Method for preparing porous conductive coating on plastic surface
A porous conductive and plastic technology, applied in conductive coatings, metal material coating processes, coatings, etc., can solve problems such as limited applicability and affect coating adhesion, improve efficiency, increase mechanical anchoring, and broaden the scope of use Effect
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Embodiment 1
[0018] Example 1: Electroplating (water plating) acid copper on ABS products
[0019] The organic solvent (using acetone and ethyl acetate, by volume ratio, acetone: ethyl acetate = 10:1) is 45g;
[0020] The non-solvent substance (water) is 2g;
[0021] Resin (ABS) is 2.5g;
[0022] Conductive particles (nano silver and nano copper, mass ratio 2:1) are 4g;
[0023] Leveling agent (polydimethylsiloxane) is 0.1g;
[0024] The dispersant (polyvinylpyrrolidone) is 0.1 g.
[0025] According to the above-mentioned raw material ratio, use a magnetic stirrer to disperse and mix to prepare a nano-modified polymer emulsion. The electroplating process is: ABS workpiece, chemical degreasing, dilute acid (3mol / L dilute sulfuric acid and pure acetic acid in a volume ratio (4: 1) Activating for 5 minutes, drying at 50°C for 20 minutes, immersing in nano-modified polymer emulsion, drying at 70°C for 30 minutes, mixing acid activation for 5 minutes, washing twice with water, and electroplating acid copp...
Embodiment 2
[0026] Example 2: PVD copper plating on unsaturated polyester (BMC)
[0027] Organic solvent (using ethyl acetate, methyl ethyl ketone and N-methyl-2-pyrrolidone, ethyl acetate: methyl ethyl ketone: N-methyl-2-pyrrolidone = 10:1:1, by volume) is 45g;
[0028] Non-solvent substance (ethanol) is 5g;
[0029] The resin (ABS and acrylic resin, according to the mass ratio, ABS: acrylic resin = 10:1) is 6g;
[0030] Conductive particles (nano silver and nano copper, according to the mass ratio, nano silver: nano copper = 1:3) is 5g;
[0031] Leveling agent (polyether modified silicone oil and KH560 silane coupling agent, volume ratio: 1:1) is 0.1g;
[0032] Dispersant (polyethyleneimine) is 0.1g;
[0033] Disperse and mix with a magnetic stirrer according to the above-mentioned raw material ratio to prepare nano-modified polymer (SNP) emulsion. The vacuum coating process is: BMC workpiece, chemical degreasing, strong alkali activation for 10 minutes, drying at 50°C for 20 minutes, spraying nano...
Embodiment 3
[0034] Example 3: Nickel plating (water plating) on nylon PA6
[0035] The organic solvent (using butyl acetate, heptanone and N-methyl-2-pyrrolidone, by volume ratio, butyl acetate: heptanone: N-methyl-2-pyrrolidone = 10:1:1) is 45g;
[0036] Non-solvent substance (water) is 1g;
[0037] Resin (ABS and acrylic resin, according to mass ratio, ABS: acrylic resin = 3:0.2) is 3g;
[0038] Conductive particles (nano silver and carbon nanotubes, according to the mass ratio, nano silver: carbon nanotube = 2:1) is 3g;
[0039] Leveling agent (polyether modified silicone oil) is 0.1g;
[0040] The dispersant (polyethyleneimine) is 0.1 g.
[0041] Disperse and mix with a magnetic stirrer according to the above-mentioned raw material ratio to prepare a nano-modified polymer (SNP) emulsion. The electroplating process is: nylon workpiece, chemical degreasing, dilute acid (6mol / L dilute sulfuric acid and pure acetic acid according to the volume ratio (4:1)) Activation for 5 minutes, drying at 50°C ...
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