Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Organic metal solderability preservative and preparation method and application oforganic metal solderability preservative film

An organometallic and flux-preserving technology used in metallurgical bonding, printed circuit manufacturing, and assembling printed circuits with electrical components. Impact performance, does not affect welding performance, and improves the effect of oxidation resistance

Active Publication Date: 2021-06-25
GUANGZHOU SANFU NEW MATERIALS TECH
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, while the melting point of azole derivatives is getting higher and higher, the molecular weight is increasing and the structure is becoming more and more stable, its water solubility is also getting worse, so it is necessary to add a certain amount of organic acid to promote the azole derivatives. However, due to the evaporation of water and the increase of pH during use, crystal precipitation will inevitably occur, which will affect the processing of PCB and shorten the service life of organic flux
As for the metallized surface treatment process, although it has the advantages of high solderability, visual inspection, and high conductivity, the process is complicated, and it is prone to blackening of the film surface and the Giavani effect (Giavani effect, also known as the original The battery effect refers to the adverse problems such as the electric current generated by two metals through the medium due to the potential difference, and then an electrochemical reaction occurs, and the anode with a high potential is oxidized)
[0004] The patent publication No. CN107971655A discloses a high heat-resistant organic welding machine and its application. The organic welding machine is composed of aryl-substituted imidazole, imidazopyridopyrazinone, formic acid, propionic acid, 2- (2-Methoxyethoxy) acetic acid, metal compound and deionized water are composed together. This kind of organic soldering machine will cause crystallization due to water evaporation or pH value change during use, which will affect the processing of PCB.
Although this kind of organic protective film can effectively suppress the Giavanni effect in the production process, but because the main plating layer contains silver metal, the oxidation resistance is poor
[0005] In summary, there are generally technical problems in the prior art such as film layer crystallization, short life of solder protection flux, blackening of metal solder protection film, and Giavani effect.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Organic metal solderability preservative and preparation method and application oforganic metal solderability preservative film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Embodiment 1, a kind of preparation method of organometallic solder protection flux and organometallic solder protection film

[0031] The organic metal flux includes the following components and parts by weight thereof:

[0032] 20 parts of thiazole derivatives, 10 parts of imidazole derivatives, 8 parts of nitrogen azole derivatives, 5 parts of sodium secondary alkyl sulfate, 28 parts of malic acid, 20 parts of tartaric acid, 10 parts of ethanol, and 150 parts of water.

[0033] The thiazole derivatives in the organometallic flux are composed of aryl-substituted thiazole and 5-benzylthio-1,3,4-thiadiazole-2-thiol in a mass ratio of 13:2.

[0034] The imidazole derivatives in the organometallic flux are composed of 2-hydroxybenzimidazole, 1-(4-aminophenyl)imidazole and N-acetylimidazole in a mass ratio of 7:11:4.

[0035] The azole derivatives in the organometallic flux are composed of tolyltriazole, 4,5-dibromo-1H-benzotriazole and 5-amino-3-mercapto-1,2,4 - Triazol...

Embodiment 2

[0044] Embodiment 2, a kind of preparation method of organic metal solder protection flux and organic metal solder protection film

[0045] The organic metal flux includes the following components and parts by weight thereof:

[0046] 30 parts of thiazole derivatives, 15 parts of imidazole derivatives, 13 parts of nitrogen azole derivatives, 8 parts of sodium secondary alkyl sulfate, 35 parts of malic acid, 30 parts of tartaric acid, 15 parts of ethanol, and 200 parts of water.

[0047] The thiazole derivatives in the organometallic flux are composed of aryl-substituted thiazole and 5-benzylthio-1,3,4-thiadiazole-2-thiol in a mass ratio of 15:4.

[0048] The imidazole derivatives in the organometallic flux are composed of 2-hydroxybenzimidazole, 1-(4-aminophenyl)imidazole and N-acetylimidazole in a mass ratio of 3:9:2.

[0049] The azole derivatives in the organometallic flux are composed of tolyltriazole, 4,5-dibromo-1H-benzotriazole and 5-amino-3-mercapto-1,2,4 - Triazole ...

Embodiment 3

[0058] Embodiment 3, a kind of preparation method of organic metal solder protection flux and organic metal solder protection film

[0059] The organometallic flux includes the following components and parts by weight: 26 parts of thiazole derivatives, 12 parts of imidazole derivatives, 11 parts of nitrogen azole derivatives, 6.3 parts of secondary alkyl sodium sulfate, 27 parts of malic acid 24.5 parts of tartaric acid, 12.6 parts of ethanol, and 178 parts of water.

[0060] The thiazole derivatives in the organometallic flux are composed of aryl-substituted thiazole and 5-benzylthio-1,3,4-thiadiazole-2-thiol in a mass ratio of 14:3.

[0061] The imidazole derivatives in the organometallic flux are composed of 2-hydroxybenzimidazole, 1-(4-aminophenyl)imidazole and N-acetylimidazole in a mass ratio of 5:10:3.

[0062] The azole derivatives in the organometallic flux are composed of tolyltriazole, 4,5-dibromo-1H-benzotriazole and 5-amino-3-mercapto-1,2,4 - Triazoles are compo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention belongs to the technical field of circuit board processing, and particularly relates to an organic metal solderability preservative and a preparation method and application of an organic metal solderability preservative film. The organic metal solderability preservative provided by the invention is prepared from thiazole derivatives, imidazole derivatives, azole derivatives, secondary alkyl sodium sulfate, malic acid, tartaric acid, ethanol and water. The pH regulator is added into the formula of the organic metal solderability preservative provided by the invention, so that the processing of a PCB cannot be influenced by the change of the concentration and pH of the organic metal solderability preservative, and the service life of the organic solderability preservative cannot be shortened; and the organic metal solderability preservative film prepared by using the organic metal solderability preservative provided by the invention has the advantages of no blackening of the film surface, no influence on the welding performance of metal, no galvanic effect, and good oxidation resistance, thermal shock resistance and moisture resistance.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a preparation method and application of an organic metal soldering flux and an organic metal soldering film. Background technique [0002] Organic solder protection film (OSP) is also called copper protectant. Simply put, OSP is to chemically grow a layer of organic film on the clean bare copper surface. This film has anti-oxidation, thermal shock resistance and moisture resistance. It is used to protect the copper surface from rusting (oxidation or vulcanization, etc.) The clean copper surface can be immediately combined with molten solder to form a strong solder joint in a very short time. [0003] At present, the printed circuit board (PCB) industry generally adopts organic solder protection film, chemical nickel gold, chemical tin, chemical silver and other surface treatment processes for bare copper protection, among which the use of organic sol...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/34
CPCH05K3/34H05K3/3457H05K3/3489H05K2203/04
Inventor 田志斌邓正平陈维速许荣国谢飞凤
Owner GUANGZHOU SANFU NEW MATERIALS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com