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Prepreg for high frequency, preparation method of prepreg, copper-clad plate and preparation method of copper-clad plate

A prepreg, high-frequency technology, applied in chemical instruments and methods, applications, household appliances, etc., can solve problems such as poor dielectric properties, high thermal expansion rate, and low humidity resistance

Active Publication Date: 2020-10-27
HAINAN UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The printed circuit boards used in a large number of electronic equipment in my country are traditional copper clad laminates, such as epoxy resin / glass cloth and other basic processes. When used as the base material of high frequency and high performance printed circuit boards, there are low moisture resistance, Poor dielectric properties, high thermal expansion, etc.

Method used

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  • Prepreg for high frequency, preparation method of prepreg, copper-clad plate and preparation method of copper-clad plate
  • Prepreg for high frequency, preparation method of prepreg, copper-clad plate and preparation method of copper-clad plate
  • Prepreg for high frequency, preparation method of prepreg, copper-clad plate and preparation method of copper-clad plate

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preparation example Construction

[0071] The present invention also provides a method for preparing a high-frequency prepreg, comprising the following steps:

[0072] The core of the fiber cloth is dip-coated in the resin glue solution for 30-90s, and then dried at 120-260°C to obtain a cured sheet for high-frequency use.

[0073] In the present invention, the composition, type and dosage of the fiber cloth core and the resin glue are the same as those of the fiber cloth core and the resin glue mentioned above, and will not be repeated here.

[0074] In the present invention, it is preferable to gently place the fiber cloth core in the resin glue, and gradually touch the glue on one side until it is completely dipped in the glue for about 30-90 seconds, then take it out and let it stand to dry, and then place it in a vacuum drying box. Drying is carried out to obtain a prepreg.

[0075] In the present invention, the dip coating time is preferably 30-90s, more preferably 40-80s, most preferably 50-70s, most pr...

Embodiment 1

[0085] First, the aramid fibers were ultrasonically cleaned with acetone for 2 hours and then dried. The aramid fibers were treated with 20 wt% phosphoric acid solution, taken out after a certain period of time, washed repeatedly with distilled water until neutral, and dried at 4Kpa and 100°C for 5 hours. Afterwards, the aramid chopped fiber, aramid pulp and basalt fiber after the surface treatment of 20wt% phosphoric acid solution are mixed according to the weight ratio of 60%: 30%: 10%, and polyacrylamide is added at a weight ratio of 3%. Each fiber is uniformly dispersed in water, and polyvinyl alcohol is added, the weight ratio is 2%; then an automatic paper machine is used to make a shape, and after vacuum drying, the surface is treated with high pressure light.

[0086] Dip-coat the paper-made cloth on the epoxy-modified cyanate ester composed of dicyclopentadiene phenol, novolak epoxy resin, hexagonal boron nitride, cross-linking agent triallyl isocyanurate (TAIC) and xy...

Embodiment 2

[0089] First, the aramid fibers were ultrasonically cleaned with acetone for 2 hours and then dried. The aramid fibers were treated with 20 wt% phosphoric acid solution, taken out after a certain period of time, washed repeatedly with distilled water until neutral, and dried at 4Kpa and 100°C for 5 hours. Afterwards, the aramid chopped fiber, aramid pulp and basalt fiber after the surface treatment of 20wt% phosphoric acid solution are mixed according to the weight ratio of 60%: 20%: 20%, and polyacrylamide is added at a weight ratio of 5%. The fibers are uniformly dispersed in water, and polyvinyl alcohol is added to a weight ratio of 5%; after that, an automatic paper machine is used to form the fiber, and after vacuum drying, the surface is treated with high pressure light.

[0090] Dip-coat the handmade cloth in 50% of the composition of dicyclopentadiene phenol epoxy modified cyanate, novolac epoxy resin, aluminum oxide, crosslinking agent triallyl isocyanurate (TAIC) and ...

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Abstract

The invention discloses a prepreg for high frequency, a preparation method of the prepreg and a copper-clad plate, and a preparation method of the copper-clad plate. Tge preparation method comprises the following steps: (1) making basalt fibers and aramid fibers into fiber cloth, and carrying out high-pressure treatment under the action of high temperature and high pressure; (2) dip-coating the papermaking cloth in a glue solution with the solid content of 50%, which consists of dicyclopentadiene phenol epoxy modified cyanate ester, novolac epoxy resin, heat-conducting powder, a cross-linkingagent triallyl isocyanurate (TAIC) and xylene, dip-coating for 30-90 seconds, and drying at 120-260 DEG C to obtain prepregs; and (3) superposing the prepreg and the copper foil, and carrying out hotpress molding. Therefore, the high-performance aramid fiber / basalt fiber-based copper-clad plate with low dielectric constant, low dielectric loss tangent value, good heat resistance, high thermal decomposition temperature and thermal shock resistance, good tensile strength and peel strength, excellent interface shear strength and excellent dimensional stability and meeting high-frequency use requirements is prepared.

Description

technical field [0001] The invention belongs to the technical field of electronic equipment substrates, and in particular relates to a high-frequency prepreg, a preparation method thereof, a copper-clad laminate, and a preparation method thereof. Background technique [0002] Nowadays, the development trend of global information technology is becoming increasingly fierce. Digitization, informatization, and networking have penetrated into various industries and fields. The cross-development of technologies in various fields such as new energy technology, new material technology, and biotechnology has triggered a new round of global scientific and technological revolution. and industrial change. At the same time, the key to restricting the development of information technology lies in the information carrying, transmission and processing capabilities of electronic equipment. Among them, higher performance requirements are put forward for printed circuit boards (PCBs) in basic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/04C08L63/00C08L77/10C08K7/10C08K9/06C08K3/38C08K3/22C08K7/18C08K7/08C08J5/24D06M11/70B32B27/02B32B27/34B32B9/00B32B9/04B32B15/14B32B15/04B32B15/088B32B15/20B32B33/00B32B37/06B32B37/10B32B38/18D06M101/36
CPCC08J5/24B32B5/08B32B15/14B32B15/20B32B33/00B32B37/06B32B37/1018B32B38/1816D06M2101/36B32B2260/021B32B2260/046B32B2262/14B32B2262/10B32B2262/0269B32B2307/306B32B2307/206B32B2307/20B32B2307/204B32B2307/73B32B2307/3065B32B2457/08C08J2363/04C08J2463/00C08J2363/00C08J2463/04C08J2477/10C08K7/10C08K2003/385C08K2003/2227C08K7/18C08K7/08C08K9/06
Inventor 汪国庆王泽方志强王皓民江昊杨宇
Owner HAINAN UNIVERSITY
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