Chip-type through-hole gold electrode chip capacitor and preparation method thereof

Abstract

The invention discloses a chip-type through-hole gold electrode chip capacitor and a preparation method thereof. The preparation method comprises the following steps of taking a low-sintered X7R ceramic material of a barium titanate system as a main base material, enabling an oxidant and a glass sintering aid to be grinded and mixed according to a proportion, and then drying the mixture to obtaina dry mixture; performing pre-burning on the dried mixture, and carrying out drying, crushing and refining to obtain multi-layer low-temperature sintered capacitor ceramic powder; enabling the multi-layer low-temperature sintered capacitor ceramic powder, absolute ethyl alcohol and a dispersing agent, a defoaming agent and an adhesive to be mixed and ball-milled to obtain slurry, enabling the slurry to be poured on a PET carrier film of an injection port of a casting machine, wherein a stable and tough micron-scale thickness ceramic membrane strip is formed after the mixture passes through a scraper and a heating region; and equivalently, a capacitive element which integrates the advantages of an MLCC and an SLC can be prepared by simulation design of the product structure parameters, development of the low-sintered ceramic dielectric material, application of filling hole gold slurry and inner electrode gold slurry, an end surface electrode forming mode and other process technologies.

Description

technical field [0001] The invention belongs to the technical field of electronic devices, and in particular relates to a chip capacitor with through-hole gold electrodes and a preparation method thereof. Background technique [0002] Driven by the continuous development of surface mount technology (SMT), miniaturization of the whole machine, and high frequency, capacitors have begun to develop in the direction of chip, miniaturization, and high frequency. The parasitic inductance of chip capacitors is almost zero, and the total inductance can be reduced to the inductance of the component itself. Almost all capacitors used in high-speed and high-density PCB boards choose chip capacitors. [0003] So far, the capacitors widely used in electronic mobile communication lines and electronic equipment are mainly chip multi-layer chip capacitors MLCC (Multi-layer Ceramic Capacitor) and chip microwave single-layer chip capacitors SLC (Single-layer Ceramic Capacitor) ). MLCC has th...

AI Technical Summary

Problems solved by technology

MLCC has the advantages of large capacity, small size, low internal inductance, high insulation resistance and small leakage current. It is widely used in oscillation, coupling, filtering and bypass circuits in various electronic machines. However, due to poor radio frequency parameters and medium Disadvantages such as large loss limit its application in microwave circuits

SLC has excellent radio frequency characteristics, but has disadvantages such as small capacity and low withstand voltage

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