Electronic material and use thereof

A technology of electronics and reinforced materials, applied in electronic materials and its application fields, can solve the problems of waste of resources, environment, pollution, copper clad laminates cannot be cured again, and achieve good shape memory performance, low energy consumption, and good remodeling performance Effect

Active Publication Date: 2020-01-21
SUZHOU YIKETAI ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, there are many reports on copper clad laminates based on bismaleimide resin. Bismaleimide is a thermosetting resin with excellent mechanical properties and heat resistance, and is widely used in aerospace and other fields. However, due to thermosetting resin The inherent defects of existing copper clad laminates cannot be cured again. Once defects such as resin cracks appear, they can only be scrapped, which will cause serious waste of resources and environmental pollution.

Method used

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  • Electronic material and use thereof
  • Electronic material and use thereof
  • Electronic material and use thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0025] The preparation method of electronic material of the present invention is as follows:

[0026] (1) In the presence of quaternary ammonium salts, react 2-allylphenyl glycidyl ether with terephthalic acid to prepare bis(3-(2-allylphenoxy)-2-hydroxypropyl) terephthalates;

[0027] (2) Mesopores coated with bis(3-(2-allylphenoxy)-2-hydroxypropyl)terephthalate, bismaleimide, zinc compound, and polyphenylene ether Silica and solvent are stirred and mixed to obtain electronic material glue;

[0028] (3) impregnating the reinforcing material with the electronic material glue to obtain a prepreg; heating the prepreg to obtain the electronic material.

Synthetic example

[0030] On a mass basis, mix 120g of 2-allylphenol, 140g of sodium hydroxide, 10g of tetrabutylammonium bromide and 230g of tetrahydrofuran, and insulate and react at 35°C for 1.5h under stirring conditions to obtain solution A; Slowly add 270 g of epichlorohydrin dropwise, and keep stirring at 35° C. for 6 hours to react; after the reaction, vacuum rotary evaporation removes tetrahydrofuran and epichlorohydrin to obtain a crude product. The crude product was washed successively with saturated ammonium chloride solution (200mL×2), deionized water (200mL×2), and finally separated and purified by chromatography column to obtain a yellow transparent liquid, namely 2-allylphenyl glycidyl ether , the yield is about 93%, and its reaction formula and 1 H-NMR see attached figure 1 and 2 . On a mass basis, mix 120g 2-allylphenyl glycidyl ether, 45g terephthalic acid, 10g tetrabutylammonium bromide and 230g acetonitrile, and keep it under stirring for 8 hours at 70°C; after the reacti...

Embodiment 1

[0032] Example 1 Preparation of electronic materials

[0033] 50g N, N'-4,4'-diphenylmethane bismaleimide, 76.17g bis(3-(2-allylphenoxy)-2-hydroxypropyl)terephthalate Mix it with 6.29g (22.3mmol) zinc acetylacetonate hydrate and 1.5g polyphenylene ether-coated mesoporous silica, stir and prepolymerize at 130°C for 60min to obtain a prepolymer, and take a sample for DSC (10°C / min , the maximum reaction exothermic peak is 242.8°C); after the above prepolymer is cooled to room temperature, it is added to a mixture of N,N-dimethylformamide and butanone with a mass ratio of 2:8, and stirred at room temperature for 2 hours to obtain Electronic material glue, the solid content of the electronic material glue is 60%.

[0034] Use 1080 fiberglass cloth (Shanghai Honghe) to impregnate the above resin solution to obtain a prepreg, and then dry (160°C, 40 seconds) to remove the solvent to obtain a prepreg, that is, an electronic material.

[0035] Lay 8 above-mentioned prepregs, laminat...

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Abstract

The invention discloses an electronic material and an application thereof. The preparation method specifically comprises the following steps: blending 2-allyl phenyl glycidyl ether and terephthalic acid in acetonitrile, and carrying out esterification reaction with quaternary ammonium salt being a catalyst, so as to obtain bis(3-(2-allylphenoxy)-2-hydroxypropyl)terephthalate containing reversibledynamic groups; and then uniformly mixing bis(3-(2-allylphenoxy)-2-hydroxypropyl)terephthalate with bismaleimide, polyphenyl ether coated mesoporous silica and a solvent, and then impregnating the mixture with glass cloth to prepare the electronic material. The electronic material not only has good dielectric property and heat resistance, but also can realize remodeling under a hot-pressing condition, and has a wide application prospect.

Description

technical field [0001] The invention relates to an electronic material, a preparation method and application thereof. Background technique [0002] At present, there are many reports on copper clad laminates based on bismaleimide resin. Bismaleimide is a thermosetting resin with excellent mechanical properties and heat resistance, and is widely used in aerospace and other fields. However, due to thermosetting resin The inherent defects of existing copper clad laminates cannot be cured again. Once defects such as resin cracks appear, they can only be scrapped, which will cause serious waste of resources and environmental pollution. In recent years, due to antennas, base stations and satellite communications requiring fast and undistorted signal transmission at high frequencies, especially in high frequency and high temperature and high humidity conditions, the signal transmission performance is consistent with normal conditions, so for high frequency applications Substrates ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/24C08L79/08C08K9/10C08K7/26C07C67/26C07C69/82B32B17/02B32B17/06B32B15/20B32B15/14B32B7/06B32B33/00
CPCB32B5/02B32B7/06B32B15/14B32B15/20B32B33/00B32B2260/021B32B2260/046B32B2262/101C07C67/26C08J5/24C08J2379/08C08K7/26C08K9/10C07C69/82
Inventor 彭代信宁礼健
Owner SUZHOU YIKETAI ELECTRONICS MATERIAL
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