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Cutting fluid for hard brittle material and uses thereof

A hard and brittle material, cutting fluid technology, applied in the field of chemical synthesis cutting fluid, can solve the problems of solid filler environmental pollution, oily cutting fluid is flammable, less use, etc., to achieve good chelating anti-settling function, low conductivity. Effect

Active Publication Date: 2008-06-25
LIAONING OXIRANCHEM INC +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The first generation of wire cutting fluids at home and abroad are mainly oily cutting fluids with mineral oil as the main component. Oily cutting fluids are flammable and pollute the environment. At the same time, chlorine-containing alkane solvents are required to clean silicon wafers, which are harmful to the human body. Carcinogenic effect, so it is used less and less; the second-generation products are mainly water-soluble cutting fluids with water and solid fillers as the main components. Such products contain water and solid fillers that cause serious corrosion to equipment, and solid fillers pollute the environment seriously. At the same time Need to add anti-rust and other additives that are not conducive to wafer application

Method used

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  • Cutting fluid for hard brittle material and uses thereof
  • Cutting fluid for hard brittle material and uses thereof
  • Cutting fluid for hard brittle material and uses thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052]1) Add 4.5kg of ethylene glycol and 0.1Kg of KOH to the high-pressure polymerization reactor of Baigang in vacuum, seal it, replace it with nitrogen, raise the temperature and start stirring. When the temperature in the kettle reaches 90-100°C, add 0.5Kg of propylene oxide. When the temperature rises and the pressure drops, continue to feed 18.5Kg of propylene oxide to control the reaction temperature at 120-160°C and the pressure in the kettle at 0.3- 0.6Mpa, when the addition of propylene oxide is completed, and the pressure in the kettle gradually drops to no longer drops for 30 minutes, add 0.5Kg of ethylene oxide, when the temperature rises and the pressure drops, continue to feed 72Kg of ethylene oxide Alkanes, control the reaction temperature at 120-160°C and the pressure in the kettle at 0.3-0.6Mpa. After the reaction is completed, the pressure in the kettle will gradually drop to no longer drop for 30 minutes, and the polyalkoxy compound component in the cutting ...

Embodiment 2

[0060] 1) In the high-pressure polymerization reactor of Baigang, add 2.5kg methanol and 0.1Kg KOH in vacuum, seal it, replace it with nitrogen, raise the temperature and start stirring. When the temperature in the kettle reaches 65-85°C, add a mixture of 0.25Kg ethylene oxide and 0.25Kg propylene oxide. When the temperature rises and the pressure drops, 17Kg of propylene oxide and 67.5Kg of epoxy are continuously introduced. Ethane mixture, the reaction temperature is controlled at 90-160°C and the pressure in the kettle is 0.3-0.6Mpa. When the mixture of ethylene oxide and propylene oxide is added and the pressure in the kettle gradually drops to 30 minutes without any further drop, the temperature will drop immediately. Obtain 87.5Kg of the polyalkoxy compound component monomer of cutting fluid, and its structural formula is: CH 3 O[(EO) 19.7 / (PO) 3.8 ]H

[0061] 2) At 30°C, add 2.5Kg of castor oil polyoxyethylene ether (EL-20) and 10Kg of propylene glycol to the monome...

Embodiment 3

[0064] 1) In a high-pressure polymerization reactor, add 12kg of isopropanol and 0.1Kg of KOH in vacuum, seal it, replace it with nitrogen, raise the temperature and start stirring. When the temperature in the kettle reaches 90-100°C, add 0.5Kg of ethylene oxide. When the temperature rises and the pressure drops, 80Kg of ethylene oxide is continuously introduced to control the reaction temperature at 120-160°C and the pressure in the kettle at 0.3 ~0.6Mpa, when the addition of ethylene oxide is completed, and the pressure in the kettle gradually drops to no longer drops for 30 minutes, add 0.5Kg propylene oxide, when the temperature rises and the pressure drops, continue to feed 6Kg of epoxy Propane, control the reaction temperature at 120-160°C and the pressure in the kettle at 0.3-0.6Mpa. After the reaction is completed, the pressure in the kettle will gradually drop to no longer drop for 30 minutes, and the polyalkoxy compound component of the cutting fluid will be obtained ...

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Abstract

The invention relates to a water-soluble cutting liquid used for processing hard brittle materials. The components of the invention by weight percentage are as follows: 70 to 100 percent of polyalkoxylated compound, 0 to 15 percent of extreme pressure resistant chelation anti-settling agent, 0 to 15 percent of dissolution promoter . The cutting liquid of the invention has the advantages of no pollution, low metal impurity content, high cutting sheet rate, and high finished product qualification rate and so on. The invention also relates to the application of the cutting liquid in the processing of monocrystalline silicon, polysilicon, germanium, gallium arsenide, quartz, Indium gallium nitride or precious stones.

Description

technical field [0001] The invention relates to a cutting fluid, in particular to a chemically synthesized cutting fluid for (multiple) wire cutting of hard and brittle materials and its application. Background technique [0002] With the strengthening of people's awareness of environmental protection, countries all over the world attach great importance to solar energy as a green resource, which is concentrated in the solar photovoltaic power generation industry. With the development of semiconductor and photovoltaic materials technology, higher requirements are put forward for the specifications and quality of source products such as silicon wafers. Large diameter crystal wafers have become a significant feature and inevitable trend in the development of silicon wafer materials such as solar energy. At the same time The increase and thinning of the crystal plate size put forward higher requirements for its production process technology equipment. [0003] The traditional ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M139/06C10M137/04C10M107/32C10N40/22
Inventor 朱建民刘兆滨董振鹏仲崇纲宋恩军富扬
Owner LIAONING OXIRANCHEM INC
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