of CT0505052X101M3X as an example, first prepare the special through-hole st...
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